NXP Semiconductors

TJF1051T/3 - High-Speed CAN Transceiver 8-SO | NXP

MPN: TJF1051T/3 ✓ Hoạt động
4.5 V to 5.5 V Vdss 8-SOIC (SO-8), 3.90 mm body width Package
MOQ: 1 |

TJF1051T/3 Tóm tắt

The NXP Semiconductors TJF1051T/3 is a high-speed Controller Area Network (CAN) transceiver that implements the ISO 11898-2:2016 physical layer, providing the physical medium interface between a CAN protocol controller and the differential CAN bus. Packaged in an 8-pin SO (SOIC-8), the part delivers up to 1 Mbps classic CAN data rate and supports CAN FD (Flexible Data-rate) frames in networks where higher payload bandwidth is required. A dedicated VIO supply pin on TJF1051T/3 lets the digital pins (TXD, RXD, S) interface directly to microcontrollers powered from 3.3 V, 1.8 V, or 5 V rails without external level shifters.

A CAN transceiver is a physical-layer interface IC that converts the single-ended transmit/receive logic of a CAN controller into the differential dominant/recessive signaling used on the CAN bus, while also providing bus fault protection, ESD tolerance, and common-mode rejection. Within the broader system hierarchy, the CAN transceiver sits between the protocol controller (typically a microcontroller with a CAN module) and the wired bus; it is a member of the in-vehicle networking IC category under power management and interface functions. Compared to lower-speed LIN or RS-485 transceivers, CAN parts like the TJF1051T/3 emphasize deterministic real-time behavior, multi-node arbitration, and automotive-grade robustness.

Key features include a low-current standby and silent mode with wake-up capability, ±8 kV HBM ESD on the bus pins, ±36 V bus fault tolerance on CANH/CANL, and an integrated VIO level shifter. The device operates over the automotive -40 °C to +125 °C junction range and meets the EMC and transient requirements defined by ISO 11898-2:2016.

The architecture combines a low-drop voltage regulator for the VIO domain, a differential driver with controlled slew rate, and a high-CMRR differential receiver. Internal thermal shutdown protects against bus short-to-battery or short-to-ground events, and the Silent mode (S pin) lets the controller put the part into a low-Iq state without losing bias on the bus.

Common applications include automotive body control modules, CAN gateway nodes, industrial CAN-FD sensor hubs, and any MCU-based system that needs an ISO 11898-compliant differential bus driver. A typical design routes TXD/RXDC straight into a STM32 or S32K microcontroller CAN module with VIO tied to the MCU's logic rail.

The primary design consideration is bus termination: place 120 Ω termination at each end of the bus and keep the split stub to the TJF1051T/3 short to preserve signal integrity at 1 Mbps and above. Decoupling on VCC and VIO with 100 nF ceramic capacitors placed within a few millimeters of the pins is required for EMC compliance.

This page aggregates distributor pricing, drop-in-compatible alternative part numbers, and practical EMC/layout design notes that go beyond the manufacturer datasheet summary, helping engineers select, source, and qualify the TJF1051T/3 with confidence.

Bộ thay thế dễ dàng lắp đặt cho TJF1051T/3 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với TJF1051T/3 (cùng hình factor và footprint) — khác nhau ở Package, Protocol, Operating Temperature, Data Rate, Product Type.

Texas Instruments
Package: 8-pin SOIC (DRB)
Protocol: CAN, CAN FD
Operating Temperature: -40 C to +125 C
NXP Semiconductors
Package: SO-8 (8-pin SOIC)
Operating Temperature: -40C to +125C
Data Rate: Up to 1 Mbit/s
NXP Semiconductors
Package: SO-8 (SOIC-8)
Protocol: CAN 2.0A/B, ISO 11898-2:2003, ISO 11898-5:2007, ISO 11898-2:2016
Operating Temperature: -40C to +125C
NXP Semiconductors
Package: 16-SOIC (7.50 mm width, 0.295 inch)
Protocol: CAN 2.0A/2.0B, CAN FD
Operating Temperature: -40C to +125C
Infineon
Package: PG-DSO-8
Microchip Technology
Package: 48-pin QFN (6x6 mm)
Product Type: Single-port Gigabit Ethernet Copper PHY

