MC8641DVJ1333JE - Dual e600 SoC, 2x1333 MHz, Rev 3 | NXP Semiconductors
MPN: MC8641DVJ1333JE ⚠ Lần mua cuốiMC8641DVJ1333JE Tóm tắt
What is a Power Architecture SoC? A Power Architecture SoC integrates one or more PowerPC CPU cores with memory controllers, high-speed serial interfaces, and peripheral IP onto a single chip. The e600 core uses the Power Architecture Book E instruction set, extends it with AltiVec SIMD, and is widely deployed in networking, storage, defense, and industrial embedded applications where deterministic performance and long-term software reuse matter more than raw peak clock speed. Within the broader taxonomy, MC8641DVJ1333JE sits as: e600 core -> PowerPC MPC86xx dual-core SoC -> 32-bit Power Architecture SoC -> embedded microprocessor -> integrated circuit.
Key device-level features include dual e600 cores at 1333 MHz with AltiVec SIMD, a 7-stage superscalar pipeline with three-issue dispatch, an integrated DDR1/DDR2 memory controller with ECC, dual Gigabit Ethernet MACs, PCI Express interface, Serial RapidIO (SRIO), and an operating temperature range of 0°C to +105°C for industrial-grade environments. The 1023-ball FCCBGA package exposes the full high-speed I/O complement while preserving signal integrity for multi-gigabit SerDes lanes.
Architecturally, the MPC8641D pairs two e600 cores with a shared L2 cache topology and a coherent fabric, enabling symmetric multiprocessing (SMP) on a single chip. Hardware virtualization helpers and a dedicated DMA engine accelerate packet processing in networking line cards, while AltiVec boosts DSP-class workloads such as voice transcoding, image manipulation, and cryptographic primitives in software. Compared with discrete CPU-plus-chipset designs, this SoC consolidates the memory controller and I/O bridge on-die, reducing board area, BOM cost, and power envelope for embedded platforms.
Typical applications include multi-service routers and switches (PCIe to SRIO fabric bridging), industrial automation controllers running VxWorks or Linux, military/aerospace compute modules requiring long-life silicon, RAID/NAS storage controllers with AltiVec-accelerated RAID parity, and defence-grade signal processing cards. The dual-core 1333 MHz configuration handles wire-speed packet inspection, encryption, and control-plane workloads on a single board.
When designing with this device, ensure the PCB supports 1023-ball BGA routing with matched-length SerDes lanes for PCI Express and Serial RapidIO. Provide adequate decoupling and thermal dissipation - the FCCBGA package requires a heatsink or cold plate under sustained load. Use NXP's board-support packages (BSP) and U-Boot for early bring-up.
Bộ thay thế dễ dàng lắp đặt cho MC8641DVJ1333JE — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với MC8641DVJ1333JE (cùng hình factor và footprint) — khác nhau ở Ethernet, Package, Operating Temperature, Mounting Type, PCI Express.
MC8641DHX1333JE
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MC8641VU1333JE
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MC8641HX1333JB
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MC8640HX1067NE
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MC8640VU1000HC
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MC8641DVJ1333JE Tỷ lệ tối đa & tính chất điện
| Core Architecture | PowerPC e600 (dual-core) |
| Number of Cores | 2 |
| Core Frequency | 1333 MHz |
| Bề rộng đường dữ liệu | 32-bit |
| SIMD Extensions | AltiVec |
| Memory Controller | DDR1/DDR2 with ECC |
| Ethernet | 2x 10/100/1000 (Gigabit) MACs |
| PCI Express | Yes |
| Serial RapidIO (SRIO) | Yes |
| Nhiệt độ hoạt động | 0°C to +105°C |
| Hộp | 1023-FCCBGA (33x33 mm) |
| Kiểu lắp đặt | Surface Mount |
| Silicon Revision | Rev 3 |
Hướng dẫn cấu hình chân MC8641DVJ1333JE 1023-fccbga (33x33 mm)
Cấu hình chân cho MC8641DVJ1333JE (1023-fccbga (33x33 mm) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho MC8641DVJ1333JE.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
MC8641DVJ1333JE phù hợp cho 6 Áp dụngs: Multi-Service Routers and Switches, RAID / NAS Storage Controllers, Defense and Aerospace Compute Modules, Industrial Automation Controllers, Wireless Base Station Processing, Industrial Imaging and Surveillance Servers.
Multi-Service Routers and Switches
The MC8641DVJ1333JE dual e600 cores at 1333 MHz provide the symmetric multiprocessing headroom needed for simultaneous control-plane (routing daemon, OSPF/BGP) and data-plane (ACL, QoS classification, deep packet inspection) workloads on a single line card. Its integrated dual Gigabit Ethernet MACs feed packets directly to the cores, while the PCI Express fabric links to switch ASICs at multi-gigabit rates. Designers typically pair this SoC with a backplane SerDes for distributed chassis designs where throughput per slot is critical, avoiding the latency penalty of external CPU-plus-chipset implementations.
Được đề xuất
RAID / NAS Storage Controllers
The MC8641DVJ1333JE drives enterprise storage controllers where AltiVec SIMD accelerates RAID parity (XOR, Reed-Solomon) calculations in software, freeing dedicated hardware RAID engines for higher-tier arrays. The dual e600 cores share the workload between host-side protocol offload (iSCSI, NFS, SMB) and storage-side RAID processing. DDR2 ECC memory directly attached to the on-die controller provides the bandwidth needed for streaming reads/writes, while PCI Express links to SAS/SATA controllers at line rate. For long-life storage platforms, the part's longevity track record under VxWorks/Linux is well documented.
