MC8641DVJ1333JE - Dual e600 SoC, 2x1333 MHz, Rev 3 | NXP Semiconductors
MPN： MC8641DVJ1333JE ⚠ 最後購買機會MC8641DVJ1333JE 概覽
What is a Power Architecture SoC? A Power Architecture SoC integrates one or more PowerPC CPU cores with memory controllers, high-speed serial interfaces, and peripheral IP onto a single chip. The e600 core uses the Power Architecture Book E instruction set, extends it with AltiVec SIMD, and is widely deployed in networking, storage, defense, and industrial embedded applications where deterministic performance and long-term software reuse matter more than raw peak clock speed. Within the broader taxonomy, MC8641DVJ1333JE sits as: e600 core -> PowerPC MPC86xx dual-core SoC -> 32-bit Power Architecture SoC -> embedded microprocessor -> integrated circuit.
Key device-level features include dual e600 cores at 1333 MHz with AltiVec SIMD, a 7-stage superscalar pipeline with three-issue dispatch, an integrated DDR1/DDR2 memory controller with ECC, dual Gigabit Ethernet MACs, PCI Express interface, Serial RapidIO (SRIO), and an operating temperature range of 0°C to +105°C for industrial-grade environments. The 1023-ball FCCBGA package exposes the full high-speed I/O complement while preserving signal integrity for multi-gigabit SerDes lanes.
Architecturally, the MPC8641D pairs two e600 cores with a shared L2 cache topology and a coherent fabric, enabling symmetric multiprocessing (SMP) on a single chip. Hardware virtualization helpers and a dedicated DMA engine accelerate packet processing in networking line cards, while AltiVec boosts DSP-class workloads such as voice transcoding, image manipulation, and cryptographic primitives in software. Compared with discrete CPU-plus-chipset designs, this SoC consolidates the memory controller and I/O bridge on-die, reducing board area, BOM cost, and power envelope for embedded platforms.
Typical applications include multi-service routers and switches (PCIe to SRIO fabric bridging), industrial automation controllers running VxWorks or Linux, military/aerospace compute modules requiring long-life silicon, RAID/NAS storage controllers with AltiVec-accelerated RAID parity, and defence-grade signal processing cards. The dual-core 1333 MHz configuration handles wire-speed packet inspection, encryption, and control-plane workloads on a single board.
When designing with this device, ensure the PCB supports 1023-ball BGA routing with matched-length SerDes lanes for PCI Express and Serial RapidIO. Provide adequate decoupling and thermal dissipation - the FCCBGA package requires a heatsink or cold plate under sustained load. Use NXP's board-support packages (BSP) and U-Boot for early bring-up.
直接替換替代品，適用於 MC8641DVJ1333JE — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MC8641DVJ1333JE （相同外形與佔位） — 差異在於 Ethernet, Package, Operating Temperature, Mounting Type, PCI Express.
MC8641DHX1333JE
✅ 直接替換聯絡詢價
查看資料表 →MC8641VU1333JE
✅ 直接替換聯絡詢價
查看資料表 →MC8641HX1333JB
✅ 直接替換📋 參考替代品（不在目錄中）
MC8640HX1067NE
✅ 直接替換📋 參考替代品（不在目錄中）
MC8640VU1000HC
✅ 直接替換📋 參考替代品（不在目錄中）
MC8641DVJ1333JE 最大額定值與電氣特性
| Core Architecture | PowerPC e600 (dual-core) |
| Number of Cores | 2 |
| Core Frequency | 1333 MHz |
| 資料匯流排寬度 | 32-bit |
| SIMD Extensions | AltiVec |
| Memory Controller | DDR1/DDR2 with ECC |
| Ethernet | 2x 10/100/1000 (Gigabit) MACs |
| PCI Express | Yes |
| Serial RapidIO (SRIO) | Yes |
| 工作溫度 | 0°C to +105°C |
| 封裝 | 1023-FCCBGA (33x33 mm) |
| 安裝類型 | Surface Mount |
| Silicon Revision | Rev 3 |
MC8641DVJ1333JE 1023-fccbga (33x33 mm) 腳位配置指南
MC8641DVJ1333JE（1023-fccbga (33x33 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MC8641DVJ1333JE.
請參閱 資料表 以查看完整腳位配置。
典型應用
MC8641DVJ1333JE 適用於 6 應用s: Multi-Service Routers and Switches, RAID / NAS Storage Controllers, Defense and Aerospace Compute Modules, Industrial Automation Controllers, Wireless Base Station Processing, Industrial Imaging and Surveillance Servers.
Multi-Service Routers and Switches
The MC8641DVJ1333JE dual e600 cores at 1333 MHz provide the symmetric multiprocessing headroom needed for simultaneous control-plane (routing daemon, OSPF/BGP) and data-plane (ACL, QoS classification, deep packet inspection) workloads on a single line card. Its integrated dual Gigabit Ethernet MACs feed packets directly to the cores, while the PCI Express fabric links to switch ASICs at multi-gigabit rates. Designers typically pair this SoC with a backplane SerDes for distributed chassis designs where throughput per slot is critical, avoiding the latency penalty of external CPU-plus-chipset implementations.
推薦
RAID / NAS Storage Controllers
The MC8641DVJ1333JE drives enterprise storage controllers where AltiVec SIMD accelerates RAID parity (XOR, Reed-Solomon) calculations in software, freeing dedicated hardware RAID engines for higher-tier arrays. The dual e600 cores share the workload between host-side protocol offload (iSCSI, NFS, SMB) and storage-side RAID processing. DDR2 ECC memory directly attached to the on-die controller provides the bandwidth needed for streaming reads/writes, while PCI Express links to SAS/SATA controllers at line rate. For long-life storage platforms, the part's longevity track record under VxWorks/Linux is well documented.
