Intel

EPF10K10TC144-3N - FLEX 10K FPGA, 10K Gates, 144-LQFP | Intel

MPN: EPF10K10TC144-3N ✗ Cuối đời

5.0 V Vdss 144-pin LQFP (TQFP), 22 mm x 22 mm, 0.5 mm pitch Package 80 MHz Speed 6,144 Memory

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EPF10K10TC144-3N Tóm tắt

The Intel EPF10K10TC144-3N is a member of the FLEX 10K family of SRAM-look-up-table-based field-programmable gate arrays (FPGAs), featuring 10,000 typical gates (31,000 maximum gates), 576 logic elements, 72 logic array blocks (LABs), and 102 user I/Os, all housed in a 144-pin LQFP (TQFP) package rated for commercial temperature. It supports MultiVolt I/O interface and offers 5.0-V tolerant input pins, enabling mixed-voltage system designs without external level shifters.

A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. The FLEX 10K family is an SRAM-LUT-based FPGA that combines fine-grained logic elements with embedded array blocks (EABs) for memory and complex arithmetic functions, occupying a middle position in the programmable logic hierarchy between simple PLDs/CPLDs and modern high-density FPGAs. The EPF10K10TC144-3N belongs to the lowest-density tier of the FLEX 10K family and was widely deployed in the late 1990s and early 2000s for glue-logic, custom peripheral, and bus-interface applications.

Key features include a maximum toggle frequency of 80 MHz (per the FLEX 10K family datasheet), PCI Local Bus Specification Revision 2.2 compliance, low standby current typically under 1 mA, flexible in-system programmability via an industry-standard SRAM configuration interface, and a rich selection of fine-grained logic, EABs, and FastTrack interconnect. The 144-LQFP plastic package measures 22 mm x 22 mm with 0.5 mm pitch, providing easy hand-soldering and rework capability for prototyping and low-volume production.

Internally, the device is built on a 0.42 µm CMOS SRAM process and uses a hierarchical interconnect structure combining row and column FastTrack channels, four-input LUT-based logic elements, and embedded array blocks (EABs) that can each implement up to 2,048 bits of RAM or a multiplier/ROM function. Configuration data is loaded from an external serial or parallel PROM via the serial configuration (EPCS-like) interface, and the device supports in-system reconfiguration for field updates. The architecture supports 6,144 memory bits (typical) of distributed RAM.

Typical applications for the EPF10K10TC144-3N include industrial automation controllers, telecommunications interface bridges, custom peripheral and bus-interface glue logic, low-density signal processing pre-processing, PCI bus interface logic, and legacy embedded designs where the FLEX 10K tool flow (Quartus, MAX+PLUS II) is already deployed. The combination of low power, 5-V tolerance, and PCI compliance makes it well-suited for retro-compatible add-in cards and industrial backplanes.

When designing with this device, ensure the configuration PROM and JTAG chain are correctly wired and that decoupling follows the FLEX 10K datasheet's recommended capacitor network. The non-volatile design must use an Altera (or compatible) configuration device because the SRAM-based logic is volatile and re-loads from configuration memory on every power-up. Quartus or MAX+PLUS II software is required for design entry, synthesis, place-and-route, and bitstream generation.

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Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPF10K10TC144-3N (cùng hình factor và footprint) — khác nhau ở Package, Operating Temperature, RoHS Status, Speed Grade, Process Technology.

EPF10K10ATC144-3N

Intel

Package: 144-pin TQFP (LQFP, 144-LQFP)

Operating Temperature: 0 °C to 70 °C (commercial)

RoHS Status: Non-Compliant (lead-bearing N suffix variant)