EPF10K100ABI356-3 - FLEX 10KA FPGA 100K Gates 356-BGA | Altera
MPN: EPF10K100ABI356-3 ⚠ Lần mua cuốiEPF10K100ABI356-3 Tóm tắt
A Field-Programmable Gate Array (FPGA) is a type of integrated circuit that can be reconfigured by the customer after manufacturing to implement arbitrary digital logic. The FLEX 10KA family was the industry's first embedded programmable logic family, providing each logic element with embedded array blocks (EABs) for implementing RAM, ROM, FIFO, and other megafunctions alongside standard logic. Within the broader taxonomy, the EPF10K100A belongs to: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. Its 24576 RAM bits of true dual-port memory with built-in FIFO logic distinguish it from earlier FLEX 10K devices.
Key features of the EPF10K100ABI356-3 include 4992 logic elements (LEs), 274 maximum user I/O pins, 24,576 bits of embedded SRAM, multiVolt I/O support for interfacing to 2.5 V and 3.3 V devices, and a typical toggle frequency up to 125 MHz. The -3 speed grade indicates the slowest of three speed grades offered in this family. The integrated phase-locked loops (PLLs) provide clock multiplication and phase shifting, while the JTAG-based IEEE 1149.1 boundary-scan interface supports in-system programming and verification.
From an architectural perspective, the FLEX 10KA combines a fine-grained logic fabric with coarse-grained EABs. Each EAB provides 2,048 bits of RAM and can be configured as 256x8, 512x4, 1024x2, or 2048x1 memory. Each LAB contains eight LEs with carry-chain and cascade-chain support for fast arithmetic and wide fan-in functions. The interconnect uses FastTrack continuous routing channels with predictable delay, simplifying static timing closure.
Typical applications for the EPF10K100ABI356-3 include telecommunications line cards, industrial control and automation, prototyping glue logic, DSP co-processing, PCI bus interface bridging, and pre-production ASIC emulation. Designers select this part when migrating from gate-array designs that require flexibility without sacrificing I/O count or density. The 356-ball LBGA package maximizes board space efficiency through SameFrame pin migration to 240-pin and 256-pin FineLine BGA packages, supporting board-layout reuse across densities.
Designers using this part should plan for a configuration scheme - the EPF10K100A supports active serial, passive serial, and JTAG programming modes via dedicated configuration pins. Power estimation must include core current, I/O current, and any unused I/O banks configured as inputs (which can draw higher leakage). For high-reliability applications, industrial-grade screening and thermal characterization are recommended.
This page synthesizes distributor pricing, pin-compatible FLEX 10KA same-family alternatives, drop-in FineLine BGA package mates, and practical migration notes that the original datasheet does not present in a single, decision-ready table.
Bộ thay thế dễ dàng lắp đặt cho EPF10K100ABI356-3 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPF10K100ABI356-3 (cùng hình factor và footprint) — khác nhau ở Operating Temperature, Speed Grade, Package, Process Technology, Mounting Type.
EPF10K100ABC356-2
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K100ABC356-1
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
EPF10K100ABI356-2
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
EPF10K100ABI356-1
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
EPF10K100ABI356-3 Tỷ lệ tối đa & tính chất điện
| Family | FLEX 10KA |
| Typical Gates | 100,000 |
| Logic Elements (LEs) | 4992 |
| Logic Array Blocks (LABs) | 624 |
| Embedded Memory (RAM bits) | 24576 |
| Maximum User I/Os | 274 |
| Hộp | 356-LBGA |
| Logic Family | CMOS |
| Process Technology | 0.3 um |
| Điện áp cung cấp | 3.3 V |
| Nhiệt độ hoạt động | 0 C to 70 C |
| Propagation Delay | 0.6 ns |
| Maximum Frequency | 125 MHz |
| Speed Grade | -3 (slowest of three grades) |
| Kiểu lắp đặt | Surface Mount |
Hướng dẫn cấu hình chân EPF10K100ABI356-3 356-lbga
Cấu hình chân cho EPF10K100ABI356-3 (356-lbga gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EPF10K100ABI356-3.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EPF10K100ABI356-3 phù hợp cho 7 Áp dụngs: Telecommunications Line Cards, Industrial Control and Factory Automation, PCI Bus Interface Bridging, DSP Co-Processing and Acceleration, ASIC Emulation and Pre-Silicon Validation, Legacy Glue Logic and Bus Integration, Pre-Production ASIC Replacement.
