MPC8313ECVRADDB - PowerQUICC II Pro MPU, 267MHz, 516-TEPBGA | NXP
MPN: MPC8313ECVRADDB ⚠ Lần mua cuốiMPC8313ECVRADDB Tóm tắt
An MPU (microprocessor unit) in the PowerQUICC family is an integrated communications processor that combines a CPU core with peripheral controllers such as Ethernet MACs, UARTs, I2C, SPI, and DDR memory controllers. The MPC8313E belongs to the PowerQUICC II Pro hierarchy: MPU -> communications processor -> embedded processor -> integrated circuit. This places it firmly in the networking-infrastructure tier of NXP's portfolio, optimized for low-cost, low-power secure routers, NAS appliances, and industrial gateways.
Key features include a 16 KB instruction cache and 16 KB data cache with Harvard architecture, hardware encryption (DES, 3DES, AES, SHA-1/MD5, ARC4), dual 10/100/1000 Ethernet MACs via the TSEC interface, DDR1/DDR2 memory controller, PCI Express and PCI interfaces, plus USB 2.0 (host/device). The on-chip security engine offloads crypto from the e300c3 core, freeing CPU cycles for protocol processing.
Architecturally, the MPC8313E uses a 90 nm CMOS process and pairs the e300c3 core with a high-bandwidth internal bus (the coherency module) that ties together the SEC, Ethernet, DDR, and local-bus peripherals. The integrated QUICC Engine technology (inherited from the PowerQUICC lineage) handles common serial protocols including HDLC, TDM, and ATM. Compared with discrete CPU-plus-ASIC designs, the MPC8313E reduces BOM cost and PCB area while maintaining deterministic real-time behavior.
Typical applications include home gateways and SOHO routers with VPN/IPsec, networked attached storage (NAS) controllers, secure industrial control gateways, factory-floor protocol converters (Modbus/TCP, PROFINET), and embedded firewalls. The encryption accelerator is particularly valuable for any application that must terminate IPsec, SSL/TLS, or MACsec tunnels at line rate without burdening the application CPU.
Designers should plan thermal dissipation for the 27x27 mm BGA using a 4-6 layer board with a continuous ground plane under the package. The DDR reference clock and Ethernet MII/RGMII traces require controlled impedance routing (50 ohm single-ended, 100 ohm differential). Bootstrap configuration pins sampled at POR determine boot source, CPU-to-bus clock ratio, and endian mode and must be pulled high or low through 4.7 kohm resistors.
This page consolidates distributor pricing, drop-in alternatives, and engineering design notes beyond what is presented in the NXP hardware datasheet, giving procurement and design engineers a single source for part selection.
Bộ thay thế dễ dàng lắp đặt cho MPC8313ECVRADDB — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với MPC8313ECVRADDB (cùng hình factor và footprint) — khác nhau ở Memory Controller, USB, Core Architecture, Encryption, Ethernet.
MPC8313EVRAGDGA
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MPC8313CVRADDB
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MPC8315ECVRAGDGA
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MPC8313ECVRAGDGA
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MPC8358EVRAGDGA
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MPC8313ECVRADDB Tỷ lệ tối đa & tính chất điện
| Processor Type | PowerPC e300c3, MPC83xx PowerQUICC II Pro |
| Core Architecture | 32-bit RISC, single core |
| Maximum CPU Clock | 267 MHz |
| Cache (I-cache / D-cache) | 16 KB / 16 KB |
| Security Accelerator | SEC 2.x (DES, 3DES, AES, SHA-1, MD5, ARC4) |
| Ethernet MAC | 2x 10/100/1000 (TSEC) |
| Memory Controller | DDR1/DDR2 with ECC |
| PCI Express / PCI | 1x PCIe + 1x PCI 2.3 |
| USB | USB 2.0 (host/device) |
| I/O Voltage | 1.8 V / 2.5 V / 3.3 V |
| Core Voltage | 0.95 V to 1.05 V |
| Nhiệt độ hoạt động | -40C to +105C (industrial) |
| Hộp / Vỏ | 516-TEPBGA, 27x27 mm |
| Kiểu lắp đặt | Surface Mount |
| Lead Free Status | Lead Free |
| Process Technology | 90 nm CMOS |
| Cấp MSL | 3 |
| Trạng thái RoHS | Compliant (per DigiKey listing) |
Hướng dẫn cấu hình chân MPC8313ECVRADDB 516-tepbga, 27x27 mm
Cấu hình chân cho MPC8313ECVRADDB (516-tepbga, 27x27 mm gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho MPC8313ECVRADDB.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
MPC8313ECVRADDB phù hợp cho 6 Áp dụngs: Secure SOHO / Branch-Office Router, Network Attached Storage (NAS) Controller, Industrial Protocol Gateway, Embedded VPN / IPsec Appliance, VoIP / Unified Communications Gateway, Smart Grid / Energy Management Gateway.
