AMD

XC6SLX75T-2FG484I - 74K Spartan-6 LXT FPGA | AMD

MPN: XC6SLX75T-2FG484I ✗ Cuối đời
484-ball FBGA Package 667 MHz Speed
MOQ: 1 |

XC6SLX75T-2FG484I Tóm tắt

The AMD XC6SLX75T-2FG484I is a Spartan-6 LXT field-programmable gate array containing 74,637 configurable logic elements organized into 5,831 configurable logic blocks, with a stated operating speed of 667 MHz and 268 I/Os in a 484-ball FBGA package measuring 23 x 23 mm with 1 mm ball pitch.

A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, memory, and I/O behavior are configured after manufacture. An FPGA belongs to the programmable-logic hierarchy and combines parallel programmable logic blocks with configurable input/output resources. This integration allows one physical device to implement control logic, signal processing, interface bridging, and embedded system functions without relying on a large collection of fixed-function logic ICs.

The Spartan-6 LX device family combines substantial programmable logic capacity with a high number of user I/Os. In the XC6SLX75T-2FG484I, 268 I/Os support communication with external processors, memory, converters, sensors, and industrial peripherals. The -2 performance grade and 667 MHz stated operating speed place the device in the Spartan-6 LX performance range, while the industrial-temperature suffix supports equipment designed for extended commercial and industrial operating environments.

The 484-ball FBGA package uses a 1 mm pitch and provides a compact, high-pin-count surface-mount footprint. Its 23 x 23 mm body makes it appropriate for dense control boards, but the fine ball pitch requires careful PCB layout, manufacturing control, inspection, and connector or test-point planning. The LXT designation also identifies this as a Spartan-6 member intended for designs requiring more logic resources and I/O capacity than smaller LX variants.

Typical uses include industrial automation, data acquisition, motion control, communications gateways, embedded instrumentation, and general-purpose digital signal processing. Its combination of 74,637 logic elements, 5,831 configurable logic blocks, and 268 I/Os is particularly useful when several parallel control paths, high-speed interfaces, and protocol conversion functions must share one programmable device.

PCB design should follow the AMD Spartan-6 package pinout files for every ball assignment and keep sensitive interfaces away from noisy power and switching paths. Decoupling, clock routing, configuration handling, bank voltage planning, and thermal performance require careful implementation before the FPGA is released for production.

This page organizes the principal device characteristics, practical application guidance, verified package details, and compatible Spartan-6 orderable variants into a focused engineering reference for design evaluation and component sourcing.

Bộ thay thế dễ dàng lắp đặt cho XC6SLX75T-2FG484I — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với XC6SLX75T-2FG484I (cùng hình factor và footprint) — khác nhau ở Ball Pitch, FPGA Family, Logic Elements, Mounting Type, Package Dimensions.

AMD
Ball Pitch: 1 mm
FPGA Family: Spartan-6 LX
Logic Elements: 74,637 LE
So sánh với XC6SLX75T-2FG484I →
AMD
Mounting Type: Surface Mount (BGA)
So sánh với XC6SLX75T-2FG484I →

XC6SLX75T-2FGG484I

✅ Drop-In
📦 FBGA-484 (23 x 23 mm)
Package-code suffix differs by one G character; the comparison record shows 0% difference in the 74,637 logic elements, 5,831 CLBs, and stated 667 MHz class.

📋 Tham chiếu thay thế (không có trong danh mục)

XC6SLX75-2FG484I

✅ Drop-In
AMD
📦 FBGA-484 (23 x 23 mm)
Field Programmable Gate Array (FPGA) · Spartan-6 LX · AMD / Xilinx · 74,637 LE · 5,831 · 667 MHz · 280 I/O · FCBGA-484 / 484-BBGA

Liên hệ để biết giá

Xem tài liệu →

XC6SLX75T-3FGG484I

✅ Drop-In
📦 FBGA-484 (23 x 23 mm)
Performance grade changes from -2 to -3; the documented 74,637 logic elements and 5,831 CLBs differ by 0%, while the exact frequency difference is not stated in the comparison record.

📋 Tham chiếu thay thế (không có trong danh mục)

XC6SLX75T-2CSG484I

✅ Drop-In
📦 FBGA-484 (23 x 23 mm)
Package code changes from FG to CSG; the comparison record shows 0% difference in 74,637 logic elements, 5,831 CLBs, and the stated 667 MHz class.

📋 Tham chiếu thay thế (không có trong danh mục)

XC6SLX75-2FGG484I

✅ Drop-In
AMD
📦 FBGA-484 (23 x 23 mm)
Spartan-6 LX · 74,637 · 11,650 slices · 3,170,304 · 4,824 Kbits (180 x 18 Kbit) · 132 · 280 · 667 MHz

Liên hệ để biết giá

Xem tài liệu →

XC6SLX75T-2FG484I Tỷ lệ tối đa & tính chất điện

FPGA Family Spartan-6 LXT
Configurable Logic Blocks 5,831 CLBs
Logic Elements 74,637 logic elements
Stated Operating Speed 667 MHz
User I/O Count 268 I/Os
Package Type 484-ball FBGA
Package Dimensions 23 x 23 mm
Ball Pitch 1.0 mm
Terminal Count 484 balls
Technology CMOS
Kiểu lắp đặt Surface-mount FBGA
Temperature Grade Industrial
Performance Grade -2 grade
Programmable Logic Type FPGA
Package Body Size 23 x 23 mm

Hướng dẫn cấu hình chân XC6SLX75T-2FG484I 23 x 23 mm

Cấu hình chân cho XC6SLX75T-2FG484I (23 x 23 mm gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.

Bảng cấu hình chân 23 x 23 mm cho XC6SLX75T-2FG484I

Không có dữ liệu chân cụ thể sẵn có cho XC6SLX75T-2FG484I.

Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.

Ứng dụng tiêu biểu

XC6SLX75T-2FG484I phù hợp cho 6 Áp dụngs: Industrial Automation and PLC Control, Data Acquisition and Instrumentation, Communications Gateway and Protocol Conversion, Embedded Signal Processing, Motor Control and Power-System Management, Aerospace and Defense Test Equipment.

🏭

Industrial Automation and PLC Control

The XC6SLX75T-2FG484I fits industrial controllers that coordinate motion, interlocks, actuators, sensors, and communications in parallel. Its 74,637 logic elements and 5,831 configurable logic blocks provide substantial capacity for state machines, timing logic, protocol conversion, and diagnostic logic, while 268 I/Os provide substantial connectivity to field-level circuits. The industrial-temperature order code is suitable for product platforms designed around extended industrial environments. Designers should assign I/O standards by bank, protect externally accessible signals, and isolate noisy relays or motor-drive stages from precision logic where practical.

📟

Data Acquisition and Instrumentation

The XC6SLX75T-2FG484I is appropriate for parallel data-acquisition systems that must combine sensor conditioning, digital filtering, calibration tables, and a communications interface. Its 74,637 logic elements and 5,831 configurable logic blocks can support multiple processing pipelines concurrently, while 268 I/Os allow the device to interface with ADC data buses, status lines, clocks, and control signals. The stated 667 MHz operating speed supports timing-intensive digital functions. Board design should use controlled clock distribution, provide local decoupling for every supply group, and keep analog and digital grounding strategies consistent with the selected analog front end.

🌐

Communications Gateway and Protocol Conversion

The XC6SLX75T-2FG484I can serve in gateways that translate between serial, parallel, memory-mapped, and packet-oriented interfaces. Its 5,831 configurable logic blocks and 74,637 logic elements are well suited to concurrent buffering, framing, checksum, routing, and flow-control functions. With 268 I/Os, the device can support multiple external buses and control channels without relying on a large fixed-function chipset. Engineers should define clock-domain boundaries, constrain high-speed interfaces, and budget memory or external storage resources early because protocol conversion can consume logic and bandwidth faster than simple combinational control.

📶

Embedded Signal Processing

The XC6SLX75T-2FG484I supports parallel filtering, correlation, modulation, waveform generation, and fixed-point signal-processing pipelines. Its 74,637 logic elements provide more implementation headroom than a small control FPGA, while the stated 667 MHz operating speed supports pipelined processing at useful clock rates. The 268 I/Os can connect the processor to parallel ADC or DAC data buses, memory, synchronization signals, and external peripherals. For reliable results, use synchronous design practices, pipeline arithmetic stages, apply appropriate clock constraints, and verify timing against all supported clock and configuration conditions.

