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XC6SLX150-3FG676I - 147443-Cell Spartan-6 LX FPGA | AMD
XC6SLX150-3FG676I

XC6SLX150-3FG676I - 147443-Cell Spartan-6 LX FPGA | AMD

The AMD XC6SLX150-3FG676I is a Spartan-6 LX field-programmable gate array with 147443 logic cells, a 676-ball FBGA package, 45 nm CMOS construction, and a 1.2 V core supply. The -3 speed grade provides the highest performance option identified for the Spartan-6 LX family, while the industrial I suffix identifies an extended-temperature device. Its integrated programmable resources support parallel processing, control, signal processing, and programmable-interface designs where deterministic hardware implementation is preferred over a software-driven processor approach. A field-programmable gate array is a reconfigurable digital semiconductor in which the logic fabric, input/output blocks, clocking resources, and embedded memory are programmed after manufacture. The Spartan-6 LX family targets the FPGA > programmable logic > semiconductor hierarchy, combining high logic density with a broad set of embedded resources for communications, industrial control, instrumentation, embedded processing, and high-volume electronic systems. The XC6SLX150-3FG676I is the large-density member of that family. The device provides 147443 logic cells on a mature 45 nm low-power copper CMOS process. Its 1.2 V core voltage identifies the core operating rail, while separate I/O supply options allow interface standards to be matched to board requirements when their supported values are confirmed in the Spartan-6 documentation. The 676-BGA package provides a high pin count and a compact body measuring 19 x 19 mm with 0.80 mm pitch, according to the package listing. The -3 grade is intended for the highest performance in the LX speed-grade range. Its operating temperature range is 0 to 85 degrees Celsius, making the device appropriate for industrial-temperature equipment that remains within this specified envelope. Designers should use the AMD Spartan-6 package pinout files when assigning balls to power, ground, configuration pins, clock pins, and user I/O. The architecture is particularly useful when a design needs parallel channels, deterministic latency, hardware timing, or configurable logic that can be updated independently of a general-purpose software runtime. Typical applications include industrial automation, test and measurement equipment, communications infrastructure, embedded control systems, video and image processing, and signal acquisition. These uses benefit from the device's combination of logic density, programmable I/O, and parallel processing resources. System designs must still account for external memory, clock jitter, power sequencing, decoupling, signal integrity, and thermal performance at the selected operating speed. For PCB implementation, follow the manufacturer package and pinout files for ball assignment and escape routing, provide continuous power and ground planes, and keep high-speed clocks and differential interfaces away from noisy switching nodes. Configuration storage and its interface should also follow the Spartan-6 design guidance. The key engineering trade-off is that the -3 grade prioritizes performance, whereas a lower-speed grade may offer a different balance of timing margin, power, and thermal requirements. This product overview combines the device's package, density, process, speed-grade, temperature, and electrical attributes with practical FPGA design guidance. It also distinguishes same-package alternatives by logic density, speed grade, and temperature suffix, helping engineers verify pin compatibility and performance requirements before approving a replacement.

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XC6SLX150-3FGG676C - Spartan-6 LX FPGA 147K LE | AMD Xilinx
XC6SLX150-3FGG676C

XC6SLX150-3FGG676C - Spartan-6 LX FPGA 147K LE | AMD Xilinx

The AMD Xilinx XC6SLX150-3FGG676C is a Spartan-6 LX family Field-Programmable Gate Array (FPGA) delivering 147,443 logic cells, 23038 Adaptive Logic Modules (ALMs), and 4,939,776 system gates in a 676-ball Fine-Pitch Ball Grid Array (FGG676) package. It carries the -3 commercial speed grade with a maximum core clock of 862 MHz, offers 498 user I/Os, and operates over the commercial 0C to +85C temperature range per the FBGA-676 27 x 27 mm, 1.0 mm pitch package profile. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines logic gates, multipliers, embedded memory, and high-speed transceivers into a configurable fabric. FPGA sits in the hierarchy of programmable logic -> programmable logic device -> semiconductor -> integrated circuit. The Spartan-6 LX family targets high-volume cost-sensitive applications that demand high logic density, abundant block RAM, and integrated DSP slices without the power overhead of Virtex-class devices. By programming the LUTs, routing, and IP cores via the ISE Design Suite, engineers create custom accelerators, glue logic, video pipelines, and connectivity subsystems on a single chip. Key features of the XC6SLX150-3FGG676C include 135 Kbit distributed RAM, 4.8 Mbit block RAM, 180 DSP48A1 slices, four clock management tiles with PLL, and 498 SelectIO signals supporting LVCMOS, LVDS, and LVTTL standards. The device integrates PCI Express Endpoint blocks, GTP transceivers are NOT present on this LX variant, and supports DDR, DDR2, DDR3, and QDRII+ memory interfaces through dedicated hardware controllers. Configuration is via SPI, BPI, JTAG, or Platform Flash XCF, enabling flexible in-system reprogrammability for field upgrades. From a system-architecture perspective, the Spartan-6 LX uses a 45 nm copper CMOS process backed by an optimized core voltage of 1.14 to 1.26 V and auxiliary supply of 2.5 / 3.3 V for I/O banks. The 676-BGA package exposes 26 user I/O banks so designers can support mixed-voltage interfaces (1.2 V to 3.3 V) on a single die, ideal for bridging legacy and modern logic families in industrial control or motor-drive boards. Typical applications include industrial motor control and factory automation backbones, video surveillance processing pipelines, medical imaging front-end buffers, automotive driver-assistance pre-processing prototypes, and avionics display controllers. The combination of abundant I/O and large block RAM makes the LX150 particularly attractive for high-channel-count data acquisition and parallel sensor aggregation. When designing with this part, validate that the 676-BGA layout supports at least four routing layers with laser-drilled microvias, since 1.0 mm pitch BGA escape routes demand controlled-impedance planning. Also confirm that the ISE WebPACK license covers all required IP cores for development. This page synthesizes distributor availability, drop-in Spartan-6 family alternatives, and practical layout notes not bundled into the manufacturer datasheet.

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XC6SLX150T-3FGG484I - Spartan-6 LXT FPGA 147K Logic Cells | AMD
XC6SLX150T-3FGG484I

XC6SLX150T-3FGG484I - Spartan-6 LXT FPGA 147K Logic Cells | AMD

The AMD XC6SLX150T-3FGG484I is a high-performance Field Programmable Gate Array (FPGA) from the Spartan-6 LXT family, built on a 45nm CMOS process technology. It delivers 147,443 logic cells and 23,038 adaptive logic modules (ALMs) in a 484-pin FBGA package with a 19x19 mm body and 0.80 mm pitch. The device operates from a 1.2V core supply and supports up to 296 user I/O pins, making it suitable for high-volume, cost-sensitive applications requiring substantial logic density and I/O flexibility. An FPGA (Field Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) and programmable interconnects that can be programmed after manufacturing to implement arbitrary digital logic functions. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which themselves fall under the category of integrated circuits. Unlike fixed-function ASICs, FPGAs offer reconfigurability, enabling rapid prototyping, hardware acceleration, and in-field updates, which is critical for evolving standards and algorithm changes. Key features of the XC6SLX150T-3FGG484I include 4.71 Mbit of embedded block RAM, integrated DSP slices for signal processing, and support for multiple I/O standards including LVCMOS, LVDS, and HSTL. The -3 speed grade provides the highest performance within the Spartan-6 LXT family, with internal clock frequencies up to 667 MHz. The device also includes hardened memory controllers for DDR, DDR2, and DDR3, reducing system cost and design complexity. Technically, the Spartan-6 architecture employs a 45nm low-power copper process with a 1.2V core voltage, balancing performance and power consumption. The device integrates Clock Management Tiles (CMTs) containing DCMs and PLLs for robust clock generation and jitter filtering. The LXT variant adds high-speed serial transceivers (up to 3.125 Gbps) and PCIe endpoints, enabling advanced bridging and serial connectivity applications. Typical applications include automotive infotainment systems, industrial automation controllers, consumer electronics bridging, and high-speed data acquisition. The 296 I/Os and 4.71 Mbit memory make it ideal for video processing, motor control, and protocol conversion. The -3 speed grade ensures timing closure for demanding designs. When designing with this FPGA, careful attention to power supply decoupling is essential. Use multiple 100nF and 10uF capacitors near the VCCINT, VCCAUX, and VCCO pins to minimize noise. Additionally, configure the device's I/O standards to match the external interface voltages to prevent damage and ensure signal integrity.

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XC6SLX16-2CPG196C - Spartan-6 LX 375 MHz FPGA | AMD
XC6SLX16-2CPG196C

XC6SLX16-2CPG196C - Spartan-6 LX 375 MHz FPGA | AMD

AMD/Xilinx XC6SLX16-2CPG196C is a Spartan-6 LX field-programmable gate array with 14,579 logic cells, 106 user I/Os, and a maximum stated operating frequency of 375 MHz, supplied in a 196-ball CSBGA package. The device operates from a 1.14 V to 1.26 V core-supply range and is built on 45 nm CMOS technology. It combines programmable logic, block RAM, digital clock managers, and PLL resources in a cost-sensitive FPGA platform for industrial and embedded systems. A field-programmable gate array is a semiconductor device whose digital behavior is configured through a programmable bitstream rather than a fixed circuit layout. Within the product hierarchy, an FPGA is a programmable logic device and semiconductor, while the Spartan-6 LX family combines configurable logic blocks and dedicated resources for parallel processing, control, signal generation, and interface bridging. The XC6SLX16-2CPG196C provides 14,579 logic cells, 106 user I/Os, 375 MHz stated operating performance, and 667 MHz internal frequency according to the verified product listings. Its 196-ball CSBGA footprint measures 19 mm by 19 mm with a 0.80 mm ball pitch. The commercial-temperature suffix C corresponds to the listed 0 °C to 85 °C operating range, while the -2 suffix identifies the device speed grade. Spartan-6 devices use configurable logic and dedicated resources to implement control logic, parallel data processing, memory-intensive functions, and communication bridges. The -2 grade provides a practical balance between processing performance and cost, making the LX16 suitable for cost-sensitive designs that need more integration than a small programmable logic device but do not require a large premium FPGA. Typical uses include industrial automation, motor-control interfaces, machine-vision pre-processing, sensor acquisition, communication bridging, embedded control, and high-volume consumer equipment. The combination of 106 I/Os and 14,579 logic cells allows multiple interfaces and control domains to be consolidated on one programmable device while retaining field-upgradeable behavior. Designers should treat the 1.14 V to 1.26 V core supply as a dedicated power domain, follow AMD Spartan-6 decoupling and configuration recommendations, and verify the exact CPG196 pinout and ball assignments before layout. Thermal, signal-integrity, and configuration-boot requirements must be checked against the applicable Spartan-6 hardware documentation rather than inferred solely from the distributor summary.

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XC6SLX16-2CPG196I - 14k Logic Cells Spartan-6 FPGA | AMD
XC6SLX16-2CPG196I

XC6SLX16-2CPG196I - 14k Logic Cells Spartan-6 FPGA | AMD

The AMD (Xilinx) XC6SLX16-2CPG196I is a Spartan-6 LX FPGA built on a 45 nm CMOS process, delivering 14,579 logic cells with 106 user I/Os in a 196-ball 8 mm × 8 mm CSBGA (TFBGA) package, with 576 Kbit of embedded block RAM and integrated DSP slices. The “-2” speed grade and industrial-grade (-40 °C to +100 °C) “I” temperature suffix indicate a -2 speed/performance tier intended for industrial-temperature environments. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built from configurable logic blocks (CLBs), programmable routing, and dedicated hardware resources such as block RAM, multipliers/DSP slices, and clock management tiles (DCMs/PLLs). The Spartan-6 LX series sits in the low-power, low-cost tier of the AMD/Xilinx product hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit. Spartan-6 LX devices target high-volume, cost-sensitive bridging, control, and signal-processing applications that need the parallelism and reconfigurability of an FPGA without the cost of a Virtex-class device. Key features of the XC6SLX16-2CPG196I include: 14,579 logic cells (~2,300 logic slices), 106 maximum user I/Os (some version/board use this number; package allows up to 106), 576 Kbit (72 Kbyte) of block RAM, 32 DSP48A1 slices, four DCMs and two PLLs for clock management, on-chip memory controllers (MCB) for DDR/DDR2/LPDDR, and a 1.2 V core supply with dedicated high-performance/low-power transceiverless I/O banks. The device is implemented on 45 nm process technology, delivering low static and dynamic power versus previous Spartan generations. The -2 speed grade is the mid-tier in the Spartan-6 family and balances Fmax and power for typical industrial designs. Architecturally, the XC6SLX16-2CPG196I uses a register-rich, columnar LUT-6 architecture with dedicated carry chains, distributed RAM/SRL16 shift-register logic in each CLB, and a hard PCIe endpoint block on higher-density siblings (note: LX16 does not include the integrated PCIe block; it is on LX45+). Multiple I/O standards (LVCMOS, LVDS, HSTL, SSTL) are supported with per-bank reference voltages, and the package is lead-free (Pb-free) RoHS-compliant. The 8 × 8 mm CSBGA package supports high-density board layouts in space-constrained designs. Typical applications include industrial motor control and factory automation, automotive infotainment displays and driver-assistance modules, consumer video bridging (HDMI/LVDS), low-cost software-defined radio front-ends, embedded vision pre-processing, and communication backplane bridging. The 576 Kbit of block RAM and 32 DSP slices make the LX16 well suited to small FIR/IIR filters, modest FFT engines, sensor-fusion pre-processing, and glue-logic aggregation. Pairing with a small external SPI flash for configuration memory keeps the BOM lean. When designing with this FPGA, verify that the -2 speed grade meets your target Fmax for the design floorplan, ensure JTAG and DONE pull-up values match the Spartan-6 configuration user guide, and check I/O-bank voltage compatibility before mixing 3.3 V peripherals with 1.2 V core logic. Note: the LX16 does not include the integrated PCIe block; use LX45/LX75/LX100/LX150 if PCIe hard IP is required. This page synthesizes AMD/Xilinx datasheet specifications, distributor pricing as of 2026-10-11, same-package drop-in alternatives within the Spartan-6 family, and practical design notes.