Secure SOHO / Branch-Office Router
The MPC8313ECVRADDB's integrated SEC 2.x accelerator offloads IPsec and SSL/TLS from the e300c3 core, allowing a single MPU to terminate site-to-site VPN tunnels at line rate. The two integrated 10/100/1000 TSEC Ethernet MACs map directly to a WAN port and a LAN switch fabric, while the PCIe link drives an external 802.11ac or LTE modem. DDR2 with ECC supports large connection-state tables. Designers typically pair it with NXP's TWR-MPC8313 reference design and a Linux BSP that includes the openswan/strongSwan IPsec stack.
Được đề xuất
Network Attached Storage (NAS) Controller
The MPC8313ECVRADDB acts as the main system-on-chip for entry-level NAS appliances: the e300c3 core runs the Linux NAS stack (Samba, NFS, DLNA), the dual TSEC lanes drive redundant Gigabit LAN ports, and the local bus connects to SATA controllers via a PCIe bridge. The DDR2 controller with ECC protects file-system metadata from bit-flips in always-on deployments. SEC 2.x hardware-accelerated AES enables encrypted volumes (LUKS) with minimal throughput penalty.
Được đề xuất
Industrial Protocol Gateway
Industrial protocol converters benefit from the MPC8313ECVRADDB's dual Ethernet MACs and PCI/PCIe expansion for fieldbus cards (Profibus, CAN, RS-485). The e300c3 core runs real-time Linux (PREEMPT_RT) translating Modbus/TCP to PROFINET or EtherNet/IP, while the SEC engine authenticates remote maintenance sessions. The -40C to +105C industrial temperature grade and 27x27 mm BGA's robust thermal pad suit sealed control-cabinet mounting. Long-term NXP/Freescale BSP availability is critical for 10+ year industrial product lifecycles.
Được đề xuất
Embedded VPN / IPsec Appliance
Dedicated IPsec appliances leverage the MPC8313ECVRADDB's SEC 2.x hardware engine to sustain AES-256/SHA-128 throughput well above what the e300c3 core could achieve in software. The dual Gigabit MACs are bridged between the WAN and LAN zones; iptables/nftables with strongSwan run on the main CPU. The PCIe x1 lane supports a hardware random-number generator for key generation, while the local bus connects to flash and EEPROM for key storage. Hardware root-of-trust is enhanced by NXP's tamper-detection pins.
Được đề xuất
VoIP / Unified Communications Gateway
The MPC8313ECVRADDB's combination of TSEC Gigabit Ethernet, PCI for DSP expansion cards, and the SEC engine for SRTP/TLS media encryption makes it a strong platform for small-to-medium VoIP gateways. The e300c3 core at 267 MHz is sufficient to handle SIP signaling, codec transcoding (via offloaded DSP), and the encrypted media stream. The DDR2 controller buffers jitter-sensitive RTP packets, and the local bus connects to a TDM/E1 framer for legacy PBX integration via the QUICC-compatible TDM interface.