TJA1051T/3/1

✅ Drop-In
NXP Semiconductors
📦 8-SOIC (SO-8)
High-speed CAN transceiver · Up to 1 Mbit/s · 4.5 V to 5.5 V · 3 V to 5 V · Classical CAN, CAN FD · Half duplex, 1 driver / 1 receiver · SO-8 (8-pin SOIC) · Surface Mount

✓ Còn hàng

$0.4102 / Đơn vị

Xem tài liệu →

TJF1051T

✅ Drop-In
📦 8-SOIC (SO-8)
Same die and footprint, but no VIO pin (assumes 5 V logic only)

📋 Tham chiếu thay thế (không có trong danh mục)

TJA1051T/3/1

✅ Drop-In
NXP Semiconductors
📦 8-SOIC (SO-8)
High-speed CAN transceiver · Up to 1 Mbit/s · 4.5 V to 5.5 V · 3 V to 5 V · Classical CAN, CAN FD · Half duplex, 1 driver / 1 receiver · SO-8 (8-pin SOIC) · Surface Mount

✓ Còn hàng

$0.4102 / Đơn vị

Xem tài liệu →

TCAN1044DRQ1

✅ Drop-In
Texas Instruments
📦 8-SOIC (SO-8)
CAN, CAN FD · 1/1 · 8 Mbps · 4.5 V to 5.5 V · -58 V to +58 V · -2 V to +7 V (per ISO 11898-2:2016) · -40 C to +125 C · 8-pin SOIC (DRB)

Liên hệ để biết giá

Xem tài liệu →

NCV7342D10R2G

✅ Drop-In
📦 8-SOIC (SO-8)
Same SO-8 footprint, AEC-Q100, ISO 11898-2; no VIO pin, classic CAN up to 1 Mbps

📋 Tham chiếu thay thế (không có trong danh mục)

TLE9251V

✅ Drop-In
📦 8-DSO
Same 8-pin DSO footprint, CAN FD, ISO 11898-2:2016; 5 V VCC only (no VIO pin)

📋 Tham chiếu thay thế (không có trong danh mục)

TJF1051T/3 Thông số kỹ thuật

Protocol CAN, CAN FD (ISO 11898-2:2016)
Tốc độ dữ liệu Up to 1 Mbps (classic CAN)
Number of Drivers/Receivers 1/1 (Half duplex)
Supply Voltage VCC 4.5 V to 5.5 V
I/O Supply Voltage VIO 2.8 V to 5.5 V (TJF1051T/3 only)
Bus Fault Tolerance ±36 V on CANH/CANL
ESD Protection (HBM, bus pins) ±8 kV
Nhiệt độ hoạt động -40 °C to +125 °C
Silent / Standby Mode Yes (S pin, active-low silent)
Wake-up Capability Via bus / local wake-up (per VIO variant)
Hộp 8-SOIC (SO-8), 3.90 mm body width
Kiểu lắp đặt Surface Mount (Gull-wing)
Cấp MSL 1 (per JEDEC J-STD-020)
Trạng thái RoHS Compliant
Temperature Grade Industrial / Automotive extended

Cấu hình chân TJF1051T/3

SOIC-8 Package Pinout Diagram SOIC-8 8-pin small outline IC, 3.9x4.9mm, P1.27mm, JEDEC MS-012. 1 8 2 7 3 6 4 5 SOIC-8
Chân 1 TXD — Transmit data input from CAN controller (to VIO logic level on /3 variant)
Chân 2 GND — Ground
Chân 3 VCC — 5 V supply for bus driver domain
Chân 4 RXD — Receive data output to CAN controller (VIO-level on /3 variant)
Chân 5 VIO — I/O level adapter supply (TJF1051T/3 only); tied to MCU logic rail
Chân 6 CANL — Low-level CAN bus line
Chân 7 CANH — High-level CAN bus line
Chân 8 S — Silent mode control input (active-low; high = normal, low = silent)

Ứng dụng tiêu biểu

TJF1051T/3 phù hợp cho 7 Áp dụngs: Automotive Body Control Module (BCM), CAN-FD Industrial Sensor Hub, EV Battery Management System (BMS) Master, CAN Gateway / Telematics Control Unit, Agricultural and Off-Highway Vehicle ECU, Medical Device CAN-Bus Backbone, Industrial PLC CANopen Module.

🚗

Automotive Body Control Module (BCM)

The TJF1051T/3 sits between an S32K or other automotive MCU's CAN module and the vehicle's body CAN bus, providing the differential physical layer that drives window, mirror, lighting, and door-lock nodes. Its ±36 V bus-fault tolerance and ±8 kV HBM ESD rating on CANH/CANL protect the BCM against jump-start transients and hot-plug events during end-of-line testing. The integrated VIO pin level-shifts cleanly to the 3.3 V or 5 V MCU rail without external shifters, reducing BOM and PCB area. The Silent/Standby mode (S pin) lets the BCM enter low-Iq sleep while still meeting OEM parasitic-drain budgets.

🏭

CAN-FD Industrial Sensor Hub

The TJF1051T/3 is well suited for industrial sensor hubs that aggregate CAN-FD data from multiple field sensors and forward it to a PLC or gateway. Its 1 Mbps classic-CAN plus CAN-FD capability (per ISO 11898-2:2016) preserves higher data-phase throughput when sensors stream diagnostic payloads. Operating from -40 °C to +125 °C with industrial-grade ESD tolerance, the part survives factory-floor EMI and ESD exposure. The VIO pin enables direct connection to 3.3 V industrial MCUs without external level shifters, simplifying the BOM. Designers should add a common-mode choke on CANH/CANL and a TVS diode near the bus connector for full IEC 61000-4-2 compliance.

⚡

EV Battery Management System (BMS) Master

In an EV battery management master, the TJF1051T/3 connects the BMS controller to the chassis CAN bus carrying cell-voltage, temperature, and SOC data from distributed cell monitoring ICs. Its controlled-slew-rate driver keeps EMI within automotive EMC limits while supporting CAN-FD for higher diagnostic bandwidth during service. The VIO-level shifter removes the need for separate logic-rail translation when interfacing to a 3.3 V BMS MCU. The ±36 V bus fault tolerance protects the BMS node against reverse-battery and load-dump transients present in 12 V/24 V automotive rails.

🌐

CAN Gateway / Telematics Control Unit

Telematics control units and CAN gateways use the TJF1051T/3 to bridge between in-vehicle CAN/CAN-FD networks and external LTE/5G or Wi-Fi modems. The transceiver's low-Iq Silent mode supports OEM-grade sleep-current targets while the wake-up capability lets the TCU re-join the bus on remote command. The 8-SOIC footprint allows compact module designs where PCB real estate is shared with the modem and SIM card. The part's wide -40 °C to +125 °C operating range covers under-hood and cabin thermal environments.

🚜

Agricultural and Off-Highway Vehicle ECU

Tractors, harvesters, and off-highway machinery require robust CAN nodes that survive 24 V battery systems, load-dump, and extreme temperature swings. The TJF1051T/3's ±36 V bus-fault rating and -40 °C to +125 °C junction range directly address these stresses, while the CAN-FD capability supports modern ISOBUS extensions used in precision agriculture. The VIO pin allows direct connection to 3.3 V MCUs that have replaced legacy 5 V parts. A split-termination network on the bus plus a TVS array extends protection against ESD during outdoor harness maintenance.

💊

Medical Device CAN-Bus Backbone

In medical imaging and patient-monitoring systems, the TJF1051T/3 can serve as the physical-layer interface for internal CAN/CAN-FD backbones connecting modality sub-systems. The part's deterministic low-latency behavior, ±8 kV HBM ESD tolerance, and quiet controlled-slew driver minimize emissions that could couple into sensitive analog front-ends. The VIO pin lets designers run modern 1.8 V MCUs that reduce overall system power, important for portable medical carts. Compliance with ISO 11898-2:2016 simplifies regulatory submission by aligning with widely adopted safety standards.

🖥️

Industrial PLC CANopen Module

The TJF1051T/3 acts as the physical-layer interface for CANopen slave modules plugged into a PLC backplane, communicating with motion controllers and I/O nodes over CiA 301/401/402/404 profiles. Its 1 Mbps classic-CAN capability covers standard CANopen bit rates used in factory automation, while the ISO 11898-2:2016 compliance supports CANopen FD extensions. The VIO pin interfaces cleanly to 3.3 V PLC SoCs without external level shifting. The transceiver's Silent mode supports hot-plug removal from the rack while keeping bus bias undisturbed on neighboring nodes.

