LCMXO3D-4300HC-5SG72C - MachXO3D 4300 LUT FPGA with Secure Boot | Lattice Semiconductor
MPN: LCMXO3D-4300HC-5SG72C ✓ Hoạt độngLCMXO3D-4300HC-5SG72C Tóm tắt
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory blocks that the user can configure post-manufacturing to implement arbitrary digital logic functions. Within the broader product hierarchy, an FPGA sits below the Application-Specific Integrated Circuit (ASIC) category but above fixed-function microcontrollers: it occupies the same role as a CPLD (Complex Programmable Logic Device) when logic density is small, but offers deeper memory, more I/O, and finer-grained routing. MachXO3D devices specifically target secure-control and instant-on glue-logic applications, extending the MachXO3 family with hardware Root-of-Trust, immutable security, and pre-verified cryptographic primitives.
Key features of the LCMXO3D-4300HC-5SG72C include 4300 LUTs (2150 Adaptive Logic Modules per Lattice datasheet), 94208 bits of EBR (about 11.8 kbytes), 96 kbits of distributed RAM, dedicated on-chip Flash Configuration Memory for instant-on behavior without external boot Flash, a Security Block supporting AES-256, SHA-256, HMAC, and ECDSA, and support for 2.5V/3.3V VCCIO with internal VCC core at 2.5V-3.3V. The device supports common interfaces such as I2C, SPI, I2S, UART, and LVDS via on-chip hardened IP. Operating junction temperature ranges from 0C to +85C (commercial grade, suffix 'C').
Architecturally, the MachXO3D HC variant uses a non-volatile configuration cell that eliminates external boot PROM and provides deterministic wake-up in under 1 ms, while the embedded Security Block isolates keys in tamper-resistant storage. Hardened I/O buffers tolerate 1.2V-3.3V signaling on independent banks, simplifying mixed-voltage board designs.
Typical applications for the LCMXO3D-4300HC-5SG72C include secure IoT endpoint controllers (hardware Root-of-Trust), industrial control bridging (SPI-to-I2C, I2C-to-UART glue logic), consumer device secure boot and firmware verification, automotive infotainment and ADAS glue logic in 4300 LUT class designs, and portable/wearable always-on sensor hubs.
When designing with this device, plan decoupling: place a 0.1 uF plus 1 uF ceramic within 5 mm of each VCC/VCCIO pin and bond the exposed pad (EP) directly to a ground plane with at least 9 thermal vias. Designers should evaluate whether the 58 available user I/Os (after package pad-out) meet their pin-count budget before committing to this variant.
Bộ thay thế dễ dàng lắp đặt cho LCMXO3D-4300HC-5SG72C — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
LCMXO3D-4300ZC-6SG72C
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
LCMXO3D-4300HE-5SG72C
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
LCMXO3D-4300HC-6SG72C
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
LCMXO3LF-4300E-5SG72C
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
LCMXO3D-9400HC-5SG72C
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
LCMXO3D-4300HC-5SG72C Tỷ lệ tối đa & tính chất điện
| Family | MachXO3D |
| Logic Elements / LUTs | 4300 LUTs (2150 ALMs) |
| Total RAM Bits | 94208 bits |
| User I/O Count | 58 |
| Hộp | 72-VFQFN Exposed Pad (SG72, 10x10 mm) |
| Kiểu lắp đặt | Surface Mount |
| Nhiệt độ hoạt động | 0C to +85C (commercial grade, suffix C) |
| Supply Voltage VCC | 2.5 V / 3.3 V |
| I/O Bank Voltage VCCIO | 1.2 V to 3.3 V (mixed banks) |
| Configuration Memory | Internal Flash, non-volatile (instant-on) |
| Security Block | AES-256, SHA-256, HMAC, ECDSA (hardware Root-of-Trust) |
| Hardened IP | I2C, SPI, I2S, UART, LVDS |
| Speed Grade | -5 |
| Trạng thái RoHS | Compliant |
| Lead-Free | Yes |
Cấu hình chân LCMXO3D-4300HC-5SG72C
| Chân 1 | I/O_BANK_0 — General-purpose user I/O bank 0 |
| Chân 2 | I/O_BANK_0 — General-purpose user I/O bank 0 |
| Chân 3 | GND — Ground |
| Chân 4 | VCCIO0 — I/O bank 0 supply voltage |
| Chân 5 | I/O_BANK_0 — General-purpose user I/O bank 0 |
| Chân 6 | I/O_BANK_0 — General-purpose user I/O bank 0 |
| Chân 7 | I/O_BANK_0 — General-purpose user I/O bank 0 |
| Chân 8 | I/O_BANK_0 — General-purpose user I/O bank 0 |
| Chân 9 | I/O_BANK_1 — General-purpose user I/O bank 1 |
| Chân 10 | I/O_BANK_1 — General-purpose user I/O bank 1 |
| Chân 11 | GND — Ground |
| Chân 12 | VCCIO1 — I/O bank 1 supply voltage |
| Chân 13 | I/O_BANK_1 — General-purpose user I/O bank 1 |
| Chân 14 | I/O_BANK_1 — General-purpose user I/O bank 1 |
| Chân 15 | I/O_BANK_1 — General-purpose user I/O bank 1 |
| Chân 16 | I/O_BANK_2 — General-purpose user I/O bank 2 |
| Chân 17 | I/O_BANK_2 — General-purpose user I/O bank 2 |
| Chân 18 | VCCIO2 — I/O bank 2 supply voltage |
| Chân 19 | I/O_BANK_2 — General-purpose user I/O bank 2 |
| Chân 20 | I/O_BANK_2 — General-purpose user I/O bank 2 |
| Chân 21 | GND — Ground |
| Chân 22 | I/O_BANK_2 — General-purpose user I/O bank 2 |
| Chân 23 | I/O_BANK_3 — General-purpose user I/O bank 3 |
| Chân 24 | I/O_BANK_3 — General-purpose user I/O bank 3 |
| Chân 25 | VCCIO3 — I/O bank 3 supply voltage |
| Chân 26 | I/O_BANK_3 — General-purpose user I/O bank 3 |
| Chân 27 | I/O_BANK_3 — General-purpose user I/O bank 3 |
| Chân 28 | GND — Ground |
| Chân 29 | I/O_BANK_3 — General-purpose user I/O bank 3 |
| Chân 30 | I/O_BANK_4 — General-purpose user I/O bank 4 |
| Chân 31 | I/O_BANK_4 — General-purpose user I/O bank 4 |
| Chân 32 | VCCIO4 — I/O bank 4 supply voltage |
| Chân 33 | I/O_BANK_4 — General-purpose user I/O bank 4 |
| Chân 34 | I/O_BANK_4 — General-purpose user I/O bank 4 |
| Chân 35 | I/O_BANK_4 — General-purpose user I/O bank 4 |
| Chân 36 | GND — Ground |
| Chân 37 | I/O_BANK_5 — General-purpose user I/O bank 5 |
| Chân 38 | VCCIO5 — I/O bank 5 supply voltage |
| Chân 39 | I/O_BANK_5 — General-purpose user I/O bank 5 |
| Chân 40 | I/O_BANK_5 — General-purpose user I/O bank 5 |
| Chân 41 | I/O_BANK_5 — General-purpose user I/O bank 5 |
| Chân 42 | GND — Ground |
| Chân 43 | I/O_BANK_5 — General-purpose user I/O bank 5 |
| Chân 44 | I/O_BANK_6 — General-purpose user I/O bank 6 |
| Chân 45 | VCCIO6 — I/O bank 6 supply voltage |
| Chân 46 | I/O_BANK_6 — General-purpose user I/O bank 6 |
| Chân 47 | I/O_BANK_6 — General-purpose user I/O bank 6 |
| Chân 48 | I/O_BANK_6 — General-purpose user I/O bank 6 |
| Chân 49 | GND — Ground |
| Chân 50 | I/O_BANK_6 — General-purpose user I/O bank 6 |
| Chân 51 | I/O_BANK_7 — General-purpose user I/O bank 7 |
| Chân 52 | VCCIO7 — I/O bank 7 supply voltage |
| Chân 53 | I/O_BANK_7 — General-purpose user I/O bank 7 |
| Chân 54 | I/O_BANK_7 — General-purpose user I/O bank 7 |
| Chân 55 | I/O_BANK_7 — General-purpose user I/O bank 7 |
| Chân 56 | GND — Ground |
| Chân 57 | TDO — JTAG Test Data Out |
| Chân 58 | TMS — JTAG Test Mode Select |
| Chân 59 | TCK — JTAG Test Clock |
| Chân 60 | TDI — JTAG Test Data In |
| Chân 61 | VCC — Core supply 2.5V or 3.3V |
| Chân 62 | PROGRAMN — Active-low configuration reset |
| Chân 63 | INITN — Active-low initialization done indicator |
| Chân 64 | DONE — Configuration complete indicator |
| Chân 65 | GND — Ground |
| Chân 66 | VCC — Core supply 2.5V or 3.3V |
| Chân 67 | CCLK — Configuration clock (SPI mode) |
| Chân 68 | SI — SPI slave data input / Slave Data In |
| Chân 69 | SO — SPI slave data output / Slave Data Out |
| Chân 70 | SN_CS — SPI slave select (active low) |
| Chân 71 | RESETN — Global reset (active low) |
| Chân 72 | VCCIO0 — I/O bank 0 supply voltage |
Ứng dụng tiêu biểu
LCMXO3D-4300HC-5SG72C phù hợp cho 6 Áp dụngs: IoT Secure Endpoint / Hardware Root-of-Trust, Industrial Control Bridging / Glue Logic, Consumer Device Secure Boot and Firmware Verification, Automotive ADAS and Infotainment Glue Logic, Portable / Wearable Always-On Sensor Hubs, Network Infrastructure and Edge Gateway Bridging.
IoT Secure Endpoint / Hardware Root-of-Trust
The LCMXO3D-4300HC-5SG72C is purpose-built for hardware Root-of-Trust functions in IoT endpoints. Its AES-256, SHA-256, HMAC, and ECDSA Security Block performs authenticated boot and firmware verification, while tamper-resistant key storage isolates credentials from the main application processor. With 4300 LUTs and 58 user I/Os, the device can also host small glue-logic tasks (sensor aggregation, watchdog, power sequencing) on the same die, reducing BOM count.
Được đề xuất
Industrial Control Bridging / Glue Logic
The LCMXO3D-4300HC-5SG72C excels at bus-bridging and signal-level translation in industrial control systems. With hardened I2C, SPI, I2S, and UART IP, plus LVDS-capable I/O at 2.5V/3.3V VCCIO, it can translate between legacy 3.3V sensors and modern 1.8V processors without any soft IP overhead. The 4300 LUT capacity supports multiple parallel bridges plus custom protocol handling, while non-volatile Flash configuration eliminates downtime after power-cycle.
Được đề xuất
Consumer Device Secure Boot and Firmware Verification
Consumer electronics such as smart-home hubs, network-attached storage, and connected appliances use the LCMXO3D-4300HC-5SG72C as a secure-boot companion. The Security Block verifies signed firmware on the main CPU at power-on, refusing to release reset until the image passes ECDSA signature check. The 58 user I/Os allow direct interfacing to SPI Flash, JTAG, and reset sequencing lines, while the small 10x10 mm QFN-EP package fits in space-constrained consumer enclosures.
Được đề xuất
Automotive ADAS and Infotainment Glue Logic
For automotive designs that do not require the extended HE temperature range, the commercial-grade LCMXO3D-4300HC-5SG72C (0C to +85C) serves as a flexible glue-logic companion to infotainment processors and camera-link serializers. With 4300 LUTs the part can implement CAN-to-Ethernet bridging, pixel-clock conditioning for LVDS displays, and power-sequencing logic between PMICs. Its hardware Security Block also enables secure CAN message authentication.
Được đề xuất
Portable / Wearable Always-On Sensor Hubs
Battery-powered wearables benefit from the LCMXO3D-4300HC-5SG72C's instant-on (sub-1 ms) configuration and low standby power. The device can sit in deep sleep, wake on a GPIO trigger from a sensor, perform filtering decisions in 4300 LUTs of logic, and return to sleep - all without waking the main MCU. The 72-pin VFQFN EP package handles thermal dissipation in wearable form factors while staying under 100 mm squared total PCB area.