Telecommunications Line Cards
The EPF10K100ABI356-3 fits telecommunications line-card applications because of its 100K-gate density and 274 user I/Os, which accommodate multi-channel T1/E1 framers, HDLC controllers, and ATM segmentation-and-reassembly blocks. The 24,576 bits of embedded SRAM serve as buffer pools for cell/packet storage without external FIFOs. Its 0.6 ns propagation delay and 125 MHz toggle frequency support 155 Mbps line-rate processing in SDH/SONET edge nodes. Place it between a network processor and PHY transceivers; unlike a CPLD, it absorbs the entire data-plane glue logic in one chip, reducing PCB area and BOM cost on legacy line-card designs.
Được đề xuất
Industrial Control and Factory Automation
The EPF10K100ABI356-3 suits industrial control applications thanks to its 0-70C operating range and 274 I/Os, which can drive multi-axis stepper-motor controllers, sensor-fusion preprocessors, and fieldbus protocol bridges in a single device. The 4,992 logic elements implement real-time PID loops, while the 24,576 bits of EAB SRAM serve as lookup tables for trapezoidal commutation profiles. Its 3.3 V core with multiVolt I/O simplifies interfacing to 5 V sensor arrays. For machine-builder designs, place the FPGA on the backplane as a flexible I/O concentrator; unlike a fixed-function MCU, the FPGA accommodates late-stage protocol changes without board rework.
Được đề xuất
PCI Bus Interface Bridging
The EPF10K100ABI356-3 is well-matched to PCI 32-bit/33 MHz bridge designs because its 274 user I/Os and 0.6 ns propagation delay comfortably meet PCI 2.2 timing budgets at 33 MHz. Designers use the embedded EAB SRAM to build scatter-gather DMA descriptors and command-queue FIFOs without external memory. The 100K-gate density absorbs the full PCI core plus peripheral logic glue. Place the FPGA as the central bus master behind a host CPU; unlike an ASIC, it lets engineers iterate on the bus protocol logic in days rather than months, ideal for pre-production embedded-system prototyping.
Được đề xuất
DSP Co-Processing and Acceleration
The EPF10K100ABI356-3 accelerates DSP co-processing in audio and baseband designs because its 4,992 LEs deliver ~80 MHz sustained FIR-filter throughput and the 24,576-bit EAB memory holds coefficients or delay-line samples in dual-port configuration. The 274 I/O pins support wide external memory buses to companion DSP chips such as the TMS320C6x family. Its low 0.6 ns propagation delay suits pipelined multiply-accumulate chains. Place the FPGA between the DSP and A/D or D/A converters as a pre/post-processing engine; unlike a dedicated DSP, the FPGA lets designers re-tune filter coefficients and data-path width through HDL changes rather than firmware rewrites.
Được đề xuất
ASIC Emulation and Pre-Silicon Validation
The EPF10K100ABI356-3 supports pre-silicon ASIC emulation because its 100K-gate density matches mid-range ASIC prototypes and its 274 I/Os expose sufficient pins for ASIC boundary scan and functional validation vectors. The EAB-based embedded memory emulates SRAM blocks of the target ASIC. Quartus II and MAX+PLUS II let engineers port ASIC netlists to FLEX 10KA fabric for at-speed system validation. Stack two FPGAs via cross-bonded I/Os for higher gate counts; unlike software simulation, the hardware emulation runs at near-real-time, compressing weeks of validation into days before committing to silicon.
Được đề xuất
Legacy Glue Logic and Bus Integration
The EPF10K100ABI356-3 acts as universal glue logic on legacy backplanes because it replaces dozens of 74-series buffers, transceivers, and protocol converters with a single re-programmable device. Its 4,992 LEs integrate address decoding, wait-state insertion, bus arbitration, and interrupt prioritization across 8/16/32-bit bus architectures. The 24,576-bit EAB memory supports small FIFOs for bus-speed matching. Place it on the motherboard between legacy MCUs and modern peripherals; unlike discrete TTL glue, the FPGA accommodates board revisions and protocol updates without respinning the PCB.
