EPF10K100ABI356-3 - FLEX 10KA FPGA 100K Gates 356-BGA | Altera
MPN: EPF10K100ABI356-3 ⚠ Bahagian terakhir untuk beliEPF10K100ABI356-3 Ringkasan
A Field-Programmable Gate Array (FPGA) is a type of integrated circuit that can be reconfigured by the customer after manufacturing to implement arbitrary digital logic. The FLEX 10KA family was the industry's first embedded programmable logic family, providing each logic element with embedded array blocks (EABs) for implementing RAM, ROM, FIFO, and other megafunctions alongside standard logic. Within the broader taxonomy, the EPF10K100A belongs to: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. Its 24576 RAM bits of true dual-port memory with built-in FIFO logic distinguish it from earlier FLEX 10K devices.
Key features of the EPF10K100ABI356-3 include 4992 logic elements (LEs), 274 maximum user I/O pins, 24,576 bits of embedded SRAM, multiVolt I/O support for interfacing to 2.5 V and 3.3 V devices, and a typical toggle frequency up to 125 MHz. The -3 speed grade indicates the slowest of three speed grades offered in this family. The integrated phase-locked loops (PLLs) provide clock multiplication and phase shifting, while the JTAG-based IEEE 1149.1 boundary-scan interface supports in-system programming and verification.
From an architectural perspective, the FLEX 10KA combines a fine-grained logic fabric with coarse-grained EABs. Each EAB provides 2,048 bits of RAM and can be configured as 256x8, 512x4, 1024x2, or 2048x1 memory. Each LAB contains eight LEs with carry-chain and cascade-chain support for fast arithmetic and wide fan-in functions. The interconnect uses FastTrack continuous routing channels with predictable delay, simplifying static timing closure.
Typical applications for the EPF10K100ABI356-3 include telecommunications line cards, industrial control and automation, prototyping glue logic, DSP co-processing, PCI bus interface bridging, and pre-production ASIC emulation. Designers select this part when migrating from gate-array designs that require flexibility without sacrificing I/O count or density. The 356-ball LBGA package maximizes board space efficiency through SameFrame pin migration to 240-pin and 256-pin FineLine BGA packages, supporting board-layout reuse across densities.
Designers using this part should plan for a configuration scheme - the EPF10K100A supports active serial, passive serial, and JTAG programming modes via dedicated configuration pins. Power estimation must include core current, I/O current, and any unused I/O banks configured as inputs (which can draw higher leakage). For high-reliability applications, industrial-grade screening and thermal characterization are recommended.
This page synthesizes distributor pricing, pin-compatible FLEX 10KA same-family alternatives, drop-in FineLine BGA package mates, and practical migration notes that the original datasheet does not present in a single, decision-ready table.
Pilihan pengganti yang segera untuk EPF10K100ABI356-3 — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.
Varietas dalam siri ini
Model serupa yang kompatibel dengan pengganti yang segera EPF10K100ABI356-3 (sama faktor bentuk dan kaki) — berbeza dalam Operating Temperature, Speed Grade, Package, Process Technology, Mounting Type.
EPF10K100ABC356-2
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →EPF10K100ABC356-1
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
EPF10K100ABI356-2
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
EPF10K100ABI356-1
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
EPF10K100ABI356-3 Penilaian maksimum & Ciri-ciri Elektrik
| Family | FLEX 10KA |
| Typical Gates | 100,000 |
| Logic Elements (LEs) | 4992 |
| Logic Array Blocks (LABs) | 624 |
| Embedded Memory (RAM bits) | 24576 |
| Maximum User I/Os | 274 |
| Kemasan | 356-LBGA |
| Logic Family | CMOS |
| Process Technology | 0.3 um |
| Tegangan Pemberi Arus | 3.3 V |
| Suhu Operasi | 0 C to 70 C |
| Propagation Delay | 0.6 ns |
| Maximum Frequency | 125 MHz |
| Speed Grade | -3 (slowest of three grades) |
| Jenis Pemasangan | Surface Mount |
Panduan Konfigurasi Pin EPF10K100ABI356-3 356-lbga
Konfigurasi pin untuk EPF10K100ABI356-3 (356-lbga pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.
Tiada data garisan pin yang diperoleh untuk EPF10K100ABI356-3.
Rujuk kepada lembaran data untuk konfigurasi pin penuh.
Aplikasi Biasa
EPF10K100ABI356-3 patut untuk 7 aplikasis: Telecommunications Line Cards, Industrial Control and Factory Automation, PCI Bus Interface Bridging, DSP Co-Processing and Acceleration, ASIC Emulation and Pre-Silicon Validation, Legacy Glue Logic and Bus Integration, Pre-Production ASIC Replacement.