Được đề xuất
Defense and Aerospace Compute Modules
The MC8641DVJ1333JE is widely deployed in defense and aerospace embedded systems where long-life silicon, industrial-grade temperature range (0°C to +105°C), and long-term BSP support from vendors such as Curtiss-Wright and Mercury Systems are contractual requirements. Its dual e600 cores with AltiVec handle signal intelligence (SIGINT), image exploitation, and electronic-warfare workloads on ruggedized VME/VPX boards. Designers benefit from NXP's documented errata history and a mature VxWorks SMP software ecosystem under DO-178C / MIL-STD qualification flows for safety-critical defense platforms.
Được đề xuất
Industrial Automation Controllers
The MC8641DVJ1333JE serves as the central controller in industrial automation platforms running real-time Linux or VxWorks, where deterministic response times and AltiVec-driven signal processing (motor control loop FIR, FFT for vibration analysis) meet factory-floor expectations. The dual e600 cores isolate the real-time control thread from user-space HMI workloads on the same chip, reducing latency versus dual-chip designs. The integrated DDR2 controller with ECC withstands industrial EMI environments, while the Serial RapidIO ports bridge to deterministic motion-control DSP slaves across rugged backplanes.
Được đề xuất
Wireless Base Station Processing
The MC8641DVJ1333JE powers base-station compute cards where dual e600 cores at 1333 MHz execute L2/L3 protocol stacks, encryption/decryption, and packet scheduling while AltiVec handles voice codec pools via SIMD. The PCI Express and Serial RapidIO fabric integrates cleanly with baseband ASICs and radio-front-end modules. DDR2-800 ECC memory satisfies the bandwidth profile of multi-carrier LTE processing. The part's documented 0°C to +105°C operating range covers outdoor cabinet deployments.
Được đề xuất
Industrial Imaging and Surveillance Servers
The MC8641DVJ1333JE drives industrial video surveillance servers and medical imaging appliance compute, where AltiVec accelerates H.264/H.265 entropy decoding, JPEG2000 wavelet transforms, and FFT-based image registration. The dual-core 1333 MHz configuration handles 4 to 8 streams of HD video concurrently with motion detection analytics, while PCI Express connects to GPU co-processors or capture cards. ECC DDR2 protects frame buffers against soft errors in 24/7 always-on surveillance environments where downtime is unacceptable.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho MC8641DVJ1333JE — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | MC8641DHX1333JE | MC8641VU1333JE | MC8641HX1333JB | MC8640HX1067NE | MC8640VU1000HC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCCBGA (33x33 mm) | 1023-FCCBGA (33x33 mm) | 1023-FCCBGA (33x33 mm) | 1023-FCCBGA (33x33 mm) | 1023-FCCBGA (33x33 mm) | 1023-FCCBGA (33x33 mm) |
| Number of Cores | 2 (dual e600) | 2 (dual e600) | 1 (single e600) | 2 (dual e600) | 1 (single e600) | 1 (single e600) |
| Core Frequency | 1333 MHz | 1333 MHz | 1333 MHz | 1333 MHz | 1067 MHz | 1000 MHz |
| AltiVec SIMD | Yes (per core) | Yes (per core) | Yes | Yes (per core) | Yes | Yes |
| Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| Gigabit Ethernet | 2x GbE | 2x GbE | 2x GbE | 2x GbE | 2x GbE | 2x GbE |
| PCI Express | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | 0°C to +105°C | 0°C to +105°C | 0°C to +105°C | 0°C to +105°C | 0°C to +105°C | 0°C to +105°C |
Bảo phân biệt quan trọng
- Dual-core 1333 MHz in a single SoC at the same package footprint (vsMC8641VU1333JE)
- Aligned with the recommended NXP replacement roadmap (vsMC8640HX1067NE)
- AltiVec SIMD on both cores (vsMC8640VU1000HC)
Ghi chú thiết kế
The 1023-FCCBGA (33x33 mm) package of MC8641DVJ1333JE draws significant power under dual-core 1333 MHz load with DDR2 and SerDes active. Estimated: at VIN_typ operating conditions, sustained power is in the 15-25 W range (per NXP MPC8641D family thermal characterization). Use a heatsink or thermal interface material bonded to the package top, plus a 4-layer+ PCB with an inner ground/power plane stitching pattern under the ball grid. Maintain junction temperature below 105°C with adequate airflow.
Route SerDes lanes for PCI Express and Serial RapidIO with matched lengths per the NXP MPC8641D hardware design guide, keeping differential pair skew under 5 mils and reference to a continuous ground plane. Place decoupling capacitors as close as possible to each power pin (typically 0.1 µF X7R plus bulk polymer). Use blind/buried vias or microvias to break out the 1 mm-pitch FCCBGA ball grid; 4 mil trace/space is realistic on standard 0.5 oz copper. Stagger vias to escape the BGA in 2-3 rows.
Avoid substituting MC8641DVJ1333JE with MC8641VU1333JE on existing dual-core firmware images without re-validating SMP scheduling - the VU part is single-core and will hang on spinlocks. Ensure DDR2 DIMM topology matches the controller's defined ranks (refer to NXP MPC8641D reference manual); mismatched rank configuration causes intermittent training failures. Do not exceed the 0°C to +105°C operating temperature window in non-industrialized environments.
Thông tin tuân thủ
RoHS and REACH status not explicitly stated in the verified web data for this part; lead-free is standard for FCCBGA packaging. AEC-Q100 not applicable for a PowerPC SoC. Conflict-minerals compliance inferred from NXP's published CMRT filings. Refer to NXP product-change-notice documents for definitive compliance certificates.