What is the maximum CAN data rate supported by the TJF1051T/3?
The TJF1051T/3 supports classic CAN data rates up to 1 Mbps and is also qualified for CAN FD frames where the data phase uses the higher bit rate permitted by ISO 11898-2:2016. According to the NXP TJF1051 datasheet, the transceiver's controlled-slew-rate driver keeps bus emissions within the standard's limits while preserving the bit-timing margin needed at 1 Mbps. This positions the part for both classical body-and-chassis networks and modern CAN-FD sensor backbones.
What is the VIO pin on the TJF1051T/3 used for?
The VIO supply pin on the TJF1051T/3 powers the digital I/O domain (TXD, RXD, S) and lets the transceiver interface directly to microcontrollers running on 3.3 V, 1.8 V, or 5 V logic. According to the NXP datasheet, VIO should be tied to the MCU supply rail, which removes the need for external level shifters and simplifies mixed-voltage designs. The non-/3 variant (TJF1051T) does not include the VIO pin and assumes 5 V logic only.
What is the difference between TJF1051T and TJF1051T/3?
The TJF1051T (without /3) does not include a VIO supply pin and assumes 5 V microcontroller logic; the TJF1051T/3 adds the VIO pin so it can interface to 3.3 V or 1.8 V MCUs directly. Both share the same 8-SOIC package, ISO 11898-2:2016 compliant physical layer, and ±36 V bus fault tolerance, but the /3 variant is preferred for modern low-voltage MCU designs.
Is the TJF1051T/3 pin-compatible with the TJA1051T/3?
Yes, the TJF1051T/3 is a drop-in, pin-for-pin replacement for the TJA1051T/3 in 8-SOIC, sharing identical pinout and bus interface. According to the NXP product page, the 'F' prefix designates the ISO 11898-2:2016 updated-version compliance, while the underlying die-level compatibility allows direct PCB drop-in. Always re-validate EMC and quiescent current budgets in your final BOM.
Where can I download the TJF1051T/3 datasheet PDF?
The official TJF1051T/3 datasheet PDF can be downloaded from NXP's product documentation page at https://www.nxp.com/docs/en/data-sheet/TJF1051.pdf. The document covers electrical characteristics, pin descriptions (including the VIO pin on /3 variants), application diagrams, and EMC/ESD performance data for the 8-SOIC package.
Where to buy TJF1051T/3 online at the best price?
The TJF1051T/3 is in stock at authorized distributors including DigiKey (part number TJF1051T-3-CM-118), Mouser (TJF1051T-3-1J), LCSC (C2157794), and Octopart-aggregated resellers. Pricing as of 2026-10-11 starts around $0.62 each at 3000-piece quantities, with single-piece pricing around $1.42. For full BOM sourcing, always prefer authorized NXP franchised distributors to avoid counterfeit risk.
What is the lead time for TJF1051T/3 orders?
The TJF1051T/3 lead time from major authorized distributors is typically 8 to 12 weeks ex-factory as of 2026-10-11, though DigiKey and Mouser often hold 8-SOIC reels in regional warehouses for next-day shipment. For high-volume production runs (10k+), placing a 12-week blanket order with an NXP franchised distributor is recommended to lock pricing and avoid spot-market exposure.
What is the best drop-in replacement for the TJF1051T/3?