Telecommunications Line Cards
The EPF10K100ABI356-3 fits telecommunications line-card applications because of its 100K-gate density and 274 user I/Os, which accommodate multi-channel T1/E1 framers, HDLC controllers, and ATM segmentation-and-reassembly blocks. The 24,576 bits of embedded SRAM serve as buffer pools for cell/packet storage without external FIFOs. Its 0.6 ns propagation delay and 125 MHz toggle frequency support 155 Mbps line-rate processing in SDH/SONET edge nodes. Place it between a network processor and PHY transceivers; unlike a CPLD, it absorbs the entire data-plane glue logic in one chip, reducing PCB area and BOM cost on legacy line-card designs.
Disebarkan
Industrial Control and Factory Automation
The EPF10K100ABI356-3 suits industrial control applications thanks to its 0-70C operating range and 274 I/Os, which can drive multi-axis stepper-motor controllers, sensor-fusion preprocessors, and fieldbus protocol bridges in a single device. The 4,992 logic elements implement real-time PID loops, while the 24,576 bits of EAB SRAM serve as lookup tables for trapezoidal commutation profiles. Its 3.3 V core with multiVolt I/O simplifies interfacing to 5 V sensor arrays. For machine-builder designs, place the FPGA on the backplane as a flexible I/O concentrator; unlike a fixed-function MCU, the FPGA accommodates late-stage protocol changes without board rework.
Disebarkan
PCI Bus Interface Bridging
The EPF10K100ABI356-3 is well-matched to PCI 32-bit/33 MHz bridge designs because its 274 user I/Os and 0.6 ns propagation delay comfortably meet PCI 2.2 timing budgets at 33 MHz. Designers use the embedded EAB SRAM to build scatter-gather DMA descriptors and command-queue FIFOs without external memory. The 100K-gate density absorbs the full PCI core plus peripheral logic glue. Place the FPGA as the central bus master behind a host CPU; unlike an ASIC, it lets engineers iterate on the bus protocol logic in days rather than months, ideal for pre-production embedded-system prototyping.
Disebarkan
DSP Co-Processing and Acceleration
The EPF10K100ABI356-3 accelerates DSP co-processing in audio and baseband designs because its 4,992 LEs deliver ~80 MHz sustained FIR-filter throughput and the 24,576-bit EAB memory holds coefficients or delay-line samples in dual-port configuration. The 274 I/O pins support wide external memory buses to companion DSP chips such as the TMS320C6x family. Its low 0.6 ns propagation delay suits pipelined multiply-accumulate chains. Place the FPGA between the DSP and A/D or D/A converters as a pre/post-processing engine; unlike a dedicated DSP, the FPGA lets designers re-tune filter coefficients and data-path width through HDL changes rather than firmware rewrites.
Disebarkan
ASIC Emulation and Pre-Silicon Validation
The EPF10K100ABI356-3 supports pre-silicon ASIC emulation because its 100K-gate density matches mid-range ASIC prototypes and its 274 I/Os expose sufficient pins for ASIC boundary scan and functional validation vectors. The EAB-based embedded memory emulates SRAM blocks of the target ASIC. Quartus II and MAX+PLUS II let engineers port ASIC netlists to FLEX 10KA fabric for at-speed system validation. Stack two FPGAs via cross-bonded I/Os for higher gate counts; unlike software simulation, the hardware emulation runs at near-real-time, compressing weeks of validation into days before committing to silicon.
Disebarkan
Legacy Glue Logic and Bus Integration
The EPF10K100ABI356-3 acts as universal glue logic on legacy backplanes because it replaces dozens of 74-series buffers, transceivers, and protocol converters with a single re-programmable device. Its 4,992 LEs integrate address decoding, wait-state insertion, bus arbitration, and interrupt prioritization across 8/16/32-bit bus architectures. The 24,576-bit EAB memory supports small FIFOs for bus-speed matching. Place it on the motherboard between legacy MCUs and modern peripherals; unlike discrete TTL glue, the FPGA accommodates board revisions and protocol updates without respinning the PCB.
Disebarkan
Pre-Production ASIC Replacement
The EPF10K100ABI356-3 substitutes for low-volume ASICs in pre-production runs because it delivers 100K gates of application-specific logic without NRE charges or mask costs. Its 356-LBGA package exposes 274 user I/Os for connecting to ASIC-pinned peripherals, while the 24,576-bit EAB SRAM holds small lookup tables, registers, and buffer memory. The 125 MHz toggle frequency covers most industrial and consumer timing budgets. Use it during the gap between prototype validation and ASIC tape-out; unlike an ASIC, the FPGA lets designers ship a few hundred units before committing to silicon, validating market acceptance at lower risk.