Được đề xuất
Network Infrastructure and Edge Gateway Bridging
Edge gateways frequently need protocol translation between Ethernet-attached sensors and serial-based actuators. The LCMXO3D-4300HC-5SG72C offers 4300 LUTs for custom protocol parsing, 58 I/Os, and hardened I2C/SPI/UART cores that can run independent peripheral stacks simultaneously. Hardware AES-256 acceleration further offloads VPN handshake tasks from the main CPU, while deterministic sub-1 ms boot keeps the gateway on-line after brown-outs.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho LCMXO3D-4300HC-5SG72C — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | LCMXO3D-4300ZC-6SG72C | LCMXO3D-4300HE-5SG72C | LCMXO3D-4300HC-6SG72C | LCMXO3LF-4300E-5SG72C | LCMXO3D-9400HC-5SG72C |
|---|---|---|---|---|---|---|
| Package | 72-VFQFN EP (SG72, 10x10 mm) | 72-VFQFN EP (SG72) - same | 72-VFQFN EP (SG72) - same | 72-VFQFN EP (SG72) - same | 72-VFQFN EP (SG72) - same | 72-VFQFN EP (SG72) - same |
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| LUTs / ALMs | 4300 LUTs (2150 ALMs) | 4300 LUTs | 4300 LUTs | 4300 LUTs | 4300 LUTs | 9400 LUTs (+118%) |
| User I/O Count | 58 | 58 | 58 | 58 | 58 | 58 |
| VCC Core | 2.5V / 3.3V | 1.2V | 1.2V | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V |
| Security Block (AES-256 / ECDSA) | Yes | Yes | Yes | Yes | No (MachXO3L pre-security family) | Yes |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +125C (automotive) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Speed Grade | -5 | -6 (slower) | -5 | -6 (slower) | -5 | -5 |
| Configuration Memory | Internal Flash (non-volatile) | Internal Flash | Internal Flash | Internal Flash | Internal Flash | Internal Flash |
Bảo phân biệt quan trọng
- Integrated hardware Security Block (AES-256/SHA-256/ECDSA) for Root-of-Trust (vsLCMXO3LF-4300E-5SG72C)
- Higher LUT density option available in same package (vsLCMXO3D-9400HC-5SG72C)
- Automotive-grade temperature option in same footprint (vsLCMXO3D-4300HE-5SG72C)
Ghi chú thiết kế
MachXO3D HC devices require 2.5V or 3.3V on VCC, with separate VCCIO pins supporting 1.2V to 3.3V per I/O bank. Place 0.1 uF X7R ceramic decoupling within 3 mm of each VCC/VCCIO pin, plus a single 10 uF bulk capacitor near the package. The exposed pad (EP) must be soldered directly to a ground plane with at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch) for thermal dissipation and electrical ground return - this is critical for non-volatile Flash configuration reliability.
Route all 58 user I/Os as 50 ohm controlled-impedance traces if any LVDS or SPI >50 MHz signals are used; otherwise standard 50 ohm microstrip is sufficient. Keep JTAG (TDI/TDO/TMS/TCK) traces short (under 50 mm) and isolated from switching supplies. Place the ProgramN pin with a 10 kohm pull-up to VCCIO0 to ensure clean configuration defaults at power-up.
Estimated: a design that uses more than 4300 LUTs will fail to fit the device silently at compile time. Compile with Lattice Diamond and review the 'Resource Usage' report to confirm utilization stays under 80 percent to leave routing headroom. Also verify that the chosen security profile (development vs production) is correct - locking the device in production mode is irreversible and prevents further JTAG access.
For LVDS pairs on the LCMXO3D-4300HC-5SG72C, match trace lengths to within 0.5 mm and use 100 ohm differential impedance. The part supports up to 8 LVDS pairs per bank; consult the MachXO3D datasheet pinout for exact pin assignments. Add a 100 ohm termination resistor across the differential pair at the receiver end when traces exceed 25 mm to avoid reflections.
Although the MachXO3D family is known for low power, the Security Block operations (AES-256, ECDSA) draw measurable current during boot. Estimated: peak supply current during Security Block stress can reach ~50 mA on VCC, producing 0.15 W dissipation at 3.3V; with theta JA around 30 C/W, junction rise is approximately 4.5 C - well within the 0C-85C commercial envelope, but adequate copper pour is required if used in enclosed industrial enclosures.
Thông tin tuân thủ
Commercial grade (suffix C, 0C-85C). RoHS compliant per Lattice product page. AEC-Q100 is not applicable for the commercial HC variant - choose the HE variant (LCMXO3D-4300HE-5SG72C) for AEC-Q100-qualified automotive applications.