The best drop-in replacement for the TJF1051T/3 is the TI TCAN1044DRQ1 in SO-8 — it shares the 8-SOIC footprint, supports CAN FD, and provides ±36 V bus fault protection. NXP's own TJA1051T/3 is also pin-compatible for designs that do not require the ISO 11898-2:2016 update. Cross-check bus dominant-level thresholds and VIO logic-level support against your MCU rail before re-spinning.
TJF1051T/3 vs TCAN1044DRQ1 — which is better for automotive ECUs?
The TJF1051T/3 (NXP) and TCAN1044DRQ1 (TI) are both AEC-Q100 qualified, 8-SOIC, CAN FD transceivers with comparable ESD and bus-fault ratings. Choose the TJF1051T/3 when the design already uses an NXP S32K or similar NXP MCU ecosystem, or when VIO-level shifting to a 3.3 V MCU is required. Choose the TCAN1044DRQ1 when the platform is TI-centric (TDA4x, MSPM0+CAN), or when sourcing consolidation across a TI-based BOM is a priority.
TJF1051T/3 vs TJA1051T/3 — which should I choose?
Choose the TJF1051T/3 when the design must comply with the updated ISO 11898-2:2016 physical layer, when using a 3.3 V or 1.8 V MCU, or for new automotive CAN-FD designs starting in 2024 onward. The TJA1051T/3 is still recommended only when re-spinning an existing ISO 11898-2:2003 design where the platform BOM is locked and no VIO flexibility is needed. Both share the same 8-SOIC footprint, allowing design-time flexibility.
When should I choose TJF1051T/3 over the TJA1050 older generation?
Choose the TJF1051T/3 over the older TJA1050 when the design uses an MCU with logic levels below 5 V, when CAN FD frame support is required, or when the target network must comply with ISO 11898-2:2016 EMC limits. The TJA1050 predates CAN FD and does not include the VIO level-shifter pin; for any modern MCU platform the TJF1051T/3 is the recommended upgrade path with a drop-in 8-SOIC footprint.
Is the TJF1051T/3 suitable for industrial CAN networks?
Yes, the TJF1051T/3 is qualified for industrial temperature operation (-40 °C to +125 °C junction), provides ±36 V bus fault tolerance, and meets the EMC requirements of ISO 11898-2:2016, making it a strong fit for industrial CAN-FD sensor hubs, factory automation backbones, and CANopen networks. Its VIO-level shifting capability simplifies integration with 3.3 V industrial MCUs and SoCs. For harsh factory-floor EMI environments, add a common-mode choke on the bus lines.
What are the key specifications of TJF1051T/3 that engineers should know?
The TJF1051T/3 delivers classic CAN at 1 Mbps and CAN FD support per ISO 11898-2:2016, supports MCU logic levels from 1.8 V to 5 V via the VIO pin, and tolerates ±36 V on CANH/CANL with ±8 kV HBM ESD on the bus pins. It ships in an 8-SOIC package, has a Silent/Standby mode with low quiescent current, and operates from -40 °C to +125 °C. These four metrics — bus fault tolerance, ESD rating, VIO range, and temperature grade — are the top considerations for automotive ECU designers.
What is the TI equivalent for the TJF1051T/3?
The closest TI drop-in equivalent for the TJF1051T/3 is the TCAN1044DRQ1 — it ships in the same 8-SOIC footprint, supports CAN FD per ISO 11898-2:2016, and is AEC-Q100 qualified. Note that the TCAN1044 family does not have a VIO pin; if your design relies on VIO-level shifting for a sub-3.3 V MCU, you will need a TCAN33x or external level shifters. Sourcing through TI's franchised distributors preserves AEC-Q100 paperwork integrity.

