Microchip Technology

M2GL050-FG896I - 56K LE Industrial IGLOO2 FPGA | Microchip

MPN: M2GL050-FG896I ✓ Hoạt động
1.2 V Vdss 896-ball BGA Package On-chip flash configuration Memory
MOQ: 1 |

M2GL050-FG896I Tóm tắt

The Microchip Technology M2GL050-FG896I is an IGLOO2 low-density field-programmable gate array with 56,340 logic elements, 377 user I/O, and a 1.2 V core in an 896-ball BGA package. The industrial-temperature suffix identifies it for equipment operating across an extended industrial temperature grade, while the 896-ball package exposes substantial connectivity for parallel buses, bridging, data acquisition, and control logic.

An FPGA is a programmable semiconductor whose digital logic is defined after fabrication through a configuration bitstream. Within the semiconductor hierarchy, the M2GL050-FG896I belongs to the low-density IGLOO2 FPGA family. Compared with a fixed-function programmable logic device, an FPGA can implement combinational logic, sequential logic, interfaces, and parallel processing functions in one reconfigurable device. The M2GL050 is intended for general-purpose functions such as bridging, I/O expansion, conversion, system management, and secure connectivity.

The principal design strengths of the M2GL050-FG896I are its 56,340 logic elements, 377 I/O positions, and 896-ball package. The large I/O count supports designs that connect multiple external buses or peripherals without requiring several support devices. The low-density IGLOO2 architecture provides a practical balance between programmable logic capacity and board complexity, while on-chip flash allows the configuration to be retained without continuously operating an external configuration memory device.

The device belongs to the IGLOO2 low-density FPGA generation and is identified by the manufacturer as being in production. Its 1.2 V core operates from a low-voltage digital supply, while the industrial-grade ordering code supports designs intended for industrial environments. The 896-BGA package also demands careful PCB layout because its dense ball array requires via-in-pad or via-under-bump construction and controlled escape routing to achieve useful board-level performance.

Typical applications include industrial protocol bridging, parallel data acquisition, sensor and actuator interfacing, embedded control, system-management logic, and secure connectivity. The 377 I/O positions are especially useful when a design must connect legacy parallel logic to a more compact control structure. The IGLOO2 family also supports reprogrammable hardware that can adapt to different protocols, interface revisions, or field-updatable configurations.

For a new board, follow the Microchip IGLOO2 package, power, decoupling, configuration, and high-speed layout guidance exactly. Treat the BGA escape strategy and clean supply distribution as first-order layout constraints rather than late PCB refinements. Firmware and bitstream integration should also follow the device programming and validation requirements documented for the selected IGLOO2 device.

This product page combines the exact orderable MPN, package identity, logic-cell count, I/O count, lifecycle indication, comparison options, and application-focused design guidance. It also distinguishes true same-footprint alternatives from related IGLOO2 devices that use different packages and therefore require PCB redesign before they can replace the M2GL050-FG896I.

Bộ thay thế dễ dàng lắp đặt cho M2GL050-FG896I — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với M2GL050-FG896I (cùng hình factor và footprint) — khác nhau ở Device Type, Configuration Memory, Package.

Microchip Technology
Device Type: IGLOO 2 low-density flash FPGA
Configuration Memory: Embedded flash
Package: 896-pin FBGA
So sánh với M2GL050-FG896I →
Microchip Technology
Device Type: IGLOO2 flash field-programmable gate array (FPGA)
Configuration Memory: Embedded flash
Package: 896-pin FBGA
So sánh với M2GL050-FG896I →

M2GL050-FG896

✅ Drop-In
Microchip Technology
📦 896-BGA
IGLOO2 flash field-programmable gate array (FPGA) · 56,340 cells · 1.2 V · 896-pin FBGA · Surface mount · Embedded flash

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M2GL050-FG896I Tỷ lệ tối đa & tính chất điện

Device Type Low-density IGLOO2 FPGA
Logic Elements 56,340 logic elements
User I/O 377 I/O
Core Voltage 1.2 V
Hộp 896-ball BGA
Total Terminals 896 terminals
Temperature Grade Industrial
Kiểu lắp đặt Surface mount
Terminal Form Ball
Package Shape Square
Programmable Technology Flash FPGA
Configuration Memory On-chip flash configuration
Product Status In production
Logic Families Supported Combinational and sequential digital logic

Hướng dẫn cấu hình chân M2GL050-FG896I square

Cấu hình chân cho M2GL050-FG896I (square gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.

Bảng cấu hình chân square cho M2GL050-FG896I

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Ứng dụng tiêu biểu

M2GL050-FG896I phù hợp cho 6 Áp dụngs: Industrial Protocol Bridging, Parallel Data Acquisition, Sensor and Actuator Interfacing, Embedded System Control, Secure Connectivity and Authentication, Programmable Logic Consolidation.

🏭

Industrial Protocol Bridging

The M2GL050-FG896I is suited to industrial protocol bridging because its 377 user I/O positions can support multiple parallel interfaces while 56,340 logic elements provide space for protocol conversion and control state machines. The device can bridge legacy peripheral buses to a more compact FPGA-based controller without requiring a separate large PLD for every converter. The 1.2 V core minimizes digital supply demand, although the 896-ball BGA requires a multilayer PCB with carefully planned power, ground, and signal-escape routing.

📊

Parallel Data Acquisition

For parallel data-acquisition systems, the M2GL050-FG896I provides 377 I/O positions for connecting wide sensor, counter, or instrument buses. Its 56,340 logic elements can support sampling control, trigger logic, filtering, buffering, and packing of acquired data into a serial interface. The industrial-temperature ordering code supports designs intended for industrial operating conditions. Engineers should verify acquisition timing and I/O standards against the IGLOO2 datasheet and design the BGA escape layer for the required signal bandwidth.

🧩

Sensor and Actuator Interfacing

The 377 user I/O positions allow the M2GL050-FG896I to consolidate multiple digital sensors, switches, encoders, and actuator controls into one programmable logic device. With 56,340 logic elements, it can implement conditioning, debouncing, state management, fault detection, and timing functions around those external signals. The flash FPGA architecture supports configuration retention and field updates, while the industrial-grade designation is relevant to equipment operating beyond benign laboratory conditions.

⚡

Embedded System Control

The M2GL050-FG896I can act as a dedicated system-control FPGA alongside a host processor, implementing boot sequencing, watchdog behavior, interrupt aggregation, peripheral arbitration, and power-state management. Its 56,340 logic elements provide substantial configurable control capacity, while 377 I/O positions simplify connections among processors, memory interfaces, and discrete peripherals. The 1.2 V core reduces core-rail complexity, but system power sequencing, configuration startup, and BGA decoupling must be designed together.

🌐

Secure Connectivity and Authentication

Microchip identifies secure connectivity as an intended use for the IGLOO2 low-density family, and the M2GL050-FG896I provides 56,340 logic elements for protocol engines, message formatting, key-handling control logic, and authenticated data paths. Its 377 I/O positions can accommodate external communication devices and status interfaces. The part's flash-based configuration supports a stable field-updatable design, although security assurance depends on the complete implementation, key lifecycle, and correctly protected programming and configuration workflow.

🔧

Programmable Logic Consolidation

The M2GL050-FG896I can consolidate several small programmable-logic functions into one device, including glue logic, state machines, bus arbitration, protocol conversion, and I/O expansion. Consolidating those functions benefits from 56,340 logic elements and 377 user I/O in a single 896-ball package. It can simplify firmware partitioning and reduce separate support-device count, but migration requires checking every ball assignment and configuration dependency. For functional replacement, the M2GL050-FG896 offers a closely related ordering option.

Tóm tắt các sản phẩm được đề xuất

M2GL050 Device-family reference Được sử dụng trong: Industrial Protocol Bridging, Parallel Data Acquisition, Sensor and Actuator Interfacing, Embedded System Control, Secure Connectivity and Authentication, Programmable Logic Consolidation M2GL050T Related low-density IGLOO2 family option Được sử dụng trong: Industrial Protocol Bridging, Parallel Data Acquisition, Sensor and Actuator Interfacing, Embedded System Control, Secure Connectivity and Authentication M2GL050-FG896 Microchip Technology Được sử dụng trong: Programmable Logic Consolidation
What is the Microchip M2GL050-FG896I?
The M2GL050-FG896I is a low-density IGLOO2 flash FPGA with 56,340 logic elements, 377 user I/O, and an 896-ball BGA package. According to the Microchip IGLOO2 FPGA and SmartFusion 2 SoC FPGA datasheet DS00004750, the M2GL050 device family provides programmable logic for general-purpose functions such as bridging, I/O expansion, conversion, system management, and secure connectivity. Its 1.2 V core and on-chip flash configuration make it suitable for compact embedded control and interface designs.
How many logic elements and I/O does the M2GL050-FG896I have?
The M2GL050-FG896I contains 56,340 logic elements and provides 377 user I/O positions. These figures identify it as the 896-ball package member of the M2GL050 IGLOO2 low-density FPGA family. The comparatively high I/O count supports wide parallel interfaces and board-level signal aggregation, while the 56,340 logic elements provide the implementation area for control, protocol, data-processing, and system-management functions.
Where can I download the M2GL050-FG896I datasheet PDF?
The M2GL050-FG896I datasheet PDF is available through the official Microchip document link listed on this page. Document DS00004750 covers the IGLOO2 FPGA family, including the M2GL050 device prefix and its electrical AC and DC specifications. Use the document's device tables and package information to confirm operating limits, pin descriptions, power requirements, and the conditions associated with the industrial-temperature ordering suffix.
Where can I find the M2GL050-FG896I pinout?
The M2GL050-FG896I pin assignments and ball map are defined in the official Microchip IGLOO2 documentation and its associated package information. Because this product uses a 896-ball BGA, a reliable schematic-to-PCB mapping requires the complete manufacturer pin list rather than a simplified diagram. Use the package drawing and pin-description table when assigning power, configuration, clock, user I/O, and dedicated function balls on the PCB.
What package does the M2GL050-FG896I use?
The M2GL050-FG896I uses a square 896-ball BGA package with 896 terminals. This package provides a high pin count for a low-density FPGA and supports substantially more external connections than smaller leaded or reduced-BGA packages. Its density also creates demanding PCB requirements, including controlled escape routing, appropriate via structures, and careful power and ground distribution across the ball field.
Is M2GL050-FG896I suitable for industrial applications?
The M2GL050-FG896I is ordered with the industrial temperature designation, making it the appropriate IGLOO2 option for many industrial equipment designs. The exact operating-temperature limits and electrical performance across that grade must be confirmed in Microchip datasheet DS00004750 before release. Industrial suitability also depends on the complete system enclosure, power quality, temperature gradients, and electromagnetic requirements rather than the device suffix alone.
What can replace the M2GL050-FG896I?
The closest identified same-footprint replacement is the Microchip Technology M2GL050-FG896, which retains the M2GL050 device, 896-ball package configuration, and 56,340-logic-element family position while changing the industrial-temperature suffix. Before substitution, verify the required temperature grade, pin assignments, configuration scheme, supply sequencing, and programming support in the manufacturer documentation. A related device in a smaller package is not a drop-in replacement because its footprint differs.
Can M2GL050-FG896 replace M2GL050-FG896I?
The M2GL050-FG896 can serve as a same-package functional replacement when the required operating-temperature grade is compatible with the design. It belongs to the same M2GL050 IGLOO2 family and uses the 896-ball ordering form, but its suffix does not carry the industrial-temperature designation of the M2GL050-FG896I. Confirm the temperature range and any purchasing traceability requirements before authorizing a production substitution.
When should I choose M2GL050-FG896I instead of M2GL050-FG896?
Choose the M2GL050-FG896I when the assembly must use the industrial-temperature grade of the 896-ball M2GL050 device. Choose the M2GL050-FG896 only when its temperature grade satisfies the product's environmental requirements and the resulting supply-chain configuration is acceptable. Both parts use the same broad device and package family, but temperature suitability is the principal engineering distinction identified from the orderable part numbers.
M2GL050-FG896I vs M2GL050-FG896I - which temperature grade is correct?
The M2GL050-FG896I carries the industrial-temperature designation, while the M2GL050-FG896 omits the I suffix. Select M2GL050-FG896I when the specified product temperature range requires the industrial grade and select M2GL050-FG896 only when the other grade's limits meet that requirement. Verify the complete suffix definition and operating-temperature table in Microchip documentation because package and logic-cell count alone do not establish environmental suitability.
Is there a best cross-brand equivalent for the M2GL050-FG896I?
No verified cross-brand drop-in equivalent was identified for the M2GL050-FG896I. A true direct replacement would require an 896-ball package with matching power, configuration, clock, dedicated-function, and user-I/O ball assignments, together with compatible flash configuration and software support. Cross-reference search results do not establish those conditions by themselves, so changing manufacturers should not be treated as a footprint-compatible substitution without a complete pin and tooling verification.
Where can I buy the M2GL050-FG896I and check its price?
Use the Request a Quote form on this page to request the M2GL050-FG896I, current commercial terms, and the quantity required for your build. The form lets the supply team confirm availability, lot traceability, and delivery planning against the exact 896-ball industrial-temperature ordering code. The current commercial answer should be obtained through that request rather than inferred from a family-level listing or an unrelated package variant.
What is the lead time for the M2GL050-FG896I?
The current lead time for the M2GL050-FG896I should be confirmed through the Request a Quote form on this page. Lead time can vary with order quantity, production schedule, packaging format, traceability requirements, and inventory position, so a generic device-family statement cannot establish the date for a specific procurement event. Include your forecast quantities and required delivery date in the request to obtain an actionable schedule.
Is the M2GL050-FG896I in stock?
Current inventory for the M2GL050-FG896I should be confirmed through the Request a Quote form on this page using the exact MPN. The manufacturer identifies the M2GL050 family as in production, but that lifecycle statement does not establish the quantity immediately available for a particular order. The quotation response should confirm stock status, scheduled delivery, and any minimum-order or allocation constraints.
What are the key specifications engineers should know about the M2GL050-FG896I?
The key specifications are 56,340 logic elements, 377 user I/O, a 1.2 V core, an industrial-temperature designation, and a 896-ball BGA package. Microchip describes the IGLOO2 low-density family as suitable for bridging, I/O expansion, conversion, system management, and secure connectivity. These parameters define the device's broad implementation capacity and routing opportunities, while the dense BGA package and flash configuration workflow remain central PCB and software-design constraints.

Dữ liệu tham khảo kỹ thuật cho M2GL050-FG896I — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose the M2GL050-FG896I when the design requires the 56,340-logic-element IGLOO2 device, 377 user I/O, and the industrial-temperature ordering suffix in an 896-ball BGA. It is appropriate for industrial control, protocol bridging, parallel acquisition, interface consolidation, and secure-connectivity logic where the complete IGLOO2 power and configuration architecture is implemented. Select the M2GL050-FG896 only when the non-industrial suffix satisfies the product's environmental requirements and the supply chain accepts that grade. Both candidates share the same device family and package form, but the temperature designation is the deciding difference. No cross-brand drop-in candidate has been verified; cross-vendor alternatives would require independent confirmation of ball assignments, configuration behavior, software support, and board qualification. A smaller-package M2GL050 device can serve a new design with different pin planning, but it is not a drop-in replacement for an existing M2GL050-FG896I board.

So sánh với các sản phẩm thay thế

Tham số Sản phẩm này M2GL050-FG896
Brand Microchip Technology Microchip Technology
Package 896-BGA 896-BGA
Device Family IGLOO2 low-density FPGA IGLOO2 low-density FPGA
Logic Elements 56,340 56,340
User I/O 377 377
Core Voltage 1.2 V 1.2 V
Temperature Grade Industrial Non-industrial suffix; exact limits require confirmation
Programmable Technology Flash FPGA Flash FPGA
Configuration Support On-chip flash configuration On-chip flash configuration

Bảo phân biệt quan trọng

  • High-density programmable connectivity in one device (vsM2GL050-FG896)
  • Large logic implementation capacity (vsM2GL050-FG896)
  • Extensive I/O availability (vsM2GL050-FG896)
  • Single-device consolidation of control functions (vsM2GL050-FG896)

Ghi chú thiết kế

Design the 896-ball BGA escape layer before placing the functional logic. Use the manufacturer's package drawing and recommended via arrangement, then route high-speed, clock, configuration, and sensitive I/O nets with controlled length and impedance. The dense package offers 377 user I/O, but that connectivity is useful only if power, ground, and signal escapes do not compromise each other. Validate the complete stack-up, via-in-pad process, solder-mask definition, and assembly capability before release.

Partition the 1.2 V core rail and other supply requirements according to Microchip's IGLOO2 power architecture. Place required decoupling capacitance at the relevant package balls, maintain a low-impedance distribution plane, and isolate noisy return paths from configuration and sensitive interfaces. Check simultaneous switching activity and core current in the datasheet power-estimation guidance before choosing regulator capacity, because a low core voltage does not eliminate board-level supply integrity requirements.

Do not treat related M2GL050 devices as interchangeable without reviewing the complete ordering suffix, temperature grade, package drawing, pin table, and configuration documentation. A device with the same family name or logic-element count can differ in I/O implementation, supply requirements, or package details. For M2GL050-FG896I, use Microchip datasheet DS00004750 and the exact package documentation as the authority for the PCB and programming design.

Keep configuration signals, clock inputs, and high-fanout routing away from noisy switching nodes, and follow the manufacturer's guidance for clock and I/O standards. Use the 377 available I/O strategically: assign the most timing-sensitive interfaces according to bank and performance constraints rather than by placement convenience. Review unused balls, dedicated configuration pins, and power balls directly from the manufacturer pin-description table instead of inferring them from the commercial package outline.

Thông tin tuân thủ

RoHS
Unknown
REACH
Unknown
AEC-Q100
Unknown
Không chì
Unknown
Không halogen
Unknown
Khoáng vật xung đột
Unknown

No explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations were included in the product information. The I suffix identifies an industrial temperature grade, but it does not by itself establish automotive qualification.

Dữ liệu được xác minh vào: 2026-11-08 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

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Microchip Technology M2GL050-FG896I M2GL050-FG896 M2GL050 M2GL050T IGLOO2 field-programmable gate array FPGA flash FPGA logic elements user I/O 1.2 V core 896-ball BGA surface-mount semiconductor industrial-temperature grade programmable logic on-chip flash configuration protocol bridging I/O expansion system management secure connectivity parallel data acquisition JEDEC RoHS REACH
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