LPC1827JBD144E - 180MHz Cortex-M3 MCU with Ethernet | NXP
MPN: LPC1827JBD144E ✓ Hoạt độngLPC1827JBD144E Tóm tắt
An Arm Cortex-M3 microcontroller is a 32-bit embedded processing device built around the Arm Cortex-M3 processor core. Cortex-M3 belongs to the microcontroller product hierarchy and combines a three-stage pipeline, interrupt-oriented architecture, low-power operation, and integrated debug support. The LPC182x family applies this core to applications requiring high connectivity, fast control, and a broad peripheral set within a single integrated circuit.
The LPC1827JBD144E provides up to 1 MB of Flash for firmware and data, 136 kB of SRAM for working memory, and CPU operation up to 180 MHz. Integrated Ethernet supports network-connected equipment, while two high-speed USB interfaces enable host, device, or dual-role connectivity. LCD support and the family’s EMC features broaden its suitability for human-interface equipment and designs exposed to electrically noisy environments.
The three-stage Cortex-M3 pipeline supports efficient instruction execution and predictable interrupt handling. This architecture is well suited to protocol processing, data acquisition, user-interface control, communications management, and real-time supervisory functions. Consolidated connectivity and memory can also reduce external component count compared with designs that require separate USB, Ethernet, memory, and display-interface components.
Typical applications include industrial Ethernet controllers, USB-to-serial and protocol-conversion equipment, data-logging systems, HMI panels, building controls, test-and-measurement instruments, and embedded gateways. The combination of 180 MHz performance, 136 kB SRAM, Ethernet, and dual high-speed USB makes the device especially useful when local processing and multiple communication paths are required in one controller.
PCB design should preserve high-speed signal integrity around the Ethernet and USB interfaces, including controlled-impedance routing, continuous return paths, and short differential-pair geometry. Decoupling and signal-integrity practices described in the NXP datasheet should be followed, and the 144-pin footprint requires careful assignment of unused pins before final schematic and layout release.
This product record combines the manufacturer’s device positioning with distributor availability information, practical application guidance, package-specific design considerations, and a structured drop-in comparison. The result helps engineers evaluate whether the LPC1827JBD144E provides the required memory, connectivity, processing speed, and 144-LQFP footprint before beginning PCB implementation.
Bộ thay thế dễ dàng lắp đặt cho LPC1827JBD144E — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với LPC1827JBD144E (cùng hình factor và footprint) — khác nhau ở Package, Architecture, Ethernet Support, Flash Memory, LCD Interface.
LPC1822JBD144
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
LPC1823JBD144
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
LPC1825JBD144
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
LPC1826JBD144
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
LPC1830FBD144K
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →LPC1827JBD144E Tỷ lệ tối đa & tính chất điện
| Product Type | 32-bit ARM Cortex-M3 Microcontroller |
| Processor Core | Arm Cortex-M3 |
| Maximum CPU Frequency | 180 MHz |
| Flash Memory | 1 MB |
| Flash Organization | 1M x 8 bits |
| SRAM | 136 kB |
| Ethernet Support | Integrated Ethernet |
| High-Speed USB Interfaces | 2 |
| LCD Support | Integrated LCD interface support |
| EMC Features | Integrated EMC features |
| Pipeline Stages | 3 stages |
| Hộp | 144-LQFP |
| Package Dimensions | 20 mm x 20 mm |
| Kiểu lắp đặt | Surface Mount |
| Architecture | ARM 32-bit |
| Product Family | LPC182x |
Hướng dẫn cấu hình chân LPC1827JBD144E 20 mm x 20 mm
Cấu hình chân cho LPC1827JBD144E (20 mm x 20 mm gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho LPC1827JBD144E.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
LPC1827JBD144E phù hợp cho 6 Áp dụngs: Industrial Ethernet Control, USB Protocol Converter, Human-Machine Interface Panel, Data Acquisition Gateway, Building Automation Controller, Test and Measurement Instrument.
Industrial Ethernet Control
The LPC1827JBD144E fits industrial Ethernet controllers that combine network communication with real-time supervisory logic. Its Arm Cortex-M3 core operates up to 180 MHz, while 136 kB of SRAM supports protocol state, buffers, diagnostics, and application variables. The integrated Ethernet interface avoids a separate network controller, and two high-speed USB interfaces can support local configuration or service connectivity. Preserve Ethernet signal integrity with continuous reference planes, controlled-impedance differential routing, and isolation from switching nodes.
Được đề xuất
USB Protocol Converter
The LPC1827JBD144E is suitable for USB protocol-conversion and interface hubs because it integrates two high-speed USB interfaces and an Arm Cortex-M3 core running up to 180 MHz. Its 1 MB Flash can hold application firmware and conversion tables, while 136 kB of SRAM can buffer active transfers. Implement USB routing with symmetric, impedance-controlled differential pairs, short connector-to-controller connections, and solid grounding to minimize insertion loss and susceptibility to EMI.