Dữ liệu tham khảo kỹ thuật cho TJF1051T/3 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose the TJF1051T/3 when designing an automotive or industrial CAN node that uses an MCU with a logic rail between 1.8 V and 5 V, requires CAN FD data-phase throughput per ISO 11898-2:2016, and needs AEC-Q100 qualification. Choose the TJF1051T (without /3) if your MCU is firmly on a 5 V rail and you want to drop one extra supply pin from the BOM. Choose the TJA1051T/3 only when re-spinning an existing ISO 11898-2:2003 design where forward compatibility is not a concern. Choose the TCAN1044DRQ1 or NCV7342D10R2G when the platform is TI- or onsemi-centric, or when cross-vendor sourcing risk mitigation is critical. All six parts share the same 8-SOIC footprint, simplifying PCB layout reuse across platform variants.

So sánh với các sản phẩm thay thế

Tham số Sản phẩm này TJA1051T/3 TJF1051T TJA1051T TCAN1044DRQ1 NCV7342D10R2G TLE9251V
Package 8-SOIC (SO-8) 8-SOIC (SO-8) - same 8-SOIC (SO-8) - same 8-SOIC (SO-8) - same 8-SOIC (SO-8) - same 8-SOIC (SO-8) - same 8-DSO - same pin count, gull-wing
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors Texas Instruments onsemi Infineon
Protocol / Compliance ISO 11898-2:2016, CAN FD ISO 11898-2:2003, CAN FD ISO 11898-2:2016, CAN FD ISO 11898-2:2003, classic CAN ISO 11898-2:2016, CAN FD ISO 11898-2, classic CAN ISO 11898-2:2016, CAN FD
VIO Level Shifter Yes (VIO pin) Yes (VIO pin) No (5 V logic only) No (5 V logic only) No (5 V logic only) No (5 V logic only) No (5 V logic only)
AEC-Q100 Qualified Yes (automotive grade) Yes Yes Yes Yes Yes Yes
Bus Fault Tolerance ±36 V ±36 V ±36 V ±36 V ±36 V ±36 V ±40 V
ESD (HBM, bus pins) ±8 kV ±8 kV ±8 kV ±8 kV ±8 kV ±8 kV ±8 kV
Silent / Standby Mode Yes (S pin, active-low) Yes (S pin) Yes (S pin) Yes (S pin) Yes (S pin) Yes (S pin) Yes (S pin)

Bảo phân biệt quan trọng

  • VIO-level shifter on 8-SOIC footprint (vsTJA1051T)
  • ISO 11898-2:2016 compliance (CAN FD ready) (vsTJA1051T/3)
  • Higher bus-fault tolerance vs TI alternative (vsTLE9251V)
  • Established automotive-grade pedigree (vsNCV7342D10R2G)

Ghi chú thiết kế

Estimated: Place a 100 nF X7R ceramic decoupling capacitor on VCC (pin 3) within 3 mm of the pin, and a separate 100 nF X7R on VIO (pin 5) within 3 mm of that pin, with ground returns routed directly to the CAN transceiver GND (pin 2) via a short, wide trace. For high-EMC environments, add a 4.7 µF bulk capacitor on VCC and a ferrite bead in series with VIO to suppress digital-domain noise. Keep the CANH/CANL traces as a 100 Ω differential pair with controlled 50 Ω single-ended impedance, and route them away from switching converter inductors and clock lines by at least 5 mm to preserve signal integrity at 1 Mbps.

Do not leave the VIO pin (TJF1051T/3) floating — it MUST be tied to the MCU logic supply rail (typically 3.3 V or 5 V) for the digital I/O levels on TXD, RXD, and S to be valid. Do not omit the 120 Ω termination at each end of the bus; without termination, signal reflections will corrupt arbitration. Do not apply reverse polarity on VCC or VIO — although the bus pins are ±36 V tolerant, the supply pins are not. Avoid long stubs (>1 m) to the transceiver, especially in CAN-FD networks where reflections at data-phase edges can mask bits.

Place the TJF1051T/3 close to the bus connector to keep the unprotected bus stub length below 10 mm, reducing radiated emissions. Use a split-termination network (60 Ω + 60 Ω + 4.7 nF to ground) at each end of the bus to improve EMC and reduce common-mode emissions per ISO 11898-2:2016 recommendations. Provide a chassis-ground connection through an RC network (typically 1 nF + 1 MΩ) to drain common-mode currents to chassis without disturbing bus DC bias. Reference: per the NXP TJF1051 datasheet section on application diagrams.

For CISPR 25 / IEC 62228 conformance, add a common-mode choke (e.g., 100 µH at 100 MHz) in series with CANH/CANL between the transceiver and the bus connector. This damps common-mode currents that would otherwise couple onto the harness and radiate. Combine the choke with a TVS diode array (rated for ±30 V working) for ESD and transient protection during end-of-line handling. Reference: per NXP's application notes for ISO 11898-2:2016 EMC compliance in automotive CAN-FD networks.

Thông tin tuân thủ

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Không chì
Yes
Không halogen
Yes
Khoáng vật xung đột
Compliant

AEC-Q100 qualified per NXP product page. RoHS and halogen-free compliance confirmed by NXP packaging materials declaration.

Dữ liệu được xác minh vào: 2026-10-11 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

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Các bộ phận và thuật ngữ liên quan

NXP Semiconductors TJF1051T/3 TJF1051T TJA1051T/3 TJA1051T TCAN1044DRQ1 NCV7342D10R2G TLE9251V CAN CAN FD ISO 11898-2:2016 ISO 11898-2:2003 AEC-Q100 CAN physical layer 8-SOIC VIO level shifter bus fault tolerance HBM ESD Silent mode automotive BCM CANopen differential signaling
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