LSM6DSV80XTR - 6-Axis IMU, 80g Accel, AI Core | STMicroelectronics
MPN: LSM6DSV80XTR ✓ Hoạt độngLSM6DSV80XTR Tóm tắt
An IMU (Inertial Measurement Unit) is a micro-electromechanical system (MEMS) device combining multiple motion sensors - typically a 3-axis accelerometer and a 3-axis gyroscope - to measure linear acceleration and angular rate along three orthogonal axes. IMUs sit at the sensor layer of a product hierarchy: IMU -> motion sensor -> MEMS sensor -> semiconductor. They form the perception backbone for inertial navigation, gesture recognition, and context-aware applications, feeding higher-level sensor-hub processors, microcontrollers, or wireless SoCs with raw or fused motion data.
Key features include dual full-scale accelerometer ranges (±16 g and ±80 g) for capturing both subtle wrist motion and high-impact events such as falls or sport collisions, a wide ±125/±250/±500/±1000/±2000/±4000 dps gyroscope range, an embedded machine-learning core for on-device classification, and a sensor-fusion low-power (SFLP) engine that outputs quaternions and Euler angles at low µA cost. Communication is provided over I²C, I³C, and auxiliary SPI interfaces, and an integrated temperature sensor aids drift compensation.
The LSM6DSV80XTR is built on ST's proprietary THELMA MEMS process and a 130 nm mixed-signal CMOS ASIC, co-packaged in a single LGA. The dual-structure accelerometer (a high-g and a low-g transducer sharing the same sense axis) is what differentiates this part from earlier LSM6DS family members: it preserves fine resolution at low g while still capturing peak accelerations above the standard 16 g ceiling.
Typical applications include sport wearables (impact detection in boxing, running gait analysis), wristbands, AR/VR controllers, fall-detection pendants for elderly care, and personal trackers. For each use case, the relevant specification is the high-g full scale combined with the embedded ML core.
When designing with the LSM6DSV80XTR, follow ST's reference schematic exactly: a 100 nF decoupling cap on VDD plus a 10 µF bulk on VDDIO, clean ground return under the LGA thermal/exposed pad, and short traces to the host MCU. Verify I3C compatibility before substituting an I²C-only MCU.
This page synthesizes distributor pricing, drop-in replacements, and practical design notes not consolidated in the manufacturer datasheet, including a same-package alternative comparison that DigiKey and Mouser product pages do not show.
Bộ thay thế dễ dàng lắp đặt cho LSM6DSV80XTR — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với LSM6DSV80XTR (cùng hình factor và footprint) — khác nhau ở Embedded Features, Gyroscope Full Scale, Operating Temperature, Package, Sensor Type.
LSM6DSV80X
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
LSM6DSO32XTR
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →LSM6DSO32XTR
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →LSM6DSO32XTR
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →LSM6DSV80XTR Tỷ lệ tối đa & tính chất điện
| Kiểu cảm biến | Accelerometer + Gyroscope, 6-axis IMU |
| Number of Axes | 6 (X, Y, Z) |
| Output Interface | I2C, I3C, SPI |
| Accelerometer Full Scale (high-g) | ±80 g |
| Gyroscope Full Scale | ±4000 dps |
| Điện áp cung cấp | 1.71 V to 3.6 V |
| Supply Current (low-power mode) | 2.9 µA |
| Nhiệt độ hoạt động | -40 °C to +85 °C |
| Hộp | LGA-14 (2.5 x 3 mm) |
| Embedded Features | Machine Learning Core, Sensor Fusion Low-Power (SFLP) Engine |
| Temperature Sensor | Integrated |
| Kiểu lắp đặt | Surface Mount |
| Trạng thái RoHS | Compliant |
| Secondary Accel Full Scale | ±16 g |
Cấu hình chân LSM6DSV80XTR
| Chân 1 | VDD — Core power supply, 1.71 V to 3.6 V |
| Chân 2 | GND — Ground |
| Chân 3 | VDDIO — I/O supply voltage |
| Chân 4 | SCL — I2C/I3C clock |
| Chân 5 | SDA — I2C/I3C data |
| Chân 6 | CS — SPI chip select |
| Chân 7 | SPC — SPI clock |
| Chân 8 | SDI — SPI data input |
| Chân 9 | SDO — SPI data output |
| Chân 10 | INT1 — Interrupt 1 |
| Chân 11 | INT2 — Interrupt 2 |
| Chân 12 | RES — Reserved / NC |
| Chân 13 | GND — Ground |
| Chân 14 | GND — Ground (thermal pad) |
Ứng dụng tiêu biểu
LSM6DSV80XTR phù hợp cho 6 Áp dụngs: Sport Impact Detection, Fall Detection Wearables, AR/VR Controller IMU, Running Gait Analysis, Industrial Vibration Monitoring, Personal Trackers and Beacons.
Sport Impact Detection
The LSM6DSV80XTR's second 80 g accelerometer structure is purpose-built for capturing high-intensity impacts in contact sports such as boxing, kickboxing, and football. With 16 g low-g and 80 g high-g full-scale sensing running in parallel, the IMU can simultaneously track subtle wrist kinematics during a punch and the peak deceleration of a glove impact, preserving low-g resolution that single-missile compressors would otherwise clip. The embedded machine-learning core can classify hit severity on-device at low µA cost, eliminating continuous high-rate streaming to a host MCU.
Được đề xuất
Fall Detection Wearables
For elderly-care pendants and wristbands, the LSM6DSV80XTR's 80 g full scale is essential: typical fall events generate peak accelerations of 8-15 g but with transient spikes above 60 g during shoulder impact. The dedicated high-g path captures those transients without saturating, while the low-g path drives the always-on posture-classification ML core. Operating at 2.9 µA in low-power mode, the IMU supports multi-day battery life on small coin cells, and the I3C interface minimizes wake-up overhead when reporting events.
Được đề xuất
AR/VR Controller IMU
In AR/VR controllers, the LSM6DSV80XTR delivers ±4000 dps gyroscope dynamic range combined with low-g accelerometer precision for sub-degree orientation tracking at high angular velocities such as fast swings. The sensor-fusion low-power (SFLP) engine outputs quaternions directly, offloading the host application processor and reducing end-to-end latency. The 14-pin LGA footprint suits space-constrained controller PCBs, and I3C supports up to 12.5 MHz data rates for high-ODR motion streaming.
Được đề xuất
Running Gait Analysis
Foot-strike analysis in running wearables requires capturing high-g heel-strike transients alongside low-g cadence data. The LSM6DSV80XTR's dual 16 g / 80 g accelerometer structure delivers this in a single package, with the high-g channel covering peak heel-strike deceleration (typically 5-10 g in elite sprinters but transient to 30-50 g on hard surfaces) and the low-g channel capturing the steady-state foot orientation. The ML core enables on-device gait-phase segmentation without streaming raw data over BLE.
Được đề xuất
Industrial Vibration Monitoring
For predictive-maintenance vibration sensors on motors and bearings, the LSM6DSV80XTR's ±4000 dps gyroscope range and 80 g accelerometer capture high-frequency mechanical signatures while the on-device ML core runs anomaly classifiers at the edge. Operating over -40 °C to +85 °C industrial temperatures and consuming only 2.9 µA in low-power mode, the IMU enables battery-powered wireless sensor nodes that report only classified events. ST's STEVAL-MKI247A adapter board provides a quick prototyping reference for industrial deployments.
Được đề xuất
Personal Trackers and Beacons
Bluetooth trackers such as luggage tags, key finders, and pet collars rely on always-on motion classification to preserve battery life. The LSM6DSV80XTR's 2.9 µA low-power current combined with its embedded ML core lets a tracker distinguish a 'picked up' event from ambient vibration without waking the host BLE SoC, extending coin-cell runtime by months. The wide 1.71 V to 3.6 V supply range accommodates the CR2032 discharge curve directly without boost circuitry.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho LSM6DSV80XTR — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | LSM6DSV80X | LSM6DSO32X |
|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | LGA-14 (2.5x3 mm) | LGA-14 (2.5x3 mm) - same | LGA-14 (2.5x3 mm) - same |
| Accelerometer High-g Full Scale | ±80 g | ±80 g - same | ±32 g (-60%) |
| Accelerometer Low-g Full Scale | ±16 g | ±16 g - same | ±16 g - same |
| Supply Voltage | 1.71 V to 3.6 V | 1.71 V to 3.6 V - same | 1.71 V to 3.6 V - same |
| Sensor Fusion Engine | Yes (SFLP) | Yes (SFLP) | Yes (SFLP) |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C |
Bảo phân biệt quan trọng
- Dual 16 g / 80 g accelerometer in single package (vsLSM6DSO32X)
- Embedded sensor-fusion low-power engine (vsGeneric external sensor-hub processor)
- I3C interface support (vsI2C-only IMU predecessors)
Ghi chú thiết kế
Place a 100 nF X7R ceramic decoupling cap directly on the LGA pads as close to pin 1 (VDD) and pin 3 (VDDIO) as possible, plus a 10 µF bulk capacitor on VDDIO. The 2.5x3 mm LGA has an integrated ground paddle on the underside - this MUST be soldered to a contiguous ground pour with multiple thermal vias to the inner ground plane, both for electrical grounding and to spread the IMU's self-heating uniformly across the PCB.
Do not assume the part operates at the legacy I3C default bus voltage if your MCU is I2C-only: confirm VDDIO matches your host rail (typically 1.8 V or 3.3 V). Verify the host firmware supports I3C dynamic address assignment before relying on I3C mode - falling back to I2C reduces throughput but preserves compatibility. Always assert the CS pin high in SPI mode to avoid bus contention.
Keep the IMU isolated from mechanical stress: mount near the geometric center of the PCB on a stiffened section, and avoid placing tall components within 5 mm of the LGA. Mechanical stress from board flexure is the dominant source of offset drift in MEMS IMUs; symmetric mounting and stiffeners cut stress-induced bias shifts by an order of magnitude compared with corner placement.
The MEMS accelerometer zero-g offset drifts with temperature at a rate of approximately ±0.1 mg/°C typical - calibrate the zero-g offset at the application's operating temperature band (e.g., at 25 °C and 40 °C for body-worn devices) for high-accuracy tilt or orientation outputs. The integrated temperature sensor can drive the fill loop in real time at the cost of a small increase in active current.
Thông tin tuân thủ
RoHS compliant per JLCPCB listing. Not AEC-Q100 qualified - commercial-grade IMU for wearables and industrial use. For automotive applications requiring AEC-Q100, consult ST's automotive-grade IMU portfolio.
