MPC8313ECVRADDB - PowerQUICC II Pro MPU, 267MHz, 516-TEPBGA | NXP
부품 번호: MPC8313ECVRADDB ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $64.95 | $6,495.00 |
| 250 | $60.1 | $15,025.00 |
| 500 | $56.4 | $28,200.00 |
| 1,000 | $52.85 | $52,850.00 |
MPC8313ECVRADDB 개요
An MPU (microprocessor unit) in the PowerQUICC family is an integrated communications processor that combines a CPU core with peripheral controllers such as Ethernet MACs, UARTs, I2C, SPI, and DDR memory controllers. The MPC8313E belongs to the PowerQUICC II Pro hierarchy: MPU -> communications processor -> embedded processor -> integrated circuit. This places it firmly in the networking-infrastructure tier of NXP's portfolio, optimized for low-cost, low-power secure routers, NAS appliances, and industrial gateways.
Key features include a 16 KB instruction cache and 16 KB data cache with Harvard architecture, hardware encryption (DES, 3DES, AES, SHA-1/MD5, ARC4), dual 10/100/1000 Ethernet MACs via the TSEC interface, DDR1/DDR2 memory controller, PCI Express and PCI interfaces, plus USB 2.0 (host/device). The on-chip security engine offloads crypto from the e300c3 core, freeing CPU cycles for protocol processing.
Architecturally, the MPC8313E uses a 90 nm CMOS process and pairs the e300c3 core with a high-bandwidth internal bus (the coherency module) that ties together the SEC, Ethernet, DDR, and local-bus peripherals. The integrated QUICC Engine technology (inherited from the PowerQUICC lineage) handles common serial protocols including HDLC, TDM, and ATM. Compared with discrete CPU-plus-ASIC designs, the MPC8313E reduces BOM cost and PCB area while maintaining deterministic real-time behavior.
Typical applications include home gateways and SOHO routers with VPN/IPsec, networked attached storage (NAS) controllers, secure industrial control gateways, factory-floor protocol converters (Modbus/TCP, PROFINET), and embedded firewalls. The encryption accelerator is particularly valuable for any application that must terminate IPsec, SSL/TLS, or MACsec tunnels at line rate without burdening the application CPU.
Designers should plan thermal dissipation for the 27x27 mm BGA using a 4-6 layer board with a continuous ground plane under the package. The DDR reference clock and Ethernet MII/RGMII traces require controlled impedance routing (50 ohm single-ended, 100 ohm differential). Bootstrap configuration pins sampled at POR determine boot source, CPU-to-bus clock ratio, and endian mode and must be pulled high or low through 4.7 kohm resistors.
This page consolidates distributor pricing, drop-in alternatives, and engineering design notes beyond what is presented in the NXP hardware datasheet, giving procurement and design engineers a single source for part selection.
드롭인 대체품: MPC8313ECVRADDB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8313ECVRADDB (동일 폼 팩터 및 풋프린트) — 차이점: Memory Controller, USB, Core Architecture, Encryption, Ethernet.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8313EVRAGDGA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8313CVRADDB
✅ 드롭인✓ 재고 있음
$24.6 / 개
데이터시트 보기 →MPC8315ECVRAGDGA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8313ECVRAGDGA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8358EVRAGDGA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8313ECVRADDB 최대 정격 & 전기적 특성
| Processor Type | PowerPC e300c3, MPC83xx PowerQUICC II Pro |
| Core Architecture | 32-bit RISC, single core |
| Maximum CPU Clock | 267 MHz |
| Cache (I-cache / D-cache) | 16 KB / 16 KB |
| Security Accelerator | SEC 2.x (DES, 3DES, AES, SHA-1, MD5, ARC4) |
| Ethernet MAC | 2x 10/100/1000 (TSEC) |
| Memory Controller | DDR1/DDR2 with ECC |
| PCI Express / PCI | 1x PCIe + 1x PCI 2.3 |
| USB | USB 2.0 (host/device) |
| I/O Voltage | 1.8 V / 2.5 V / 3.3 V |
| Core Voltage | 0.95 V to 1.05 V |
| 동작 온도 | -40C to +105C (industrial) |
| 패키지 / 케이스 | 516-TEPBGA, 27x27 mm |
| 실장 유형 | Surface Mount |
| Lead Free Status | Lead Free |
| Process Technology | 90 nm CMOS |
| MSL 레벨 | 3 |
| RoHS 상태 | Compliant (per DigiKey listing) |
MPC8313ECVRADDB 516-tepbga, 27x27 mm 핀 구성 가이드
MPC8313ECVRADDB(516-tepbga, 27x27 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8313ECVRADDB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8313ECVRADDB 적합 용도: 6 애플리케이션s: Secure SOHO / Branch-Office Router, Network Attached Storage (NAS) Controller, Industrial Protocol Gateway, Embedded VPN / IPsec Appliance, VoIP / Unified Communications Gateway, Smart Grid / Energy Management Gateway.
Secure SOHO / Branch-Office Router
The MPC8313ECVRADDB's integrated SEC 2.x accelerator offloads IPsec and SSL/TLS from the e300c3 core, allowing a single MPU to terminate site-to-site VPN tunnels at line rate. The two integrated 10/100/1000 TSEC Ethernet MACs map directly to a WAN port and a LAN switch fabric, while the PCIe link drives an external 802.11ac or LTE modem. DDR2 with ECC supports large connection-state tables. Designers typically pair it with NXP's TWR-MPC8313 reference design and a Linux BSP that includes the openswan/strongSwan IPsec stack.
추천
Network Attached Storage (NAS) Controller
The MPC8313ECVRADDB acts as the main system-on-chip for entry-level NAS appliances: the e300c3 core runs the Linux NAS stack (Samba, NFS, DLNA), the dual TSEC lanes drive redundant Gigabit LAN ports, and the local bus connects to SATA controllers via a PCIe bridge. The DDR2 controller with ECC protects file-system metadata from bit-flips in always-on deployments. SEC 2.x hardware-accelerated AES enables encrypted volumes (LUKS) with minimal throughput penalty.
추천
Industrial Protocol Gateway
Industrial protocol converters benefit from the MPC8313ECVRADDB's dual Ethernet MACs and PCI/PCIe expansion for fieldbus cards (Profibus, CAN, RS-485). The e300c3 core runs real-time Linux (PREEMPT_RT) translating Modbus/TCP to PROFINET or EtherNet/IP, while the SEC engine authenticates remote maintenance sessions. The -40C to +105C industrial temperature grade and 27x27 mm BGA's robust thermal pad suit sealed control-cabinet mounting. Long-term NXP/Freescale BSP availability is critical for 10+ year industrial product lifecycles.
추천
Embedded VPN / IPsec Appliance
Dedicated IPsec appliances leverage the MPC8313ECVRADDB's SEC 2.x hardware engine to sustain AES-256/SHA-128 throughput well above what the e300c3 core could achieve in software. The dual Gigabit MACs are bridged between the WAN and LAN zones; iptables/nftables with strongSwan run on the main CPU. The PCIe x1 lane supports a hardware random-number generator for key generation, while the local bus connects to flash and EEPROM for key storage. Hardware root-of-trust is enhanced by NXP's tamper-detection pins.
추천
VoIP / Unified Communications Gateway
The MPC8313ECVRADDB's combination of TSEC Gigabit Ethernet, PCI for DSP expansion cards, and the SEC engine for SRTP/TLS media encryption makes it a strong platform for small-to-medium VoIP gateways. The e300c3 core at 267 MHz is sufficient to handle SIP signaling, codec transcoding (via offloaded DSP), and the encrypted media stream. The DDR2 controller buffers jitter-sensitive RTP packets, and the local bus connects to a TDM/E1 framer for legacy PBX integration via the QUICC-compatible TDM interface.
추천
Smart Grid / Energy Management Gateway
Smart-meter data concentrators and substation gateways benefit from the MPC8313ECVRADDB's industrial temperature grade, hardware AES/SHA accelerators for DLMS/COSEM security, and the dual Ethernet MACs for redundant grid-side and customer-side connections. The PCI/PCIe expansion slots accommodate cellular modems for backhaul. The DDR2 with ECC is essential for long-term data integrity of billing and event logs. NXP's long-term support and reference designs for IEC 61850-3 environments accelerate certification.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8313ECVRADDB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8313EVRAGDGA | MPC8313CVRADDB | MPC8315ECVRAGDGA | MPC8313ECVRAGDGA | MPC8358EVRAGDGA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-TEPBGA (27x27 mm) | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same |
| Maximum CPU Clock | 267 MHz | 400 MHz | 267 MHz | 333/400 MHz | 400 MHz | 400 MHz |
| Hardware Encryption (SEC 2.x) | Yes | Yes | No | Yes | Yes | Yes |
| Core Architecture | e300c3 | e300c3 | e300c3 | e300c3 | e300c3 | e300c4 (with QUICC Engine) |
| Ethernet MACs (TSEC) | 2x 10/100/1000 | 2x 10/100/1000 | 2x 10/100/1000 | 2-3x 10/100/1000 | 2x 10/100/1000 | 2x 10/100/1000 + UCC |
| Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR2/DDR3 | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| Operating Temperature | -40C to +105C (Industrial) | -40C to +105C (Industrial) | -40C to +105C (Industrial) | -40C to +105C (Industrial) | -40C to +105C (Industrial) | -40C to +105C (Industrial) |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
주요 차별점
- Hardware SEC 2.x encryption accelerator at a cost-optimized price point (vs MPC8313CVRADDB)
- Mature 267 MHz speed grade with broader long-term support than higher bins (vs MPC8313EVRAGDGA)
- Best-in-class integration for cost-sensitive secure gateways (vs MPC8358EVRAGDGA)
설계 노트
The 516-TEPBGA 27x27 mm package with 1.0 mm pitch requires a minimum 6-layer PCB stack-up with laser-drilled microvias to fan out the inner-ball rows. Place a continuous ground plane on the layer directly beneath the package top side and stitch thermal vias (0.3 mm drill, 0.5 mm pad, 1.0 mm pitch) directly to the exposed die pad. Match DDR2 data, address, and clock trace lengths within 50 mils and route 50 ohm single-ended / 100 ohm differential.
Estimated: at Vcore=1.0 V, TDP for the MPC8313E at 267 MHz is approximately 1.5-2.0 W (typical application), with junction-to-ambient theta_JA near 18 C/W on a JEDEC 4-layer test board. Designers should compute P = V x I from real workload measurements and ensure the thermal pad connects to an inner copper pour of at least 1 sq inch to keep Tj below 105C in sealed enclosures.
Bootstrap configuration pins (cfg_reset, cfg_boot_seq, cfg_rom_loc, cfg_core_ratio) must be pulled high or low through 4.7 kohm resistors during power-on reset and remain stable for 100 cycles of the system clock. Floating cfg pins are a frequent cause of boot failure. Also ensure the DDR2 reference clock has its PLL loop filter components within 1 cm of the corresponding analog supply pin and that the DDR compensation pin is tied to a 240 ohm 1% resistor to ground.
The MPC8313ECVRADDB requires three independent supply rails: VDD_CORE (1.0 V), VDD_DDR (1.8 V or 2.5 V), and VDD_IO (3.3 V or 2.5 V). Sequence VDD_CORE last during power-up and first during power-down to avoid in-rush current through the I/O cells. Place 22 uF bulk + 0.1 uF + 10 nF ceramic decoupling within 5 mm of each supply pin pair, and isolate the analog PLL supply (VDD_PLL) with a ferrite bead and dedicated LDO.
규정 준수 정보
RoHS and REACH compliant per DigiKey listing and NXP material declaration. Industrial temperature grade (not automotive AEC-Q100). Halogen-free status not explicitly listed in distributor records.