推薦
Defense and Aerospace Compute Modules
The MC8641DVJ1333JE is widely deployed in defense and aerospace embedded systems where long-life silicon, industrial-grade temperature range (0°C to +105°C), and long-term BSP support from vendors such as Curtiss-Wright and Mercury Systems are contractual requirements. Its dual e600 cores with AltiVec handle signal intelligence (SIGINT), image exploitation, and electronic-warfare workloads on ruggedized VME/VPX boards. Designers benefit from NXP's documented errata history and a mature VxWorks SMP software ecosystem under DO-178C / MIL-STD qualification flows for safety-critical defense platforms.
推薦
Industrial Automation Controllers
The MC8641DVJ1333JE serves as the central controller in industrial automation platforms running real-time Linux or VxWorks, where deterministic response times and AltiVec-driven signal processing (motor control loop FIR, FFT for vibration analysis) meet factory-floor expectations. The dual e600 cores isolate the real-time control thread from user-space HMI workloads on the same chip, reducing latency versus dual-chip designs. The integrated DDR2 controller with ECC withstands industrial EMI environments, while the Serial RapidIO ports bridge to deterministic motion-control DSP slaves across rugged backplanes.
推薦
Wireless Base Station Processing
The MC8641DVJ1333JE powers base-station compute cards where dual e600 cores at 1333 MHz execute L2/L3 protocol stacks, encryption/decryption, and packet scheduling while AltiVec handles voice codec pools via SIMD. The PCI Express and Serial RapidIO fabric integrates cleanly with baseband ASICs and radio-front-end modules. DDR2-800 ECC memory satisfies the bandwidth profile of multi-carrier LTE processing. The part's documented 0°C to +105°C operating range covers outdoor cabinet deployments.
推薦
Industrial Imaging and Surveillance Servers
The MC8641DVJ1333JE drives industrial video surveillance servers and medical imaging appliance compute, where AltiVec accelerates H.264/H.265 entropy decoding, JPEG2000 wavelet transforms, and FFT-based image registration. The dual-core 1333 MHz configuration handles 4 to 8 streams of HD video concurrently with motion detection analytics, while PCI Express connects to GPU co-processors or capture cards. ECC DDR2 protects frame buffers against soft errors in 24/7 always-on surveillance environments where downtime is unacceptable.
推薦
推薦產品摘要
工程參考資料，適用於 MC8641DVJ1333JE — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MC8641DHX1333JE | MC8641VU1333JE | MC8641HX1333JB | MC8640HX1067NE | MC8640VU1000HC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCCBGA (33x33 mm) | 1023-FCCBGA (33x33 mm) | 1023-FCCBGA (33x33 mm) | 1023-FCCBGA (33x33 mm) | 1023-FCCBGA (33x33 mm) | 1023-FCCBGA (33x33 mm) |
| Number of Cores | 2 (dual e600) | 2 (dual e600) | 1 (single e600) | 2 (dual e600) | 1 (single e600) | 1 (single e600) |
| Core Frequency | 1333 MHz | 1333 MHz | 1333 MHz | 1333 MHz | 1067 MHz | 1000 MHz |
| AltiVec SIMD | Yes (per core) | Yes (per core) | Yes | Yes (per core) | Yes | Yes |
| Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| Gigabit Ethernet | 2x GbE | 2x GbE | 2x GbE | 2x GbE | 2x GbE | 2x GbE |
| PCI Express | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | 0°C to +105°C | 0°C to +105°C | 0°C to +105°C | 0°C to +105°C | 0°C to +105°C | 0°C to +105°C |
主要差異化特點
- Dual-core 1333 MHz in a single SoC at the same package footprint (對比MC8641VU1333JE)
- Aligned with the recommended NXP replacement roadmap (對比MC8640HX1067NE)
- AltiVec SIMD on both cores (對比MC8640VU1000HC)
設計說明
The 1023-FCCBGA (33x33 mm) package of MC8641DVJ1333JE draws significant power under dual-core 1333 MHz load with DDR2 and SerDes active. Estimated: at VIN_typ operating conditions, sustained power is in the 15-25 W range (per NXP MPC8641D family thermal characterization). Use a heatsink or thermal interface material bonded to the package top, plus a 4-layer+ PCB with an inner ground/power plane stitching pattern under the ball grid. Maintain junction temperature below 105°C with adequate airflow.
Route SerDes lanes for PCI Express and Serial RapidIO with matched lengths per the NXP MPC8641D hardware design guide, keeping differential pair skew under 5 mils and reference to a continuous ground plane. Place decoupling capacitors as close as possible to each power pin (typically 0.1 µF X7R plus bulk polymer). Use blind/buried vias or microvias to break out the 1 mm-pitch FCCBGA ball grid; 4 mil trace/space is realistic on standard 0.5 oz copper. Stagger vias to escape the BGA in 2-3 rows.
Avoid substituting MC8641DVJ1333JE with MC8641VU1333JE on existing dual-core firmware images without re-validating SMP scheduling - the VU part is single-core and will hang on spinlocks. Ensure DDR2 DIMM topology matches the controller's defined ranks (refer to NXP MPC8641D reference manual); mismatched rank configuration causes intermittent training failures. Do not exceed the 0°C to +105°C operating temperature window in non-industrialized environments.
合規資訊
RoHS and REACH status not explicitly stated in the verified web data for this part; lead-free is standard for FCCBGA packaging. AEC-Q100 not applicable for a PowerPC SoC. Conflict-minerals compliance inferred from NXP's published CMRT filings. Refer to NXP product-change-notice documents for definitive compliance certificates.