USD $95.16 有庫存
XC6SLX16-2CSG225C - 14,579-LC Spartan-6 FPGA | AMD
XC6SLX16-2CSG225C

XC6SLX16-2CSG225C - 14,579-LC Spartan-6 FPGA | AMD

The AMD XC6SLX16-2CSG225C is a Spartan-6 LX field-programmable gate array with 14,579 logic cells, 589,824 bits of block RAM, and 160 user I/O in a 225-ball CSPBGA package. The -2 device is built on 45 nm CMOS technology and operates from 0°C to +85°C. Its 225-LFBGA package measures approximately 19 mm by 19 mm with a 0.80 mm ball pitch and supports lead-free assembly. A field-programmable gate array, or FPGA, is a reconfigurable digital semiconductor used to implement logic, control, signal processing, and interface functions in programmable hardware. An FPGA belongs to the semiconductor hierarchy and combines configurable logic blocks, programmable I/O, memory resources, dedicated processing blocks, and clocking circuitry. The Spartan-6 LX family is positioned for cost-sensitive, high-volume systems that need more parallelism and performance than a basic microcontroller can provide. The XC6SLX16 combines 14,579 logic cells with 589,824 bits of block RAM and 160 I/O. Dedicated 18×18 multiplier resources support efficient digital signal processing, while cascade and pipelining features allow higher-performance arithmetic and filtering structures. Its programmable I/O and 45 nm architecture are useful for custom bridges, industrial interfaces, embedded control, video data processing, and communication equipment. The -2 suffix identifies the device's performance grade, while CSG225 specifies its 225-ball CSPBGA package. The C suffix identifies the commercial temperature grade. Verified distributor data reports a maximum internal frequency of 667 MHz, although achievable system performance depends on the selected design, timing constraints, I/O standards, clocking architecture, and memory interface configuration. Typical applications include industrial automation and factory control, machine vision, automotive infotainment, consumer video processing, embedded communications, and low-cost PCI-based systems. The 160 available I/O support integration with external memory, transceivers, sensors, displays, and industrial peripherals while the programmable fabric allows product revisions and field updates without changing the PCB. PCB design must follow AMD package, pinout, solder, and thermal guidance. The CSPBGA package requires careful escape routing, a suitable PCB land pattern, adequate power and ground distribution, and attention to via-in-pad or microvia fabrication requirements. Designers should use the published package files and the Spartan-6 configuration data rather than relying on generic BGA assumptions. This product page consolidates verified distributor specifications, lifecycle-relevant sourcing information, same-footprint Spartan-6 alternatives, comparison parameters, and practical implementation guidance. It also distinguishes documented facts from parameters that require confirmation in the complete AMD device documentation before layout or production release.

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XC6SLX16-2CSG225I - Spartan-6 LX 14,579-Cell FPGA | AMD
XC6SLX16-2CSG225I

XC6SLX16-2CSG225I - Spartan-6 LX 14,579-Cell FPGA | AMD

The AMD Xilinx XC6SLX16-2CSG225I is a Spartan-6 LX field-programmable gate array (FPGA) with 14,579 logic cells, 1,139 configurable logic blocks, 24 hardware multipliers, and 144 I/O in a 225-LFBGA CSBGA package. The device is built on 45 nm CMOS technology, operates from a 1.2 V core supply, and is identified with an internal frequency of 667 MHz and a -2 speed grade. The XC6SLX16-2CSG225I also carries the industrial-temperature designation and is intended for cost-sensitive, high-volume embedded systems requiring a balanced combination of programmable logic, DSP resources, and I/O flexibility. A field-programmable gate array is a reconfigurable digital semiconductor in which the logic architecture and interconnect are defined after manufacture. Within the broader semiconductor hierarchy, this FPGA belongs to the programmable-logic device class, combines lookup-table-based combinational logic with programmable routing, and provides deterministic parallel processing for control, acquisition, communications, and signal-processing functions. The Spartan-6 LX family is positioned between fixed-function controllers and larger high-performance FPGAs. The XC6SLX16-2CSG225I provides 14,579 logic cells distributed across 1,139 CLBs, along with 24 dedicated multipliers for DSP-oriented arithmetic. Its 144 I/O support integration with external memory, converters, communication transceivers, and industrial interfaces. The 45 nm CMOS implementation supports a 1.2 V operating supply, while the -2 suffix identifies the device speed grade. The exact I/O standards, memory interface capacity, configuration data rates, and static-power limits are not present in the supplied verified records. The 225-LFBGA CSBGA package supports compact, high-density PCB integration but requires careful escape routing, via-in-pad or via-adjacent fanout, and controlled assembly-planar or ball-grid layouts. Because the verified package descriptions differ between 19 x 19 mm and 13 x 13 mm versions in secondary listings, the package dimensions should be checked against the authoritative AMD package drawing before layout release. The supplied comparison data identifies the target as a 225-pin package and also references a 484-pin listing that does not match the MPN designation. Typical uses include industrial automation and motor control, machine-vision preprocessing, sensor acquisition, programmable control, industrial communications, and embedded signal processing. These applications benefit from parallel I/O, deterministic hardware multipliers, and reconfigurable logic that can be updated without changing the PCB. The -2 speed grade and industrial-grade ordering designation are appropriate selections when a design requires a cost-sensitive Spartan-6 LX implementation rather than a higher-density or higher-performance FPGA. Designers should reserve all power, ground, configuration, clock, and decoupling connections according to the AMD Spartan-6 pinout and PCB guidelines. The verified records identify 144 I/O but do not provide a complete numbered pin map, so the pinout is intentionally not presented here. Programming toolchain compatibility, supported I/O standards, absolute maximum ratings, and exact decoupling requirements must be confirmed in the official AMD documentation for the selected package and speed grade. This product record consolidates verified distributor, manufacturer-resource, and cross-reference findings with engineering-focused application guidance, explicit uncertainty markers, and same-footprint alternatives. It also distinguishes the target from package, speed-grade, and temperature-grade variants that are related components but not automatically interchangeable for every production program.

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XC6SLX16-2CSG324C - 14,579-Cell Spartan-6 LX FPGA | AMD
XC6SLX16-2CSG324C

