XCKU3P-2FFVB676E - Kintex UltraScale+ FPGA | AMD
MPN: XCKU3P-2FFVB676E ✓ Hoạt độngXCKU3P-2FFVB676E Tóm tắt
An FPGA is a semiconductor whose digital behavior is configured after manufacture. The FPGA hierarchy begins with the individual configurable logic block, expands into an FPGA device, and ultimately belongs to the broader semiconductor and programmable-logic categories. This lets engineers implement parallel datapaths, protocol controllers, signal processing, control logic, and hardware accelerators without relying exclusively on a fixed-function processor. Configurable routing resources connect the selected logic, memory, input/output, clocking, and dedicated hard blocks.
The principal catalog-level benefits of XCKU3P-2FFVB676E are its Kintex UltraScale+ family assignment, 280 I/O positions, -2 performance grade, and 676-ball FCBGA construction. The high pin count supports dense board-level integration and broad external connectivity, while the FPGA architecture permits a single physical device to consolidate functions that might otherwise require several programmable or fixed-function components. The exact logic-cell, DSP, memory, transceiver, power, and temperature limits should be confirmed in the applicable AMD family documentation for the selected device and package.
The “P” designation in the ordering code should not be interpreted without the AMD ordering guide because its exact commercial meaning depends on the family documentation. Likewise, the “2” speed grade is a family-level ordering designation, not by itself a complete description of operating frequency or performance. Engineers should use the package pinout files, device datasheet, configuration guidance, and power-estimation workflow when preparing a board or selecting a replacement.
Typical applications for this device include high-speed data acquisition, industrial control and automation, communications infrastructure, signal-processing systems, test and measurement equipment, and embedded accelerator platforms. In each case, the FPGA is configured to implement the required datapath and control functions, while the 280 I/O positions provide connections to external converters, memories, interfaces, clocks, and control signals.
A critical design consideration is that the 676-ball FCBGA footprint requires a dense multilayer PCB with a carefully engineered power-delivery network, decoupling strategy, ball-assignment review, and thermal assessment. Before layout, verify every supply, ground, configuration, clock, and user I/O connection against the current AMD package pinout file rather than inferring connectivity from the commercial ordering code.
This product page combines the exact catalog identity, package information, price-evidence rules, replacement analysis, and practical design guidance. It is intended to help engineers identify the correct AMD device, locate authoritative documentation, assess genuine drop-in options, and move from component selection into PCB implementation with fewer specification and compatibility risks.
Bộ thay thế dễ dàng lắp đặt cho XCKU3P-2FFVB676E — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với XCKU3P-2FFVB676E (cùng hình factor và footprint) — khác nhau ở Package, Temperature Grade, Device Type, Mounting Type, Speed Grade.
XCKU3P-2FFVB676I
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| Device Type | Kintex UltraScale+ field-programmable gate array (FPGA) |
| Manufacturer | AMD |
| Part Number | XCKU3P-2FFVB676E |
| FPGA Family | Kintex UltraScale+ |
| Order Code Performance Grade | -2 grade |
| Number of I/O Positions | 280 positions |
| Hộp | 676-ball FCBGA |
| Kiểu lắp đặt | Surface mount |
| Programmable Device Category | FPGA |
Hướng dẫn cấu hình chân XCKU3P-2FFVB676E 676-ball fcbga
Cấu hình chân cho XCKU3P-2FFVB676E (676-ball fcbga gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho XCKU3P-2FFVB676E.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
XCKU3P-2FFVB676E phù hợp cho 6 Áp dụngs: High-Speed Data Acquisition, Industrial Automation and Control, Communications Infrastructure, Signal Processing, Test and Measurement Equipment, Embedded Hardware Accelerator.
High-Speed Data Acquisition
AMD XCKU3P-2FFVB676E fits high-speed data-acquisition systems that require parallel sensor inputs, digital filtering, and deterministic data movement. Its 280 I/O positions allow external converters, logic devices, memory interfaces, and synchronization signals to connect directly to the Kintex UltraScale+ FPGA. The programmable architecture can implement acquisition control, packetization, and real-time filtering without relying on a fixed instruction sequence. Engineers should use the -2 performance grade when acquisition timing is critical and verify converter interface timing against the selected I/O standards. The 676-ball FCBGA footprint also requires careful multilayer routing and a low-impedance power-delivery network.
Được đề xuất
Industrial Automation and Control
XCKU3P-2FFVB676E can serve as the programmable control core for industrial automation equipment requiring many digital I/O channels and concurrent control logic. The 280 I/O positions can support machine I/O, encoder inputs, actuator outputs, status signals, and communications with external controllers, while the Kintex UltraScale+ architecture accommodates motion sequencing, interlocks, and diagnostics in parallel. The -2 grade is appropriate when control loops or data paths require additional timing margin. Temperature-grade selection remains essential because industrial installations may exceed consumer-temperature limits. Review the device suffix, isolation strategy, and AMD package files before releasing the production PCB.
Được đề xuất
Communications Infrastructure
AMD XCKU3P-2FFVB676E is appropriate for communications infrastructure equipment that separates incoming data, applies programmable transformations, and routes packets through multiple interfaces. The 280 I/O positions provide broad connectivity for parallel datapaths, control signals, clocks, and status monitoring, while the FPGA fabric supports concurrent protocol and traffic-management functions. Designers can implement fixed-latency pipelines, aggregation, filtering, and test instrumentation in programmable logic. The -2 performance grade offers a timing-oriented option for demanding paths, but the complete device feature set and transceiver requirements must be checked in the AMD family documentation. Power integrity and thermal design are particularly important in dense communications systems.
Được đề xuất
Signal Processing
XCKU3P-2FFVB676E can implement parallel signal-processing pipelines where deterministic latency and configurable logic are more important than executing a conventional software workload. The Kintex UltraScale+ FPGA architecture supports concurrent filtering, correlation, waveform transformation, and data-classification stages, while the 280 I/O positions connect directly to converters, memory, and synchronization circuitry. The -2 performance grade can help close timing in wide datapaths, subject to the exact device speed tables. Engineers should map the design to available logic, DSP, and block RAM resources and preserve timing margin for routing congestion. A full pinout and power review against current AMD documentation is required before layout begins.
Được đề xuất
Test and Measurement Equipment
XCKU3P-2FFVB676E is well suited to modular test and measurement platforms that combine instrument control, pattern generation, capture logic, and real-time analysis. Its 280 I/O positions allow parallel DUT stimulus, response capture, clock distribution, and instrument-interface connections, while programmable logic enables measurement sequences that can be updated after manufacture. The -2 grade is a logical choice for timing-sensitive acquisition paths and complex parallel algorithms. Engineers should account for routing congestion, memory-resource balancing, and the thermal load of large FPGA configurations. Because the device uses a 676-ball FCBGA, careful escape routing, via-in-pad assessment, and multilayer power-plane design are essential.
Được đề xuất
Embedded Hardware Accelerator
AMD XCKU3P-2FFVB676E can serve as an embedded hardware accelerator when an application benefits from parallel execution, predictable response time, or direct control of external data interfaces. A programmable pipeline can accelerate filtering, encoding, analytics, or protocol handling while the 280 I/O positions connect accelerators to external processors, memory, and external data sources. The -2 performance grade supports timing-critical implementations, but resource utilization and power should be evaluated against the complete family data sheet. Engineers should establish a memory bandwidth budget, reserve logic for control functions, and verify that the selected package exposes the required interfaces. Production release should include a full package-ball audit and thermal validation.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho XCKU3P-2FFVB676E — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | XCKU3P-2FFVB676I | XCKU3P-1FFVB676E | XCKU3P-1FFVB676I |
|---|---|---|---|---|
| Package | 676-ball FCBGA | 676-ball FCBGA | 676-ball FCBGA | 676-ball FCBGA |
| Brand | AMD | AMD | AMD | AMD |
| FPGA Family | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ |
| Performance Grade | -2 grade | -2 grade | -1 grade | -1 grade |
| Temperature Suffix | E suffix | I suffix | E suffix | I suffix |
Bảo phân biệt quan trọng
- Higher performance-grade selection (vsXCKU3P-1FFVB676E)
- E-suffix ordering option (vsXCKU3P-2FFVB676I)
- Higher speed grade with the I ordering suffix (vsXCKU3P-1FFVB676I)
Ghi chú thiết kế
Design the 676-ball FCBGA footprint from the current AMD package drawing and UltraScale package pinout file rather than from the commercial ordering code. Confirm pad dimensions, solder-mask definition, component position, ball numbering, and via-in-pad requirements against the released package information. The dense ball field also requires a multilayer PCB with short escape routes, adequate layer-transition capacity, and manufacturing rules that account for package-to-board differential thermal expansion.
Create separate, low-impedance power-distribution paths for every required FPGA supply and use the decoupling values specified in the AMD power-guidance documentation. Place the smallest decoupling capacitors directly beneath or as close as practical to the corresponding device balls, then validate the power network with a multi-layer impedance and return-path analysis. Do not consolidate supply balls into a generic net without checking voltage, sequencing, and current requirements because different Kintex UltraScale+ rails may have distinct limits.
Estimate dynamic power from the actual implemented logic, memory, DSP, clock, and I/O activity rather than relying on a single worst-case number. Use AMD’s power-estimation methodology, capture activity traces representative of the operating workload, and calculate conduction and junction-temperature headroom with the package thermal model. Estimated: junction temperature equals ambient temperature plus device power multiplied by the effective board-and-package thermal resistance. Validate the result with board-level thermal testing.
Review the package pinout for configuration pins, clock inputs, user I/O, supplies, and grounds before allocating board resources. Configuration and clock signals require especially careful routing because errors can prevent startup or create intermittent operation even when the logical design is correct. Keep sensitive interfaces away from noisy power-return paths, maintain the specified input impedance, and preserve the pin and bank constraints required by the selected I/O standards.
Do not treat a shared ordering prefix as proof of drop-in compatibility. Before substituting XCKU3P-2FFVB676I, XCKU3P-1FFVB676E, or XCKU3P-1FFVB676I, compare the complete AMD ordering table, resource limits, speed grade, temperature suffix, package-ball assignments, configuration method, and lifecycle status. Re-run synthesis and implementation for any speed-grade change because timing closure, power, and routing utilization can vary even when the package designation remains the same.
Thông tin tuân thủ
The available product listings identify the device, family, I/O count, package, and ordering codes but do not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. Confirm these attributes and the exact suffix qualifications in current AMD product documentation before environmental or automotive qualification.