Được đề xuất
Human-Machine Interface Panel
The LPC1827JBD144E supports human-machine interface panels that combine display control, touch or keypad input, data logging, and network management. LCD support removes the need for a separate display-interface component, while 180 MHz processing performance allows responsive control and background communications. The 136 kB of SRAM is useful for screen buffers and interface state. Apply NXP’s decoupling and layout guidance and validate signal timing and display-interface levels before releasing the PCB.
Được đề xuất
Data Acquisition Gateway
The LPC1827JBD144E can serve as the local controller in a data-acquisition gateway by sampling sensors, formatting measurements, and forwarding results over Ethernet or USB. Its Arm Cortex-M3 core operates up to 180 MHz for protocol processing, while 136 kB of SRAM supports acquisition buffers and communications queues. The integrated EMC features are useful in electrically noisy equipment. Separate analog and digital grounding appropriately, use controlled input filtering, and verify timing margins under simultaneous high-speed communication.
Được đề xuất
Building Automation Controller
The LPC1827JBD144E is appropriate for building-automation controllers that must coordinate sensors, communications, local logic, and remote management. Its 1 MB Flash supports firmware and configuration storage, while Ethernet and dual USB connectivity provide flexible commissioning and service paths. The 180 MHz Cortex-M3 core can handle protocol tasks without an external processor. Use isolated field-bus transceivers where required and keep long external wiring physically separated from the Ethernet, USB, and clock routing.
Được đề xuất
Test and Measurement Instrument
The LPC1827JBD144E can coordinate acquisition, calibration, front-panel communication, and host connectivity in a test-and-measurement instrument. Its 180 MHz processing capability supports responsive measurement control, the 136 kB SRAM handles working buffers, and Ethernet or USB can connect the instrument to automated test equipment. Maintain short analog paths, use independent analog and digital supply sections, and follow the manufacturer’s grounding and decoupling layout to prevent digital activity from disturbing sensitive measurements.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho LPC1827JBD144E — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | LPC1822JBD144 | LPC1823JBD144 | LPC1825JBD144 | LPC1826JBD144 | LPC1830FBD144K |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP, 20 mm x 20 mm | 144-LQFP | 144-LQFP | 144-LQFP | 144-LQFP | 144-LQFP |
| Processor Core | Arm Cortex-M3 | Arm Cortex-M3 | Arm Cortex-M3 | Arm Cortex-M3 | Arm Cortex-M3 | Arm Cortex-M3 |
| Maximum CPU Frequency | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 180 MHz |
| Flash Memory | 1 MB | 512 KB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 136 kB | 64 kB | 64 kB | 64 kB | 64 kB | 136 kB |
Bảo phân biệt quan trọng
- Higher Flash capacity than LPC1822JBD144 (vsLPC1822JBD144)
- More SRAM than three same-family candidates (vsLPC1823JBD144)
- Supports a Site-listed LPC18xx option with the same family architecture (vsLPC1830FBD144K)
Ghi chú thiết kế
Place all required decoupling capacitors directly at the corresponding LPC1827JBD144E power pins and route each capacitor’s ground return through an uninterrupted plane connection. Use the NXP manufacturer datasheet to identify every supply rail and its permitted voltage. Do not merge power and signal-ground paths casually around the Ethernet PHY, USB interfaces, or clock circuitry because shared impedances can convert switching current into measurement and communication errors.
Route Ethernet and USB differential pairs as continuous impedance-controlled connections with symmetric geometry, minimal vias, and no unterminated stubs. Preserve a continuous reference plane beneath each pair and separate high-speed lines from crystals, clocks, and sensitive inputs. For USB, place protection and series-resistance components where the connector and controller require them, and follow the NXP layout recommendations before finalizing component placement.
Do not treat the 144-LQFP footprint as sufficient proof of interchangeability. Before substituting an LPC18xx device, compare power pins, ground pins, Ethernet PHY and USB pins, LCD signals, clock inputs, reset, debug interfaces, boot pins, and every no-connect position against the manufacturer pin table. Software startup, peripheral availability, and temperature-grade differences can affect a replacement even when the PCB land pattern is identical.
Estimate junction temperature from actual input voltage, core and I/O current, switching activity, ambient temperature, and the package thermal characteristics specified in the manufacturer datasheet. The 144-LQFP package has many leads, so thermal performance depends on both copper area and the distribution of power-dissipating I/O. Spread heat-producing paths across the device where practical and avoid directing high-current outputs through a small group of pins.
Thông tin tuân thủ
No explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements were included in the product information. Confirm these attributes and the exact ordering-suffix qualification on the NXP product page before release.