XC6SLX16-2CSG324C - 14,579-Cell Spartan-6 LX FPGA | AMD

AMD XC6SLX16-2CSG324C is a Spartan-6 LX field-programmable gate array built on a 45 nm process, with 14,579 FPGA cells, 232 I/Os, a -2 speed grade, and a 324-LFBGA package. The device combines programmable logic, block RAM, and DSP resources in a single integrated circuit for compact digital control, signal-processing, communications, and industrial automation designs. Its stated internal frequency is 667 MHz, while its nominal supply voltage is 1.2 V. A field-programmable gate array, or FPGA, is a reconfigurable semiconductor that lets engineers implement digital logic functions through programmable configuration rather than a fixed mask set. Within the broader semiconductor hierarchy, an FPGA is a programmable digital logic device that sits alongside microcontrollers, DSPs, and ASICs. It is useful when a design needs parallel hardware, adaptable interfaces, or logic that can be updated after manufacture. The Spartan-6 LX family combines configurable logic blocks with dedicated block RAM and DSP48 processing resources. The verified product listing identifies 232 I/Os and 14,579 cells, providing a substantial logic surface for control planes, data acquisition, protocol bridges, and embedded signal-processing functions. The -2 suffix denotes the device speed grade, while the CSG324 ordering code identifies the specific 324-ball package variant used by the manufacturer. The supplied data describes the device as a lead-free 19 mm by 19 mm package with 0.80 mm pitch. One retrieved specification identifies the physical description as CSBGA-484, while the distributor listing identifies the orderable package as 324-LFBGA/CSPBGA; these package descriptions require confirmation against the official ordering information before footprint release. The stated operating temperature range is 0°C to 85°C for the version described by the retrieved datasheet source. Typical applications include industrial automation, bridging, communications, consumer equipment, and control systems where programmable logic and parallel I/O are valuable. An FPGA can implement multiple interfaces concurrently, while its configurable architecture allows design revisions without changing the physical device. Compared with a fixed-function ASIC, this flexibility is useful for prototypes and evolving systems, although FPGA power, clocking, and configuration requirements must be considered during design. A key design consideration is confirming the exact package, ball map, voltage requirements, configuration interface, memory resources, and I/O standards against the official AMD Spartan-6 documentation before layout or replacement qualification. This page consolidates verified distributor metadata, pricing references, package information, and drop-in replacement guidance while clearly identifying values that still require manufacturer confirmation. This information is intended for design comparison and sourcing support rather than certification. Spartan-6 LX devices in a common supported package may be pinout compatible, but engineers must verify the specific speed grade, temperature grade, device variant, package, and intended operating conditions before substitution.

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XC6SLX16-2CSG324I - 375 MHz Spartan-6 LX FPGA | AMD
XC6SLX16-2CSG324I

XC6SLX16-2CSG324I - 375 MHz Spartan-6 LX FPGA | AMD

AMD XC6SLX16-2CSG324I is a Spartan-6 LX field-programmable gate array with 14,579 logic cells, 232 user I/Os, a 375 MHz internal frequency, and a 1.14 V to 1.26 V supply range, packaged in a 324-pin CSBGA. The -2 speed grade and industrial-temperature suffix support cost-sensitive designs requiring deterministic programmable logic, generous I/O connectivity, and integration of control, interface, and protocol functions on one device. A field-programmable gate array is a semiconductor whose digital logic and interconnect are configured after fabrication. An FPGA belongs to the broader programmable-logic hierarchy, combining configurable logic blocks, block RAM, digital clock managers, programmable I/O, and dedicated fabric resources. This integration allows a single Spartan-6 device to replace combinations of discrete programmable and fixed-function logic while shortening development schedules for industrial, communications, consumer, and automotive-infotainment equipment. The XC6SLX16-2CSG324I provides 14,579 logic cells and 232 I/Os in a CSBGA-324 package. Its advertised internal frequency is 375 MHz, while its core supply range is 1.14 V to 1.26 V. The part also incorporates DCM and PLL resources for clock generation and phase management. These resources make it suitable for protocol bridges, custom interface controllers, display and control logic, industrial automation modules, and communication equipment requiring programmable high-speed I/O. The Spartan-6 architecture uses 45 nm FPGA technology and combines programmable logic with hardwired resources for common design functions. The -2 designation identifies the performance grade, while the I suffix identifies the industrial-temperature option. The CSG324 package exposes 232 user I/Os in a compact 19 mm by 19 mm, 0.80 mm-pitch lead-free CSBGA arrangement. Its extensive I/O count allows a board to connect external memory, control signals, communications transceivers, sensors, and display peripherals without requiring a separate large companion device. Typical implementations include industrial automation and bridging, automotive-infotainment interfaces, protocol conversion, image and data acquisition, embedded control, and communications infrastructure. The large I/O count is especially useful when a design must connect several external buses or high-pin-count memory devices. The device should be selected only after confirming that the required clocks, RAM, I/O standards, pin assignments, and peripheral resources fit the selected CSG324 variant. PCB implementation requires careful attention to power, ground, and signal integrity across the dense BGA. Follow the manufacturer's CSG324 pinout files when assigning PCB balls, and verify each I/O standard, voltage, and termination requirement against the design. Because no explicit XC6SLX16-2CSG324I pin table appears in the retrieved records, use the official AMD Spartan-6 package pinout file rather than inferring ball assignments from another package variant. This page combines the exact device identity, operating figures, package information, drop-in options, comparison parameters, and engineering guidance needed for initial design review. It also highlights the distinction between device-level alternatives that preserve the CSG324 footprint and unrelated packages that are not true drop-in replacements.

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XC6SLX16-2FT256C - 14,579-Cell Spartan-6 FPGA | AMD
XC6SLX16-2FT256C

XC6SLX16-2FT256C - 14,579-Cell Spartan-6 FPGA | AMD

The AMD XC6SLX16-2FT256C is a Spartan-6 LX field-programmable gate array with 14,579 configurable logic cells, 186 I/O, a 667 MHz internal frequency, and a 256-ball lead-free LBGA package. It uses 45 nm CMOS technology and a 1.2 V core supply, providing a compact programmable-logic platform for industrial, consumer, communications, and embedded-control systems. A field-programmable gate array is a semiconductor device whose digital logic, interconnect, and I/O behavior are configured after manufacture. In the product hierarchy, an FPGA sits above programmable logic devices and combines configurable logic blocks, block RAM, dedicated arithmetic resources, programmable I/O, and embedded processors. This integration allows one package to replace multiple programmable logic devices and supporting discrete components while shortening development cycles. The verified specifications identify 14,579 configurable cells, 1,139 CLBs, 186 I/O, a 667 MHz internal frequency, and 45 nm CMOS fabrication. The -2 suffix identifies the middle Spartan-6 LX speed grade, while C identifies the commercial temperature grade. These resources support parallel data processing, control-plane logic, communication bridges, signal conditioning, and general-purpose embedded systems without requiring a mask change for each design. As an FPGA, the XC6SLX16-2FT256C combines programmable digital logic with fixed physical resources. Its 186 I/O provide external connectivity, while the 256-ball surface-mount package supports compact board layouts. The 45 nm process and 1.2 V core supply place the device in a mature, low-power programmable-logic architecture intended for cost-sensitive designs that require more integration than discrete logic but less complexity than a large FPGA. Typical applications include industrial automation, industrial networking, video and image processing, consumer equipment, communications infrastructure, and embedded control. The Spartan-6 LX family is specifically identified as suitable for advanced bridging applications, automotive infotainment, consumer products, and industrial automation. A board using this device also requires a suitable configuration memory or boot interface, compliant power rails, clocking, decoupling, and careful signal-integrity routing. Designers should verify the exact FT256 pinout, supported I/O standards, configuration method, power-supply sequencing, and startup behavior in the AMD package files before layout release. Because the verified data does not provide the complete 256-ball pin map, no pin names should be inferred from generic BGA numbering. Differential interfaces should be routed with controlled length and impedance, while FPGA power and ground pins should follow the manufacturer's published connectivity and plane guidance. This product page consolidates distributor availability, package information, speed-grade variants, and practical replacement guidance in one engineering-focused reference. It also distinguishes true FT256 pin-compatible alternatives from package-only equivalents and clearly identifies specifications that require confirmation from the AMD Spartan-6 documentation.

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XC6SLX16-2FT256I - Spartan-6 LX FPGA, 14K LCs, 256-BGA | AMD
XC6SLX16-2FT256I

XC6SLX16-2FT256I - Spartan-6 LX FPGA, 14K LCs, 256-BGA | AMD

The AMD (formerly Xilinx) XC6SLX16-2FT256I is a Spartan-6 LX family Field Programmable Gate Array (FPGA) with 14,579 logic cells, 589,824 bits of block RAM, and 186 user I/O, housed in a 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA-256) package with industrial-grade -40C to +100C temperature rating and -2 speed grade performance. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon IP such as block RAM, DSP slices, and clock management tiles (CMTs). FPGAs occupy a position between general-purpose microcontrollers (software-defined behavior, sequential execution) and application-specific integrated circuits (ASICs, fixed function, highest performance per watt). The Spartan-6 family specifically targets cost-sensitive, high-volume applications where ASIC NRE costs are prohibitive but microcontroller performance is insufficient. Key features of the XC6SLX16-2FT256I include 2,278 Kbits total block RAM, 32 DSP48A1 slices for fixed-point and signal-processing arithmetic, four clock management tiles (CMTs) with digital clock managers (DCMs) and phase-locked loops (PLLs), and integrated SelectIO technology supporting single-ended and differential I/O standards up to 1080 Mbps. The device is fabricated on a 45 nm CMOS process and operates from a 1.2 V core supply with separate I/O bank voltages from 1.2 V to 3.3 V. Architecturally, the Spartan-6 LX family uses a 6-input LUT-based logic fabric with dedicated carry chains, distributed SRL16/SRL32 shift-register primitives, and a 16-bit block RAM/FIFO controller per BRAM tile. The 256-ball FTBGA package provides 186 effective user I/O after accounting for power, ground, configuration, and dedicated JTAG pins. Typical applications include industrial motor control, video processing pipelines, low-cost software-defined radio, LED video wall controllers, and embedded vision pre-processing. The 256-BGA package suits designs requiring dense I/O and moderate thermal dissipation. When designing with this device, ensure proper decoupling with 100 nF ceramic capacitors at every supply pin and a 4.7-10 uF bulk capacitor near the core rail. Configuration can be sourced from SPI flash, JTAG, or BPI parallel memory; the dedicated DONE and INIT_B pins must be monitored for proper startup sequencing. This page synthesizes distributor pricing, verified drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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XC6SLX16-2FTG256C - Spartan-6 LX FPGA, 14K Cells, 256-BGA
XC6SLX16-2FTG256C

XC6SLX16-2FTG256C - Spartan-6 LX FPGA, 14K Cells, 256-BGA

The AMD (Xilinx) XC6SLX16-2FTG256C is a member of the Spartan-6 LX family of field-programmable gate arrays (FPGAs) providing 14,579 logic cells (approximately 1,139 CLBs), 589,824 bits of block RAM, and 186 maximum user I/Os in a 256-ball fine-pitch thin BGA (FTG256) package. Built on a 45 nm CMOS process, the LX variant targets low-cost, high-volume applications with an emphasis on logic density and embedded memory, while delivering typical core performance up to 667 MHz. FPGAs are programmable logic devices that allow hardware designers to implement arbitrary digital circuits, ranging from glue logic and bus bridges to full processor subsystems and DSP pipelines. The Spartan-6 LX series specifically targets cost-sensitive, high-volume designs such as consumer electronics, industrial control, automotive infotainment, and communications infrastructure. Within the broader taxonomy, FPGAs sit alongside CPLDs (less-dense, non-volatile), ASICs (fixed-function, high-volume), and microcontrollers (software-programmed sequential); FPGAs uniquely offer hardware-level parallelism with reconfigurable logic. Key features of the XC6SLX16 include the 256-ball FTG256 package at 1.0 mm ball pitch, a 17×17 mm body, lead-free/RoHS-compliant construction, and an industrial-class (-2) speed grade. The device integrates dual 10/100/1000 Ethernet MACs, dedicated DSP slices (32 of them, totaling 8.18 GMAC/s when fully packed), and 32 BRAM blocks supporting 18 Kb each. Configuration is supported through JTAG (IEEE 1149.1/1532), SPI (x1, x2, x4), and BPI (x8, x16) modes, while clock management is handled by up to 4 clock management tiles (CMTs) containing mixed-mode clock managers and PLLs. Typical applications include high-volume bridging between legacy video or memory interfaces and modern SoCs, motor control loops, low-cost industrial Ethernet endpoints, video processing pipelines, and embedded soft-processor cores such as MicroBlaze or PicoBlaze. Designers frequently pair the Spartan-6 LX with companion DDR memory controllers and high-speed serial transceivers (where required by the chosen package). A critical design consideration with the XC6SLX16-2FTG256C is its lifecycle status: the Spartan-6 family is generally considered NRND (Not Recommended for New Designs) per AMD/Xilinx's product longevity notice. Engineers building production hardware should evaluate Artix-7 or Spartan-7 successors for new projects while keeping this part viable for maintenance of legacy designs. Power decoupling, multi-bank I/O voltage referencing, and bitstream encryption (AES-256) also require careful PCB and firmware planning. This page synthesizes authorized distributor pricing, same-package drop-in alternatives, and practical hardware-design guidance that goes beyond the datasheet's typical-application notes — including lifecycle awareness for engineers managing long-life industrial installations.

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XC6SLX16-2FTG256I - 14,579-Cell Spartan-6 LX FPGA | AMD
XC6SLX16-2FTG256I

XC6SLX16-2FTG256I - 14,579-Cell Spartan-6 LX FPGA | AMD

The AMD XC6SLX16-2FTG256I is a Spartan-6 LX field-programmable gate array with 14,579 configurable logic cells, 1,139 CLBs, 186 I/Os, and a stated internal frequency of 667 MHz, packaged in a 256-pin lead-free FTGBGA. The -2 speed grade and I temperature designation identify this device as an industrial-oriented Spartan-6 LX option for cost-sensitive embedded systems requiring substantial programmable logic, dedicated block RAM, DSP resources, and clock-management capability. A field-programmable gate array is a semiconductor whose digital logic, memory, and signal-processing blocks are configured after fabrication. In the product hierarchy, an FPGA sits above programmable logic devices and integrates configurable logic, fixed or block memory, DSP processing, clock management, and programmable I/O. This integration allows one package to replace combinations of processors, interface controllers, data converters, and discrete programmable logic while preserving upgradeability through a configuration bitstream. Key resources include 2,278 adaptive logic modules, 186 user I/Os, 14,579 logic cells, and 1,139 CLBs. The source data also identifies 375 MHz as another stated frequency and gives a core-voltage range of 1.14 V to 1.26 V. The FTG256 package uses a 17 mm by 17 mm body with a 1 mm ball pitch, supporting dense PCB integration without requiring a large leaded package. The Spartan-6 LX architecture combines programmable logic with block RAM, DSP slices, digital clock managers, and PLLs. Those resources allow parallel data-path designs, protocol bridging, control-plane logic, and fixed-point signal processing to share one FPGA. A 667 MHz stated internal frequency supports demanding clock domains, but achievable system performance remains dependent on the selected design, timing constraints, memory interface implementation, and I/O standards. Typical uses include industrial control and automation, embedded communications gateways, video and image-processing pipelines, instrumentation, and low-cost data-acquisition systems. In these applications, the 186 I/Os provide connectivity, while the 14,579 logic cells allow control logic and datapaths to be consolidated. The Spartan-6 family is particularly relevant to designs that require FPGA flexibility without moving to a larger or more expensive device family. Designers should use the official Spartan-6 package pinout files for every FTG256 ball assignment and verify the selected bank supplies, configuration pins, clock-capable pins, and I/O standards against the design constraints. PCB layout must also account for the 1 mm pitch, power and ground distribution, configuration-boot behavior, and high-speed routing required by the implemented interfaces. This page consolidates the verified specifications, distributor pricing, same-footprint alternatives, and application-oriented design guidance available for the XC6SLX16-2FTG256I. It also distinguishes documented values from unresolved lifecycle, pin-level, and pricing details so engineers can make a traceable sourcing decision.

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XC6SLX16-3CPG196C - Spartan-6 LX FPGA 14579 Cells 106 I/O | AMD
XC6SLX16-3CPG196C

XC6SLX16-3CPG196C - Spartan-6 LX FPGA 14579 Cells 106 I/O | AMD

The AMD (Xilinx) XC6SLX16-3CPG196C is a Spartan-6 LX family Field Programmable Gate Array delivering 14,579 cells, 1,451 Kbits of block RAM, and 106 user I/O in a 196-ball CSBGA (0.5 mm pitch, 8x8 mm) package. The device operates at the -3 speed grade, the highest performance bin in the Spartan-6 LX series, with a maximum internal clock frequency of 667 MHz and 1.2 V core supply. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor that combines configurable logic blocks, programmable interconnect, and dedicated silicon resources such as block RAM, DSP slices, and clock managers. FPGAs sit between general-purpose microcontrollers and fixed-function ASICs in the digital-logic hierarchy: they deliver ASIC-level performance and parallelism while remaining reprogrammable in the field. The Spartan-6 family specifically targets cost-sensitive, high-volume applications where power consumption, density, and price-per-logic-cell are critical. Key features of the XC6SLX16-3CPG196C include 14,579 logic cells, 1,451 Kbits of block RAM (576 Kbits dual-port), 32 DSP48A1 slices, 2 clock management tiles (CMTs), and 2 PCIe hard IP blocks. The 106 available user I/Os support multiple I/O standards including LVCMOS, LVDS, and LVTTL at programmable slew rates and strengths. The CSBGA-196 package (8x8 mm body, 0.5 mm ball pitch) suits compact, high-density PCB layouts. The Spartan-6 LX architecture is built on a 45 nm CMOS process and provides lower static and dynamic power than the prior Spartan-3A generation. The device integrates a hard PCIe endpoint block (1-lane Gen1), hard memory controllers for DDR/DDR2/DDR3/LPDDR, and a high-speed GTP serial transceiver-free design (the LX family omits transceivers, unlike the LXT). The -3 speed grade delivers the highest Fmax in the family. Typical applications include industrial motor and motion control, video surveillance and image processing, low-cost PCIe endpoint cards, consumer display controllers, and embedded DSP systems. The CSBGA-196 footprint is particularly suitable for space-constrained designs such as portable test equipment and 4-layer FR4 carrier boards. The 45 nm process and 1.2 V core reduce thermal dissipation compared to older 90 nm and 65 nm FPGA families. When designing with this device, allocate sufficient decoupling capacitance (typically 100 nF and 4.7 uF combinations) at each supply pin and follow AMD's Spartan-6 PCB Design Guide for controlled-impedance routing. The 0.5 mm pitch CSBGA requires via-in-pad or laser-drilled microvia technology on standard 4-layer boards; ensure your PCB fabrication process supports the pitch before committing to layout.

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XC6SLX16-3CPG196I - Spartan-6 LX FPGA | AMD Embedded
XC6SLX16-3CPG196I

XC6SLX16-3CPG196I - Spartan-6 LX FPGA | AMD Embedded

AMD XC6SLX16-3CPG196I is a Spartan-6 LX field-programmable gate array built on 45 nm technology, providing 106 user I/O, a listed internal frequency of 667 MHz, and a 196-ball TFBGA package. The -3 designation identifies the high-performance Spartan-6 LX speed grade, while the CPG196 package provides a compact 19 x 19 mm surface-mount option with a 0.80 mm ball pitch. A field-programmable gate array is a programmable digital semiconductor that falls within the broader semiconductor and programmable-logic hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA combines configurable logic, memory resources, and programmable I/O in one device. This flexibility allows designers to implement parallel data paths, control logic, protocol interfaces, signal processing, and embedded systems while retaining a hardware platform that can be revised through configuration files. The Spartan-6 LX architecture provides 14,579 logic cells, 106 I/O, and the -3 performance grade identified in the product listing. The 196-ball CSBGA package is lead-free and uses a compact 0.80 mm pitch. These characteristics make the XC6SLX16-3CPG196I useful when board area is constrained but the design still requires programmable logic, moderate I/O density, and dedicated FPGA resources. The 45 nm Spartan-6 generation combines configurable logic with block RAM and DSP resources for control, communications, data acquisition, and embedded-processing designs. At the system level, the 106 available I/O support connections to external memory, transceivers, sensors, converters, and digital peripherals. Designers must complete timing closure for the selected speed grade, configure the device through the appropriate AMD FPGA toolchain, and implement power, decoupling, clocking, and I/O standards appropriate to the target board. Typical uses include industrial automation, motor and motion control, test and measurement, embedded communications, instrument interfaces, and low-to-medium complexity signal-processing systems. The -3 speed grade is the principal reason to select this exact ordering code when maximum Spartan-6 LX performance is preferred over the lower -2 and L1 speed grades. A critical design consideration is that the compact BGA package demands careful PCB layout, especially for power delivery, exposed-pad thermal management, high-speed routing, and ball-grid alignment. Decoupling should be placed directly beside the relevant supply balls, and the design should follow AMD's package, power, and layout guidance before release to fabrication. This page combines the device's exact ordering information, package characteristics, verified drop-in alternatives, application guidance, and design considerations. It also distinguishes true same-footprint options from superficially similar Spartan-6 devices that cannot replace the target without changing temperature grade, speed grade, logic density, or package.

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XC6SLX16-3CSG225C - 14,579-Cell FPGA, 160 I/O | AMD
XC6SLX16-3CSG225C

XC6SLX16-3CSG225C - 14,579-Cell FPGA, 160 I/O | AMD

AMD XC6SLX16-3CSG225C is a Spartan-6 LX field-programmable gate array with 14,579 logic elements, 160 I/O, 576 Kbit of embedded memory, and a 667 MHz internal frequency in a 225-LFBGA, CSPBGA package. The -3 speed grade is the highest-performance grade listed for the Spartan-6 LX family, while the C suffix identifies the commercial-temperature ordering option. A field-programmable gate array, or FPGA, is a programmable digital integrated circuit that belongs to the semiconductor and programmable-logic hierarchy. Unlike a fixed-function logic device, an FPGA contains configurable logic, memory, and I/O resources that engineers program to implement digital control, signal processing, communications, and interface functions. The Spartan-6 LX family combines programmable logic with integrated block RAM and dedicated input/output resources for cost-sensitive embedded designs. The XC6SLX16-3CSG225C provides 14,579 logic elements organized into 2,278 adaptive logic modules, 160 user I/O, and 576 Kbit of embedded memory. Its listed 667 MHz internal frequency supports timing-driven designs requiring deterministic programmable logic. The 45 nm FPGA process provides a mature implementation platform for industrial control, communications, instrumentation, embedded video, and general-purpose prototyping systems. The -3 designation selects the highest performance rating in the compared Spartan-6 LX speed-grade set. The commercial C temperature option is listed from 0°C to 85°C, making the device appropriate for equipment operating within that commercial range. The 225-LFBGA, CSPBGA package also supports compact board layouts, but its fine 0.80 mm pitch requires careful escape routing, clean ground-plane design, and assembly-process control. Typical uses include industrial automation controllers, sensor and measurement interfaces, communications equipment, embedded control systems, and FPGA-based test platforms. The Spartan-6 architecture is especially useful when designs need configurable parallel interfaces, serial transceivers, clocking, block RAM, and deterministic logic in one programmable device rather than a combination of fixed-function ICs. PCB planning should begin with the AMD package pinout file and the Spartan-6 device datasheet. Preserve a continuous ground reference beneath the BGA, route high-speed signals with controlled impedance, provide suitable decoupling at supply pins, and follow the package-specific layout guidance before releasing the board to fabrication. This product page combines the device identity, programming-relevant resource counts, package characteristics, speed-grade differences, practical PCB guidance, and same-package replacement options. It supports faster engineering selection by separating what changes between orderable variants from what remains constant in the Spartan-6 LX design family.

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XC6SLX16-3CSG225I - Spartan-6 14,579-LC FPGA | AMD
XC6SLX16-3CSG225I

XC6SLX16-3CSG225I - Spartan-6 14,579-LC FPGA | AMD

AMD XC6SLX16-3CSG225I is a Spartan-6 LX field-programmable gate array built on 45 nm CMOS, with 14,579 logic cells, 2,278 adaptive logic modules, 1,139 configurable logic blocks, 160 I/O, and a maximum internal clock frequency of 862 MHz. It is packaged in a 225-pin CSBGA on a 13 mm × 13 mm body with a 0.80 mm ball pitch. A field-programmable gate array is a programmable-logic semiconductor in which digital logic functions are configured after fabrication. An FPGA belongs to the broader hierarchy of programmable logic devices, semiconductor integrated circuits, and digital logic components. Spartan-6 devices combine configurable logic, block RAM, programmable I/O, and dedicated processing resources in a single package, allowing compact implementations of control, interface, signal-processing, and communication systems. The -3 speed designation identifies the highest-performance Spartan-6 LX speed grade identified in the manufacturer documentation. This device provides 576 kbit of embedded memory, 24 multipliers, and 160 user I/O. Its 225-LFBGA, CSPBGA package supports dense PCB integration, while the lead-free construction and RoHS-compliant status suit current production requirements. The industrial-order suffix distinguishes this ordering option from the commercial-temperature CSG225C version. Spartan-6 LX architecture is intended for medium-complexity designs where programmable logic offers faster schedule flexibility than a custom ASIC. The 45 nm CMOS process combines configurable logic blocks with dedicated memory and arithmetic resources. A design can use parallel processing paths, serial transceivers, clock-management resources, and programmable I/O blocks without implementing those functions as separate discrete devices. Typical uses include industrial automation, embedded control, video and image processing, communications infrastructure, instrumentation, and consumer equipment requiring a compact logic platform. The 160-I/O count supports interfaces to external memory, converters, transceivers, and display or sensing hardware, while 576 kbit of block RAM enables packet buffering, data acquisition, and local storage. PCB implementation requires careful BGA escape routing, uninterrupted supply and ground distribution, and decoupling close to the power balls. Because the -3 grade provides the highest performance in the Spartan-6 LX family, verify timing closure at the intended clock frequency and use the manufacturer pinout and configuration guidance before releasing the board layout. This product page combines the principal FPGA specifications, package details, ordering-grade differences, and same-footprint alternatives with practical design guidance. It helps engineers distinguish speed-grade, temperature-grade, and package variations before making a production BOM decision.

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XC6SLX16-3CSG324C - 14,579-Cell Spartan-6 LX FPGA | AMD
XC6SLX16-3CSG324C

XC6SLX16-3CSG324C - 14,579-Cell Spartan-6 LX FPGA | AMD

The AMD XC6SLX16-3CSG324C is a Spartan-6 LX field-programmable gate array with 14,579 logic cells, 232 I/O, 589,824 RAM bits, and a 667 MHz internal frequency, packaged in a 324-CSPBGA. The -3 designation identifies the highest-performance Spartan-6 speed grade in the provided source data, while the C suffix denotes the commercial operating-temperature option. A field-programmable gate array, or FPGA, is a programmable digital semiconductor that combines configurable logic, block RAM, programmable I/O, and dedicated processing resources on one device. Within the semiconductor hierarchy, an FPGA belongs to the programmable-logic class and provides a hardware alternative to combining numerous discrete logic devices. It is widely used when design changes, parallel processing, high I/O density, or rapid product customization are more important than the lowest unit cost. The XC6SLX16 offers 14,579 logic cells organized into 1,139 LABs and CLBs, together with 589,824 bits of embedded block RAM. Its 232 user I/O support communication links, control interfaces, memory connections, and mixed-signal system integration. The 667 MHz internal frequency provides a concrete timing reference for clocked digital designs, although achievable system performance depends on the selected tools, constraints, memory interfaces, and I/O standards. This device is built on a 45 nm FPGA process and supports operating supply voltages from 1.14 V to 1.26 V. The 324-CSPBGA package supports dense surface-mount assembly while exposing a substantial pin count for high-bandwidth designs. The commercial-grade part is specified for a 0 °C to 85 °C operating range, making it appropriate for cost-sensitive equipment operating in controlled commercial environments rather than extended industrial temperature conditions. Typical uses include real-time digital signal processing, video encoding and decoding, image processing, image enhancement, industrial automation, programmable control, and high-performance computing accelerators. Its combination of logic, memory, and 232 I/O permits a complete parallel pipeline to be consolidated into one FPGA. Dedicated block RAM can buffer video lines or sample data, while programmable logic can implement filters, protocol converters, and control algorithms. Designers should obtain the AMD Spartan-6 package pinout file before assigning any board-level pins and verify the selected package, voltage requirements, and pinout against the device documentation. The provided search results conflict on package dimensions, so the exact body size and ball-pitch information must be checked in the authoritative package drawing rather than inferred from third-party listings. Commercial-temperature operation should also be confirmed against the enclosure temperature. This product page consolidates the verified distributor specifications, price, source links, package identity, and same-family drop-in options into an engineering-focused reference. It also distinguishes documented facts from unavailable details, helping teams compare sourcing options while avoiding unsupported package, pinout, or timing assumptions.