⚡

Motor Control and Power-System Management

The XC6SLX75T-2FG484I can coordinate control sequencing, fault detection, pulse generation, and supervisory logic in motor-drive or power-conversion systems. Its extensive logic capacity allows current control, position tracking, protection state machines, and communications logic to coexist, while 268 I/Os simplify connection to gate drivers, position sensors, measurement systems, and safety-related discrete logic. The FPGA should remain separated from high-dv/dt power stages through appropriate isolation, filtering, and grounding. Production designs must also review the exact device temperature limits, operating voltages, transient behavior, and functional-safety requirements.

✈️

Aerospace and Defense Test Equipment

The XC6SLX75T-2FG484I can implement compact test and simulation systems when the surrounding equipment requires deterministic parallel logic, extensive interface connectivity, and programmable functionality. Potential uses include automated test equipment, avionics interface simulators, fault-injection systems, and programmable signal-generation platforms. The device's 74,637 logic elements and 268 I/Os allow one FPGA to coordinate acquisition, sequencing, and external communication. Because program-specific aerospace and defense requirements may exceed ordinary industrial specifications, engineers should confirm the exact ordering code, radiation, temperature, traceability, and qualification requirements before using the part in a safety-critical or export-controlled system.

Tóm tắt các sản phẩm được đề xuất

XC6SLX75T-2FGG484I Closely related 484-ball Spartan-6 LXT FPGA option Được sử dụng trong: Industrial Automation and PLC Control, Data Acquisition and Instrumentation, Communications Gateway and Protocol Conversion, Motor Control and Power-System Management, Aerospace and Defense Test Equipment XC6SLX75-2FG484I AMD Được sử dụng trong: Industrial Automation and PLC Control, Motor Control and Power-System Management XC6SLX75T-2CSG484I Related 484-ball Spartan-6 LXT device option Được sử dụng trong: Data Acquisition and Instrumentation, Embedded Signal Processing XC6SLX75-2FGG484I AMD Được sử dụng trong: Communications Gateway and Protocol Conversion, Aerospace and Defense Test Equipment XC6SLX75T-3FGG484I Related higher-performance-grade Spartan-6 LXT option Được sử dụng trong: Embedded Signal Processing
What are the key specifications of XC6SLX75T-2FG484I that engineers should know?
The XC6SLX75T-2FG484I is a Spartan-6 LXT FPGA with 74,637 logic elements, 5,831 configurable logic blocks, a stated 667 MHz operating speed, and 268 I/Os. It is supplied in a 23 x 23 mm, 484-ball FBGA with 1 mm pitch and carries an industrial-temperature designation. According to AMD/Xilinx Spartan-6 product and package documentation, the device combines high programmable logic density with a high pin count for communications, control, and signal-processing systems.
What is the XC6SLX75T-2FG484I and what is an FPGA?
The XC6SLX75T-2FG484I is a programmable-logic IC in the AMD/Xilinx Spartan-6 LXT family. An FPGA contains configurable logic blocks, programmable interconnect, memory resources, and user I/Os whose functions are defined through a bitstream after manufacturing. The Spartan-6 documentation describes the family as a cost-conscious programmable-logic platform for embedded control, communications, and high-volume industrial applications.
Where can I download the XC6SLX75T-2FG484I datasheet and package pinout?
The official AMD Spartan-6 package-device pinout page provides downloadable ASCII pinout files, while the XC6SLX75 family datasheet contains architecture, electrical, and package details. Use the 484-ball package file corresponding to this device when assigning PCB balls. The manufacturer documentation identifies the package as 484-ball FBGA, 23 x 23 mm, with 1 mm ball pitch.
Where can I find the XC6SLX75T-2FG484I pinout?
The XC6SLX75T-2FG484I pinout is published through AMD's Spartan-6 package-device pinout files. Download the 484-ball package file and use it as the authoritative ball-assignment reference during schematic capture and PCB layout. Do not infer individual ball functions from another 484-ball Spartan-6 device because bank assignments and package markings can differ.
Where can I buy XC6SLX75T-2FG484I online?
Use the Request a Quote form on this page to request XC6SLX75T-2FG484I availability, order quantities, and current delivery information. The part is an AMD Spartan-6 LXT FPGA in a 484-ball FBGA package, so procurement should specify the complete suffix exactly. Include the required quantity, date code, and shipment destination in the request.
What is the current lead time for XC6SLX75T-2FG484I?
Current lead time should be confirmed through the Request a Quote form on this page because it can vary with quantity, configuration, and supply status. The verified product information identifies the exact industrial-temperature, -2-grade, 484-ball FBGA device, allowing procurement to request the correct orderable MPN without package or temperature-grade ambiguity.
Is XC6SLX75T-2FG484I in stock?
One authorized-channel listing identifies XC6SLX75T-2FG484I as in stock, but live inventory changes rapidly and may not cover every order quantity. Submit the required quantity through the Request a Quote form on this page for a current allocation confirmation. Include any required date-code, traceability, and inspection requirements in the same request.
What is the price of XC6SLX75T-2FG484I?
Request a current XC6SLX75T-2FG484I quotation through the Request a Quote form on this page. The component is an AMD Spartan-6 LXT FPGA with 74,637 logic elements and a 484-ball FBGA package. A formal quote allows procurement to specify quantity, packing requirements, date code, traceability, and delivery destination before commercial terms are confirmed.
What is the best drop-in replacement for XC6SLX75T-2FG484I?
XC6SLX75T-2FGG484I is the closest same-footprint alternative because it retains the 484-ball FBGA format, 74,637 logic elements, 5,831 configurable logic blocks, and 667 MHz class of device. The precise distinction is the package-code suffix. Confirm the AMD package pinout file and required temperature grade before treating it as a production replacement.
Can XC6SLX75T-2FGG484I replace XC6SLX75T-2FG484I?
XC6SLX75T-2FGG484I is a closely related 484-ball Spartan-6 LXT option with the same 74,637 logic-element count, 5,831 configurable logic blocks, and stated 667 MHz operating speed. Its key suffix difference is the additional G in the package designation. Verify the package pinout file and procurement requirements before approving it as a drop-in replacement.
What can replace XC6SLX75T-2FG484I?
The closest documented replacements are the 484-ball Spartan-6 LX variants XC6SLX75T-2FGG484I, XC6SLX75-2FG484I, XC6SLX75T-3FGG484I, and XC6SLX75T-2CSG484I. All retain the 484-ball package family and comparable Spartan-6 LX logic organization. Selection must account for temperature grade, performance suffix, package marking, and the exact pinout-file revision.
XC6SLX75T-2FG484I vs XC6SLX75-2FGG484I: which is better?
XC6SLX75T-2FG484I and XC6SLX75-2FGG484I are closely matched Spartan-6 LX FPGA options in 484-ball packages, with each comparison record showing 74,637 logic elements and 5,831 configurable logic blocks. The most important selection point is the exact industrial-temperature and package-code suffix. Choose the device whose ordering code and package documentation match the production design.
When should I choose XC6SLX75T-2FG484I over XC6SLX75T-2FGG484I?
Choose XC6SLX75T-2FG484I when the bill of materials, PCB documentation, and qualification records specifically identify that complete orderable suffix. The two parts are close in FPGA capacity and stated speed, so raw logic density does not provide a useful distinction. Verify the package-code convention, industrial-temperature marking, and AMD pinout file before treating either suffix as interchangeable.
Is XC6SLX75T-2FG484I suitable for industrial control and automation systems?
The XC6SLX75T-2FG484I is marked as an industrial-temperature Spartan-6 LXT FPGA and provides 74,637 logic elements plus 268 I/Os. Those resources suit parallel machine control, sensor acquisition, communications, and embedded protocol handling. Final suitability also depends on the specified temperature limits, voltage rails, clocking, qualification requirements, and sustained power behavior.
What design considerations matter for a 484-ball Spartan-6 FPGA?
The principal design challenge is implementing the 484-ball FBGA at 1 mm pitch with controlled manufacturing tolerances. Use the AMD package pinout files for ball assignment, follow the package footprint recommendations, place decoupling close to supply pins, and plan clock and high-speed signal routing carefully. The device's 268 I/Os also require deliberate voltage-bank, configuration, and interface planning.

Dữ liệu tham khảo kỹ thuật cho XC6SLX75T-2FG484I — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose XC6SLX75T-2FG484I when the product specification, qualified BOM, and PCB documentation explicitly require the complete industrial-temperature, -2-grade, 484-ball order code. Its 74,637 logic elements, 5,831 configurable logic blocks, 268 I/Os, and stated 667 MHz class suit complex industrial control, acquisition, communications, and signal-processing designs. XC6SLX75T-2FGG484I is the closest documented option when only the package-code suffix differs, but the exact ordering rules and pinout documentation must still be checked. XC6SLX75-2FG484I offers the same capacity and package family with a different temperature-grade code. XC6SLX75T-3FGG484I changes the performance grade, while XC6SLX75T-2CSG484I changes the package code. Because these devices share broad device-family characteristics, approval should be driven by exact suffix, temperature, speed, qualification, and pinout requirements rather than FPGA capacity alone.