Disebarkan
Ringkasan Produk Disebarkan
Data referensi kejuruteraan untuk EPF10K100ABI356-3 — perbandingan, panduan rancangan, dan maklumat kesediaan
Panduan Pilihan
Perbandingan dengan Gantian
| Parametr | Produk Ini | EPF10K100ABC356-2 | EPF10K100ABC356-1 | EPF10K100ABI356-2 | EPF10K100ABI356-1 |
|---|---|---|---|---|---|
| Package | 356-LBGA | 356-LBGA - same | 356-LBGA - same | 356-LBGA - same | 356-LBGA - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Family | FLEX 10KA | FLEX 10KA - same | FLEX 10KA - same | FLEX 10KA - same | FLEX 10KA - same |
| Typical Gates | 100,000 | 100,000 - same | 100,000 - same | 100,000 - same | 100,000 - same |
| Speed Grade | -3 (slowest) | -2 (mid) | -1 (fastest) | -2 (mid) | -1 (fastest) |
| Temperature Grade | Industrial (I), 0-70 C | Commercial (C), 0-70 C | Commercial (C), 0-70 C | Industrial (I), 0-70 C - same | Industrial (I), 0-70 C - same |
| Maximum User I/Os | 274 | 274 - same | 274 - same | 274 - same | 274 - same |
| Supply Voltage | 3.3 V | 3.3 V - same | 3.3 V - same | 3.3 V - same | 3.3 V - same |
| Embedded Memory | 24576 bits | 24576 bits - same | 24576 bits - same | 24576 bits - same | 24576 bits - same |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Penyeberangsung Jelas
- Industrial temperature grade within the same die (vsEPF10K100ABC356-2)
- Slowest speed grade is most widely stocked (vsEPF10K100ABI356-1)
- SOPC integration via embedded array blocks (vsAltera MAX 7000 CPLD family)
- Mature Altera SameFrame pin-migration ecosystem (vsCyclone II EP2C50)
Catatan Desain
Estimated: At 100 percent toggle rate (typical activity 12-15 percent) with 274 I/Os switching at 5 MHz, the EPF10K100ABI356-3 draws roughly 300-500 mA from the 3.3 V supply. The datasheet recommends at least four 0.1 uF decoupling capacitors placed adjacent to each power-ball quadrant of the 356-LBGA, plus a single 100 uF bulk capacitor on the supply rail. Add a ferrite bead if the 3.3 V rail is shared with switching converters to keep FPGA switching noise out of sensitive analog sections.
The 356-LBGA package uses a 1.0 mm ball pitch requiring 0.5 mm diameter pads and microvia-in-pad PCB technology for reliable assembly. Place a continuous ground plane on layer 2 directly beneath the FPGA to provide a low-impedance return path for the high-speed signals. Match all clock and global signal trace lengths within 50 mils to avoid setup/hold violations. Fan-out from the BGA using dog-bone or via-in-pad patterns; the latter is preferred for signal integrity above 100 MHz.
Do not leave unused I/O banks floating - configure unused I/O pins as outputs driving ground or as inputs with internal pull-ups enabled to prevent input-buffer oscillation and excess supply current. The configuration pins (nCONFIG, nSTATUS, CONF_DONE) require 10 kohm pull-ups to VCCIO during power-up; missing pull-ups prevent successful configuration. When migrating from 356-LBGA to a smaller FineLine BGA via SameFrame, confirm that the unused balls do not carry signals required by the original design.
Estimated: Worst-case power dissipation at full I/O utilization and 125 MHz toggling is approximately 1.5 W. The 356-LBGA package has a theta-JA of approximately 18 C/W with a standard JEDEC test board, giving a junction-to-ambient rise of 27 C above ambient. In enclosed industrial cabinets at 70 C ambient, junction temperature remains below the 85 C maximum. Add thermal vias under the central ball grid for improved heat extraction in fanless designs.
MultiVolt I/O supports 2.5 V and 3.3 V outputs but the input threshold follows the VCCIO supply. When interfacing to 5 V devices, add external resistor dividers or level-shifters - never connect 5 V signals directly to FLEX 10KA I/O pins. Series-terminate clock outputs with 33 ohm resistors at the FPGA pin to dampen reflections on traces longer than 50 mm. Use the Quartus II timing analyzer to verify that all paths meet setup and hold margins with at least 15 percent slack.
Maklumat Kesediaan
Compliance data not stated in source web data; lead-free and RoHS status require confirmation from the distributor's environmental compliance documentation. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC.