LPC1827JBD144E - 180MHz Cortex-M3 MCU with Ethernet | NXP
部品番号: LPC1827JBD144E ✓ 生産中LPC1827JBD144E 概要
An Arm Cortex-M3 microcontroller is a 32-bit embedded processing device built around the Arm Cortex-M3 processor core. Cortex-M3 belongs to the microcontroller product hierarchy and combines a three-stage pipeline, interrupt-oriented architecture, low-power operation, and integrated debug support. The LPC182x family applies this core to applications requiring high connectivity, fast control, and a broad peripheral set within a single integrated circuit.
The LPC1827JBD144E provides up to 1 MB of Flash for firmware and data, 136 kB of SRAM for working memory, and CPU operation up to 180 MHz. Integrated Ethernet supports network-connected equipment, while two high-speed USB interfaces enable host, device, or dual-role connectivity. LCD support and the family’s EMC features broaden its suitability for human-interface equipment and designs exposed to electrically noisy environments.
The three-stage Cortex-M3 pipeline supports efficient instruction execution and predictable interrupt handling. This architecture is well suited to protocol processing, data acquisition, user-interface control, communications management, and real-time supervisory functions. Consolidated connectivity and memory can also reduce external component count compared with designs that require separate USB, Ethernet, memory, and display-interface components.
Typical applications include industrial Ethernet controllers, USB-to-serial and protocol-conversion equipment, data-logging systems, HMI panels, building controls, test-and-measurement instruments, and embedded gateways. The combination of 180 MHz performance, 136 kB SRAM, Ethernet, and dual high-speed USB makes the device especially useful when local processing and multiple communication paths are required in one controller.
PCB design should preserve high-speed signal integrity around the Ethernet and USB interfaces, including controlled-impedance routing, continuous return paths, and short differential-pair geometry. Decoupling and signal-integrity practices described in the NXP datasheet should be followed, and the 144-pin footprint requires careful assignment of unused pins before final schematic and layout release.
This product record combines the manufacturer’s device positioning with distributor availability information, practical application guidance, package-specific design considerations, and a structured drop-in comparison. The result helps engineers evaluate whether the LPC1827JBD144E provides the required memory, connectivity, processing speed, and 144-LQFP footprint before beginning PCB implementation.
ドロップイン代替品: LPC1827JBD144E — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: LPC1827JBD144E （同一形状・フットプリント） — 相違点: Package, Architecture, Ethernet Support, Flash Memory, LCD Interface.
LPC1822JBD144
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
LPC1823JBD144
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
LPC1825JBD144
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
LPC1826JBD144
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
LPC1830FBD144K
✅ ドロップイン ⚠️ 仕様未検証価格はお問い合わせください
データシートを見る →LPC1827JBD144E 最大定格＆電気的特性
| Product Type | 32-bit ARM Cortex-M3 Microcontroller |
| Processor Core | Arm Cortex-M3 |
| Maximum CPU Frequency | 180 MHz |
| Flash Memory | 1 MB |
| Flash Organization | 1M x 8 bits |
| SRAM | 136 kB |
| Ethernet Support | Integrated Ethernet |
| High-Speed USB Interfaces | 2 |
| LCD Support | Integrated LCD interface support |
| EMC Features | Integrated EMC features |
| Pipeline Stages | 3 stages |
| パッケージ | 144-LQFP |
| Package Dimensions | 20 mm x 20 mm |
| 実装タイプ | Surface Mount |
| Architecture | ARM 32-bit |
| Product Family | LPC182x |
LPC1827JBD144E 20 mm x 20 mm ピン配置ガイド
LPC1827JBD144E (20 mm x 20 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: LPC1827JBD144E.
詳細は データシート をご参照ください。
主な用途
LPC1827JBD144E の用途: 6 件s: Industrial Ethernet Control, USB Protocol Converter, Human-Machine Interface Panel, Data Acquisition Gateway, Building Automation Controller, Test and Measurement Instrument.
Industrial Ethernet Control
The LPC1827JBD144E fits industrial Ethernet controllers that combine network communication with real-time supervisory logic. Its Arm Cortex-M3 core operates up to 180 MHz, while 136 kB of SRAM supports protocol state, buffers, diagnostics, and application variables. The integrated Ethernet interface avoids a separate network controller, and two high-speed USB interfaces can support local configuration or service connectivity. Preserve Ethernet signal integrity with continuous reference planes, controlled-impedance differential routing, and isolation from switching nodes.
おすすめ
USB Protocol Converter
The LPC1827JBD144E is suitable for USB protocol-conversion and interface hubs because it integrates two high-speed USB interfaces and an Arm Cortex-M3 core running up to 180 MHz. Its 1 MB Flash can hold application firmware and conversion tables, while 136 kB of SRAM can buffer active transfers. Implement USB routing with symmetric, impedance-controlled differential pairs, short connector-to-controller connections, and solid grounding to minimize insertion loss and susceptibility to EMI.
おすすめ
Human-Machine Interface Panel
The LPC1827JBD144E supports human-machine interface panels that combine display control, touch or keypad input, data logging, and network management. LCD support removes the need for a separate display-interface component, while 180 MHz processing performance allows responsive control and background communications. The 136 kB of SRAM is useful for screen buffers and interface state. Apply NXP’s decoupling and layout guidance and validate signal timing and display-interface levels before releasing the PCB.
おすすめ
Data Acquisition Gateway
The LPC1827JBD144E can serve as the local controller in a data-acquisition gateway by sampling sensors, formatting measurements, and forwarding results over Ethernet or USB. Its Arm Cortex-M3 core operates up to 180 MHz for protocol processing, while 136 kB of SRAM supports acquisition buffers and communications queues. The integrated EMC features are useful in electrically noisy equipment. Separate analog and digital grounding appropriately, use controlled input filtering, and verify timing margins under simultaneous high-speed communication.
おすすめ
Building Automation Controller
The LPC1827JBD144E is appropriate for building-automation controllers that must coordinate sensors, communications, local logic, and remote management. Its 1 MB Flash supports firmware and configuration storage, while Ethernet and dual USB connectivity provide flexible commissioning and service paths. The 180 MHz Cortex-M3 core can handle protocol tasks without an external processor. Use isolated field-bus transceivers where required and keep long external wiring physically separated from the Ethernet, USB, and clock routing.
おすすめ
Test and Measurement Instrument
The LPC1827JBD144E can coordinate acquisition, calibration, front-panel communication, and host connectivity in a test-and-measurement instrument. Its 180 MHz processing capability supports responsive measurement control, the 136 kB SRAM handles working buffers, and Ethernet or USB can connect the instrument to automated test equipment. Maintain short analog paths, use independent analog and digital supply sections, and follow the manufacturer’s grounding and decoupling layout to prevent digital activity from disturbing sensitive measurements.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: LPC1827JBD144E — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | LPC1822JBD144 | LPC1823JBD144 | LPC1825JBD144 | LPC1826JBD144 | LPC1830FBD144K |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP, 20 mm x 20 mm | 144-LQFP | 144-LQFP | 144-LQFP | 144-LQFP | 144-LQFP |
| Processor Core | Arm Cortex-M3 | Arm Cortex-M3 | Arm Cortex-M3 | Arm Cortex-M3 | Arm Cortex-M3 | Arm Cortex-M3 |
| Maximum CPU Frequency | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 180 MHz |
| Flash Memory | 1 MB | 512 KB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 136 kB | 64 kB | 64 kB | 64 kB | 64 kB | 136 kB |
主な差別化要因
- Higher Flash capacity than LPC1822JBD144 （vs LPC1822JBD144)
- More SRAM than three same-family candidates （vs LPC1823JBD144)
- Supports a Site-listed LPC18xx option with the same family architecture （vs LPC1830FBD144K)
設計ノート
Place all required decoupling capacitors directly at the corresponding LPC1827JBD144E power pins and route each capacitor’s ground return through an uninterrupted plane connection. Use the NXP manufacturer datasheet to identify every supply rail and its permitted voltage. Do not merge power and signal-ground paths casually around the Ethernet PHY, USB interfaces, or clock circuitry because shared impedances can convert switching current into measurement and communication errors.
Route Ethernet and USB differential pairs as continuous impedance-controlled connections with symmetric geometry, minimal vias, and no unterminated stubs. Preserve a continuous reference plane beneath each pair and separate high-speed lines from crystals, clocks, and sensitive inputs. For USB, place protection and series-resistance components where the connector and controller require them, and follow the NXP layout recommendations before finalizing component placement.
Do not treat the 144-LQFP footprint as sufficient proof of interchangeability. Before substituting an LPC18xx device, compare power pins, ground pins, Ethernet PHY and USB pins, LCD signals, clock inputs, reset, debug interfaces, boot pins, and every no-connect position against the manufacturer pin table. Software startup, peripheral availability, and temperature-grade differences can affect a replacement even when the PCB land pattern is identical.
Estimate junction temperature from actual input voltage, core and I/O current, switching activity, ambient temperature, and the package thermal characteristics specified in the manufacturer datasheet. The 144-LQFP package has many leads, so thermal performance depends on both copper area and the distribution of power-dissipating I/O. Spread heat-producing paths across the device where practical and avoid directing high-current outputs through a small group of pins.
コンプライアンス情報
No explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements were included in the product information. Confirm these attributes and the exact ordering-suffix qualification on the NXP product page before release.