Được đề xuất
Smart Grid / Energy Management Gateway
Smart-meter data concentrators and substation gateways benefit from the MPC8313ECVRADDB's industrial temperature grade, hardware AES/SHA accelerators for DLMS/COSEM security, and the dual Ethernet MACs for redundant grid-side and customer-side connections. The PCI/PCIe expansion slots accommodate cellular modems for backhaul. The DDR2 with ECC is essential for long-term data integrity of billing and event logs. NXP's long-term support and reference designs for IEC 61850-3 environments accelerate certification.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho MPC8313ECVRADDB — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | MPC8313EVRAGDGA | MPC8313CVRADDB | MPC8315ECVRAGDGA | MPC8313ECVRAGDGA | MPC8358EVRAGDGA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-TEPBGA (27x27 mm) | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same |
| Maximum CPU Clock | 267 MHz | 400 MHz | 267 MHz | 333/400 MHz | 400 MHz | 400 MHz |
| Hardware Encryption (SEC 2.x) | Yes | Yes | No | Yes | Yes | Yes |
| Core Architecture | e300c3 | e300c3 | e300c3 | e300c3 | e300c3 | e300c4 (with QUICC Engine) |
| Ethernet MACs (TSEC) | 2x 10/100/1000 | 2x 10/100/1000 | 2x 10/100/1000 | 2-3x 10/100/1000 | 2x 10/100/1000 | 2x 10/100/1000 + UCC |
| Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR2/DDR3 | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| Operating Temperature | -40C to +105C (Industrial) | -40C to +105C (Industrial) | -40C to +105C (Industrial) | -40C to +105C (Industrial) | -40C to +105C (Industrial) | -40C to +105C (Industrial) |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
Bảo phân biệt quan trọng
- Hardware SEC 2.x encryption accelerator at a cost-optimized price point (vsMPC8313CVRADDB)
- Mature 267 MHz speed grade with broader long-term support than higher bins (vsMPC8313EVRAGDGA)
- Best-in-class integration for cost-sensitive secure gateways (vsMPC8358EVRAGDGA)
Ghi chú thiết kế
The 516-TEPBGA 27x27 mm package with 1.0 mm pitch requires a minimum 6-layer PCB stack-up with laser-drilled microvias to fan out the inner-ball rows. Place a continuous ground plane on the layer directly beneath the package top side and stitch thermal vias (0.3 mm drill, 0.5 mm pad, 1.0 mm pitch) directly to the exposed die pad. Match DDR2 data, address, and clock trace lengths within 50 mils and route 50 ohm single-ended / 100 ohm differential.
Estimated: at Vcore=1.0 V, TDP for the MPC8313E at 267 MHz is approximately 1.5-2.0 W (typical application), with junction-to-ambient theta_JA near 18 C/W on a JEDEC 4-layer test board. Designers should compute P = V x I from real workload measurements and ensure the thermal pad connects to an inner copper pour of at least 1 sq inch to keep Tj below 105C in sealed enclosures.
Bootstrap configuration pins (cfg_reset, cfg_boot_seq, cfg_rom_loc, cfg_core_ratio) must be pulled high or low through 4.7 kohm resistors during power-on reset and remain stable for 100 cycles of the system clock. Floating cfg pins are a frequent cause of boot failure. Also ensure the DDR2 reference clock has its PLL loop filter components within 1 cm of the corresponding analog supply pin and that the DDR compensation pin is tied to a 240 ohm 1% resistor to ground.
The MPC8313ECVRADDB requires three independent supply rails: VDD_CORE (1.0 V), VDD_DDR (1.8 V or 2.5 V), and VDD_IO (3.3 V or 2.5 V). Sequence VDD_CORE last during power-up and first during power-down to avoid in-rush current through the I/O cells. Place 22 uF bulk + 0.1 uF + 10 nF ceramic decoupling within 5 mm of each supply pin pair, and isolate the analog PLL supply (VDD_PLL) with a ferrite bead and dedicated LDO.
Thông tin tuân thủ
RoHS and REACH compliant per DigiKey listing and NXP material declaration. Industrial temperature grade (not automotive AEC-Q100). Halogen-free status not explicitly listed in distributor records.