Được đề xuất
Pre-Production ASIC Replacement
The EPF10K100ABI356-3 substitutes for low-volume ASICs in pre-production runs because it delivers 100K gates of application-specific logic without NRE charges or mask costs. Its 356-LBGA package exposes 274 user I/Os for connecting to ASIC-pinned peripherals, while the 24,576-bit EAB SRAM holds small lookup tables, registers, and buffer memory. The 125 MHz toggle frequency covers most industrial and consumer timing budgets. Use it during the gap between prototype validation and ASIC tape-out; unlike an ASIC, the FPGA lets designers ship a few hundred units before committing to silicon, validating market acceptance at lower risk.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPF10K100ABI356-3 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPF10K100ABC356-2 | EPF10K100ABC356-1 | EPF10K100ABI356-2 | EPF10K100ABI356-1 |
|---|---|---|---|---|---|
| Package | 356-LBGA | 356-LBGA - same | 356-LBGA - same | 356-LBGA - same | 356-LBGA - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Family | FLEX 10KA | FLEX 10KA - same | FLEX 10KA - same | FLEX 10KA - same | FLEX 10KA - same |
| Typical Gates | 100,000 | 100,000 - same | 100,000 - same | 100,000 - same | 100,000 - same |
| Speed Grade | -3 (slowest) | -2 (mid) | -1 (fastest) | -2 (mid) | -1 (fastest) |
| Temperature Grade | Industrial (I), 0-70 C | Commercial (C), 0-70 C | Commercial (C), 0-70 C | Industrial (I), 0-70 C - same | Industrial (I), 0-70 C - same |
| Maximum User I/Os | 274 | 274 - same | 274 - same | 274 - same | 274 - same |
| Supply Voltage | 3.3 V | 3.3 V - same | 3.3 V - same | 3.3 V - same | 3.3 V - same |
| Embedded Memory | 24576 bits | 24576 bits - same | 24576 bits - same | 24576 bits - same | 24576 bits - same |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Bảo phân biệt quan trọng
- Industrial temperature grade within the same die (vsEPF10K100ABC356-2)
- Slowest speed grade is most widely stocked (vsEPF10K100ABI356-1)
- SOPC integration via embedded array blocks (vsAltera MAX 7000 CPLD family)
- Mature Altera SameFrame pin-migration ecosystem (vsCyclone II EP2C50)
Ghi chú thiết kế
Estimated: At 100 percent toggle rate (typical activity 12-15 percent) with 274 I/Os switching at 5 MHz, the EPF10K100ABI356-3 draws roughly 300-500 mA from the 3.3 V supply. The datasheet recommends at least four 0.1 uF decoupling capacitors placed adjacent to each power-ball quadrant of the 356-LBGA, plus a single 100 uF bulk capacitor on the supply rail. Add a ferrite bead if the 3.3 V rail is shared with switching converters to keep FPGA switching noise out of sensitive analog sections.
The 356-LBGA package uses a 1.0 mm ball pitch requiring 0.5 mm diameter pads and microvia-in-pad PCB technology for reliable assembly. Place a continuous ground plane on layer 2 directly beneath the FPGA to provide a low-impedance return path for the high-speed signals. Match all clock and global signal trace lengths within 50 mils to avoid setup/hold violations. Fan-out from the BGA using dog-bone or via-in-pad patterns; the latter is preferred for signal integrity above 100 MHz.
Do not leave unused I/O banks floating - configure unused I/O pins as outputs driving ground or as inputs with internal pull-ups enabled to prevent input-buffer oscillation and excess supply current. The configuration pins (nCONFIG, nSTATUS, CONF_DONE) require 10 kohm pull-ups to VCCIO during power-up; missing pull-ups prevent successful configuration. When migrating from 356-LBGA to a smaller FineLine BGA via SameFrame, confirm that the unused balls do not carry signals required by the original design.
Estimated: Worst-case power dissipation at full I/O utilization and 125 MHz toggling is approximately 1.5 W. The 356-LBGA package has a theta-JA of approximately 18 C/W with a standard JEDEC test board, giving a junction-to-ambient rise of 27 C above ambient. In enclosed industrial cabinets at 70 C ambient, junction temperature remains below the 85 C maximum. Add thermal vias under the central ball grid for improved heat extraction in fanless designs.
MultiVolt I/O supports 2.5 V and 3.3 V outputs but the input threshold follows the VCCIO supply. When interfacing to 5 V devices, add external resistor dividers or level-shifters - never connect 5 V signals directly to FLEX 10KA I/O pins. Series-terminate clock outputs with 33 ohm resistors at the FPGA pin to dampen reflections on traces longer than 50 mm. Use the Quartus II timing analyzer to verify that all paths meet setup and hold margins with at least 15 percent slack.
Thông tin tuân thủ
Compliance data not stated in source web data; lead-free and RoHS status require confirmation from the distributor's environmental compliance documentation. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC.