MC7448HX1250ND - PowerPC G4 MPU 1.25GHz 1MB L2 | NXP
MPN: MC7448HX1250ND ✗ Cuối đờiMC7448HX1250ND Tóm tắt
What is a PowerPC microprocessor? A PowerPC microprocessor is a reduced instruction set computer (RISC) CPU based on the Power Architecture instruction set developed jointly by Apple, IBM, and Motorola. The MPC74xx line (PowerPC G4) targets high-performance embedded applications that require deterministic compute, large L2 caches, and AltiVec SIMD acceleration - placing it in the hierarchy: PowerPC -> RISC MPU -> microprocessor -> integrated circuit -> semiconductor. The MPC7448 is the most significant update to the MPC74xx line to date, manufactured on 90 nm SOI for lower power and higher frequency.
Key features include a 32-bit Power Architecture core at 1.25 GHz, 1 MB of unified L2 cache, the AltiVec vector engine for single-instruction multiple-data (SIMD) workloads, an MPX/60x system bus for high-bandwidth memory and I/O, and a low 1.1 V core voltage. Power dissipation is managed through dynamic frequency scaling and deep power-down states, allowing the part to fit thermal envelopes as low as approximately 7 W typical. Hardware virtualization, MMU, and on-chip debug are standard.
Architecturally, the MPC7448 expands the original MPC7410/MPC7447 pipeline with a wider issue width, enhanced branch prediction, and a dedicated L2 prefetch engine that sustains throughput on cache-miss workloads. The 90 nm SOI process reduces leakage current compared with earlier 130 nm G4 parts, while preserving software compatibility across the MPC74xx family. The MPX bus scales to 200 MHz and supports multiprocessor coherency, allowing two MPC7448 devices to be paired for symmetric multiprocessing.
Typical applications include network routing and switching line cards, telecom baseband and control-plane processing, military/aerospace ruggedized compute modules, industrial machine vision, and high-end imaging or print controllers. AltiVec also accelerates DSP-style inner loops in software-defined radio and video preprocessing.
When designing with this device, provision a robust thermal solution because FCCBGA-360 packages dissipate significant power at 1.25 GHz. Maintain a stable 1.1 V core rail with low ripple, route the MPX bus with controlled impedance, and follow NXP layout guidelines for BGA decoupling and clock distribution.
This page synthesizes distributor pricing, same-family drop-in alternatives, and design guidance not found in the bare datasheet - giving engineers a single reference for EOL risk, second-source options, and practical layout considerations for the MC7448HX1250ND.
Bộ thay thế dễ dàng lắp đặt cho MC7448HX1250ND — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với MC7448HX1250ND (cùng hình factor và footprint) — khác nhau ở Core Architecture, Mounting Type, Package, Process Technology, SIMD Engine.
MC7448HX1400ND
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MC7448HX1267ND
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
MC7448HX1167ND
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
MC7448HX1000ND
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →MPC7448VS1267ND
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
MC7448HX1250ND Tỷ lệ tối đa & tính chất điện
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Series | MPC7448 (PowerPC G4) |
| Core Architecture | 32-bit Power Architecture (PowerPC G4) |
| Core Count | 1 |
| Maximum Core Frequency | 1.25 GHz |
| L2 Cache Size | 1 MB (unified, on-chip) |
| Process Technology | 90 nm Silicon-on-Insulator (SOI) |
| System Bus | MPX/60x, up to 200 MHz |
| SIMD Engine | AltiVec (VMX) |
| Core Voltage (Vdd) | 1.1 V |
| Nhiệt độ hoạt động | -40C to +105C |
| Hộp | 360-ball FCCBGA (25x25 mm) |
| Kiểu lắp đặt | Surface Mount (BGA) |
Hướng dẫn cấu hình chân MC7448HX1250ND 360-ball fccbga (25x25 mm)
Cấu hình chân cho MC7448HX1250ND (360-ball fccbga (25x25 mm) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho MC7448HX1250ND.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
MC7448HX1250ND phù hợp cho 6 Áp dụngs: Network Routing & Switching Line Cards, Telecom Baseband & Control-Plane Processing, Military & Aerospace Ruggedized Compute, Industrial Machine Vision Systems, High-End Imaging & Print Controllers, Software-Defined Radio (SDR) Front-Ends.
Network Routing & Switching Line Cards
The MC7448HX1250ND's 1.25 GHz PowerPC G4 core with AltiVec SIMD accelerates packet header parsing, route-lookup, and QoS classification in enterprise routing line cards. The MPX/60x bus sustains 200 MHz transfers to external DDR memory and lookup ASICs, while 1 MB of L2 cache keeps routing tables hot for low-latency forwarding. Power consumption around 7-10 W fits NEBS-compliant chassis thermal budgets.
Được đề xuất
Telecom Baseband & Control-Plane Processing
In 3G/4G base stations and control-plane blades, the MC7448HX1250ND provides deterministic single-thread performance for signaling stacks and real-time control loops. AltiVec accelerates DSP inner loops for channel decoding and modulation, while the 32-bit PowerPC ISA preserves software compatibility with legacy VxWorks and Linux BSPs deployed across telecom fleets.
Được đề xuất
Military & Aerospace Ruggedized Compute
The MC7448HX1250ND's industrial -40C to +105C operating range and 90 nm SOI radiation-tolerant design make it suitable for avionics, unmanned vehicle control, and ruggedized mission computers. The 360-ball FCCBGA package withstands high-vibration environments when paired with underfill, and the PowerPC ISA enjoys a long heritage of MIL-spec BSPs and real-time OS support.
Được đề xuất
Industrial Machine Vision Systems
AltiVec SIMD engine on the MC7448HX1250ND delivers up to 8 GFLOPs of single-precision throughput for image preprocessing, edge detection, and pattern matching in factory-floor machine vision. The 1 MB L2 cache holds multi-megapixel frame buffers in flight, while the deterministic PowerPC pipeline supports hard-real-time inspection cycles under 10 ms.
Được đề xuất
High-End Imaging & Print Controllers
The MC7448HX1250ND drives raster image processors (RIPs) in commercial and industrial printers by streaming large page buffers through its L2 cache and decompressing page-description languages via AltiVec. The MPX/60x interface connects to imaging ASICs and high-speed serializers, while the 1.25 GHz clock keeps multi-color print pipelines running at production speed.
Được đề xuất
Software-Defined Radio (SDR) Front-Ends
AltiVec SIMD acceleration on the MC7448HX1250ND executes FFT, modulation, and channelization kernels in real time for software-defined radio front-ends. The 1.25 GHz PowerPC core processes multiple MHz of spectrum bandwidth, while the MPX/60x bus streams baseband samples to ADC/DAC companion chips. Deterministic interrupt latency supports time-sensitive protocol stacks.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho MC7448HX1250ND — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | MC7448HX1400ND | MC7448HX1267ND | MC7448HX1167ND | MC7448HX1000ND | MPC7448VS1267ND |
|---|---|---|---|---|---|---|
| Package | 360-FCCBGA (25x25 mm) | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 1.25 GHz | 1.40 GHz | 1.267 GHz | 1.167 GHz | 1.00 GHz | 1.267 GHz |
| L2 Cache | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| Process Technology | 90 nm SOI | 90 nm SOI | 90 nm SOI | 90 nm SOI | 90 nm SOI | 90 nm SOI |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | VID-controlled |
| AltiVec SIMD | Yes | Yes | Yes | Yes | Yes | Yes |
| System Bus | MPX/60x up to 200 MHz | MPX/60x up to 200 MHz | MPX/60x up to 200 MHz | MPX/60x up to 200 MHz | MPX/60x up to 200 MHz | MPX/60x up to 200 MHz |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
Bảo phân biệt quan trọng
- Highest same-package clock in 7448 HX family (vsMC7448HX1000ND)
- Same die, lower power versus 1.4 GHz binned part (vsMC7448HX1400ND)
- Industrial temperature screening across -40C to +105C (vsMPC7448VS1267ND)
Ghi chú thiết kế
Estimated: at 1.25 GHz the MC7448HX1250ND dissipates approximately 7-10 W. For an FR4 PCB with the FCCBGA-360 package, theta_JA is typically around 15-25 C/W depending on copper area and via count. Mount a heatsink rated for at least 10 W continuous with thermal interface material, and keep junction temperature under 110C at the worst-case ambient. Verify with the NXP MPC7448 thermal model before final layout.
The 360-ball FCCBGA (25x25 mm) requires high-density fan-out routing. Use microvia stacks (laser-drilled 0.1 mm vias) to escape the inner rows of balls, and provide a solid ground/power plane pair beneath the package. Place at least eight 0.1 uF high-frequency ceramic decoupling capacitors within 5 mm of the package perimeter, plus bulk polymer or tantalum capacitors on each voltage rail.
Core voltage is 1.1 V with tight tolerance; use a buck converter with sub-2% load regulation. Provide a separate PLL supply rail filtered through a ferrite bead and bypassed with 10 uF + 0.1 uF. Sequence the MPX bus voltage and core voltage to avoid latch-up during power-up; consult the NXP MPC7448 hardware specifications addendum for the recommended sequencing order.
Do not confuse the MC7448HX1250ND with the lower-frequency MC7447AHX1000NB or MC7447ATHX1000NB - the 7447 family uses a 130 nm process, 512 KB L2, and runs at 1.0 GHz. Same package ballout but BIOS firmware differs. Also avoid confusing the 'HX' (industrial) suffix against 'VS' (VID-controlled voltage) variants - both share the same die but use different voltage regulation schemes.
Thông tin tuân thủ
Compliance status not explicitly stated in the public MPC7448 hardware specifications addendum. NXP transitioned the family to lead-free packaging during its production life, but specific lot compliance should be verified via manufacturer certificate of conformance (CoC). AEC-Q100 is not applicable because this is an MPU, not an automotive-grade IC.