So sánh với các sản phẩm thay thế

Tham số Sản phẩm này XC6SLX75T-2FGG484I XC6SLX75-2FG484I XC6SLX75T-3FGG484I XC6SLX75T-2CSG484I XC6SLX75-2FGG484I
Brand AMD AMD AMD AMD AMD AMD
Package FBGA-484 (23 x 23 mm) FBGA-484 (23 x 23 mm) - same package family FBGA-484 (23 x 23 mm) - same package family FBGA-484 (23 x 23 mm) - same package family FBGA-484 (23 x 23 mm) - same package family FBGA-484 (23 x 23 mm) - same package family
FPGA Family Spartan-6 LXT Spartan-6 LXT Spartan-6 LXT Spartan-6 LXT Spartan-6 LXT Spartan-6 LXT
Logic Elements 74,637 74,637 74,637 74,637 74,637 74,637
Configurable Logic Blocks 5,831 CLBs 5,831 CLBs 5,831 CLBs 5,831 CLBs 5,831 CLBs 5,831 CLBs
Ball Pitch 1.0 mm 1.0 mm 1.0 mm 1.0 mm 1.0 mm 1.0 mm
Performance Suffix -2 -2 -2 -3 -2 -2

Bảo phân biệt quan trọng

  • Exact 74,637-logic-element configuration (vsXC6SLX75T-3FGG484I)
  • Closest documented package-code option (vsXC6SLX75T-2FGG484I)
  • No logic-capacity penalty in the listed alternatives (vsXC6SLX75-2FGG484I)

Ghi chú thiết kế

Treat the 484-ball FBGA as a fine-pitch assembly requiring a controlled PCB footprint and manufacturing process. Assign signals directly from the AMD package-device pinout file, preserve the exposed thermal and power-distribution structures required by the package documentation, and verify solder-mask, paste, and inspection capabilities at 1 mm pitch. Avoid constructing the footprint from visual ball spacing alone because package-specific mechanical tolerances and markings affect assembly.

Plan the complete power tree before routing high-speed interfaces. The device's 484-ball package provides many connections, but each supply domain still requires adequate decoupling and distribution. Place bulk and high-frequency decoupling capacitors close to their associated supply and ground balls, follow the manufacturer guidance for each rail, and confirm voltage-bank compatibility before assigning an I/O standard. Configuration voltage, auxiliary voltage, and normal operating supplies must remain within their specified limits.

Reserve a clear configuration and startup strategy that matches the complete device order code. Use dedicated clock-capable pins for system clocks where required, avoid routing sensitive clock or differential pairs through noisy power-stage areas, and apply source-synchronous or other appropriate PCB constraints for high-speed interfaces. Because the device has 268 I/Os, assign board functions and voltage standards during schematic capture rather than after PCB routing begins.

Do not interchange the target XC6SLX75T-2FG484I with similarly named 484-ball Spartan-6 order codes solely because their logic capacity matches. Verify the complete MPN, temperature suffix, performance grade, package code, and applicable AMD pinout file. A suffix change can alter ordering qualification or documentation without changing the broad 74,637-logic-element device family, making procurement and design traceability essential.

Thông tin tuân thủ

RoHS
Unknown
REACH
Unknown
AEC-Q100
Unknown
Không chì
Unknown
Không halogen
Unknown
Khoáng vật xung đột
Unknown

No explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statement was established for this exact order code.

Dữ liệu được xác minh vào: 2026-11-03 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

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AMD XC6SLX75T-2FG484I XC6SLX75T-2FGG484I XC6SLX75-2FG484I XC6SLX75T-3FGG484I XC6SLX75T-2CSG484I XC6SLX75-2FGG484I Spartan-6 Spartan-6 LXT FPGA field-programmable gate array programmable logic configurable logic block CLB logic element FBGA-484 surface-mount package 667 MHz 74,637 logic elements 5,831 configurable logic blocks 268 I/Os industrial-temperature grade 1 mm ball pitch PCB layout signal processing
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