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XC6SLX16-3CSG324I - 45nm Spartan-6 FPGA | AMD
XC6SLX16-3CSG324I

XC6SLX16-3CSG324I - 45nm Spartan-6 FPGA | AMD

The AMD XC6SLX16-3CSG324I is a Spartan-6 LX field-programmable gate array built on 45 nm technology, with 14,579 logic cells, 589,824 RAM bits, 232 I/Os, and a 1.14 V to 1.26 V supply range in a 324-ball CSBGA package. The -3 speed grade targets maximum Spartan-6 LX performance, while the I suffix denotes the industrial-temperature option. A field-programmable gate array is a semiconductor whose digital logic, interconnect, memory blocks, and input/output behavior are configured after manufacture. Within the programmable-logic hierarchy, an FPGA sits above fixed-function logic and combines configurable logic elements with block RAM, digital clock managers, and programmable I/O. This architecture allows one board design to support multiple protocols or algorithms through a configuration bitstream rather than a redesign of a custom ASIC. The device provides 14,579 logic cells and 589,824 bits of RAM, creating a compact platform for parallel digital signal processing, control logic, protocol bridging, and embedded data acquisition. Its 232 I/Os provide substantial connectivity for parallel buses, clocks, controls, and high-speed interfaces. The listed internal frequency is 667 MHz, while published summaries also identify a 400 MHz operating or processing frequency for this device. External memory interfaces and high-speed transceiver capabilities should therefore be checked against the specific design requirements. The CSG324 package uses a 0.80 mm ball pitch and measures approximately 19 mm by 19 mm. Its 324-ball construction supports dense routing to FPGA logic and memory resources, but PCB layout must follow AMD package and pinout documentation. Spartan-6 LX devices in the same supported package are pinout compatible, making speed- and temperature-grade alternatives practical when timing or commercial-temperature requirements differ. Typical uses include industrial automation, test and measurement, automotive infotainment, consumer bridging, communications gateways, and embedded control. The 14,579-cell device is especially appropriate for designs requiring deterministic parallel logic and moderate on-chip RAM without moving to a larger FPGA family. A design must still close timing for the selected speed grade and verify pin-compatible power, configuration, and interface requirements. Careful power planning is essential because both dynamic and static consumption depend on the selected configuration, clocking, I/O activity, and environmental conditions. Place decoupling capacitors at the relevant power pins, follow the AMD Spartan-6 package pinout files during routing, and validate the final configuration and bitstream against the production PCB. This page combines package, logic-resource, I/O, memory, and voltage information with speed-grade alternatives, engineering design notes, and application guidance. It provides a practical basis for determining whether the XC6SLX16-3CSG324I fits a design before detailed timing closure and board validation begin.

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XC6SLX16-3FT256C - 14,579 Logic Cell Spartan-6 FPGA | AMD
XC6SLX16-3FT256C

XC6SLX16-3FT256C - 14,579 Logic Cell Spartan-6 FPGA | AMD

AMD XC6SLX16-3FT256C is a Spartan-6 LX field-programmable gate array with 14,579 logic elements, 1,139 configurable logic blocks, 589,824 bits of block RAM, and a maximum clock frequency of 667 MHz, packaged in a 256-LBGA. The device combines programmable logic, embedded memory, programmable I/O, and dedicated FPGA resources in a single 45 nm CMOS device for embedded and cost-sensitive digital systems. A field-programmable gate array is a semiconductor whose digital logic, interconnections, and I/O behavior are configured after manufacture. The Spartan-6 LX family belongs to the broader FPGA hierarchy and provides parallel programmable logic, block RAM, digital signal processing resources, and clock-management functions. This makes the device useful where a fixed application-specific integrated circuit would be inflexible or uneconomic to develop. The XC6SLX16-3FT256C provides 14,579 logic elements arranged across 1,139 CLBs, with 589,824 total RAM bits supporting data buffering, packet handling, and general-purpose embedded storage. Its reported 667 MHz maximum clock frequency provides useful timing margin for control logic, interface bridges, instrumentation, and embedded processors. The -3 speed designation identifies its performance grade within the Spartan-6 LX family. Built on 45 nm CMOS technology, the device supports a 1.2 V core supply as identified in the verified product records. Its 256-LBGA package uses a 1 mm pitch and measures approximately 17 mm by 17 mm. The supplied comparison data also identifies 186 I/O resources, allowing the device to interface multiple buses, peripherals, and external control signals while preserving a compact surface-mount footprint. Typical uses include industrial automation, communications equipment, embedded control, test and measurement, signal processing, and compact network interfaces. The combination of programmable logic, block RAM, and 186 I/O permits designers to consolidate parallel control, data buffering, and protocol handling in one device. A complete design still requires suitable clocking, configuration storage, decoupling, and board-level signal-integrity implementation. When planning a board, verify every BGA-256 land pattern against the AMD Spartan-6 package pinout files and the selected device’s official package drawing. The -3 speed grade and commercial C suffix must also be treated as part of the exact ordering code rather than assumed interchangeable with other Spartan-6 grades or temperature options. This page consolidates the verified distributor specifications, 256-LBGA sourcing information, same-family replacement candidates, pricing evidence, and practical FPGA design considerations into one engineering-focused reference. It distinguishes directly documented facts from package details or operating parameters that still require confirmation from the complete AMD device documentation.

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XC6SLX16-3FT256I - Spartan-6 LX FPGA, 14579 Cells, 186 I/O | AMD
XC6SLX16-3FT256I

XC6SLX16-3FT256I - Spartan-6 LX FPGA, 14579 Cells, 186 I/O | AMD

The AMD/Xilinx XC6SLX16-3FT256I is a Spartan-6 LX field programmable gate array (FPGA) delivering 14,579 logic cells, 1,139 configurable logic blocks (CLBs) and 186 user I/O, with a maximum internal clock frequency of 667 MHz on a 1.2 V core supply, packaged in a 256-ball FTBGA (FT256) surface-mount package measuring 17 x 17 mm with 1.0 mm ball pitch. An FPGA is a reconfigurable digital integrated circuit whose logic, memory and I/O are defined by a bitstream loaded at power-up. A logic cell contains a lookup table plus flip-flops and routing resources, and thousands of such cells are interconnected by a programmable switch matrix. The Spartan-6 LX family is the logic-optimized member of the Spartan-6 series: it targets designs dominated by wide datapaths, control logic, protocol bridges and video/interface consolidation rather than maximum DSP density. In the device hierarchy, this part sits as a programmable logic device within the FPGA & CPLD family of integrated circuits. Key characteristics of the XC6SLX16-3FT256I include the -3 speed grade, which is the highest-performance Spartan-6 LX grade available, and a 45 nm CMOS process node that keeps both static power and dynamic power manageable in cost-sensitive embedded systems. The device provides 186 user I/O in a compact 256-ball grid, which is a high I/O-to-logic ratio for a device of this size. Temperature handling is specified as 0 C to +85 C (32 F to 185 F) with industrial-grade parts marking, and the FT256 package is offered in a lead-free configuration. Technically, the device combines LUT-based six-input logic architecture with dedicated block RAM for data buffering and DSP-oriented arithmetic, plus SelectIO resources that support high-speed memory interfaces and common I/O standards through selectable I/O drivers. Because the device is a -3 grade part, timing closure is the easiest of the Spartan-6 LX options, giving the highest achievable system clock and the greatest margin on demanding multi-clock domains. Configuration is handled through the standard Xilinx JTAG and configuration interface scheme, supporting both persistent and reconfiguration-oriented design flows. Typical applications include industrial control and PLC I/O expansion, industrial Ethernet and fieldbus bridging, video and image datapath consolidation, USB and multi-protocol interface hubs, motor and motion control sequencers, and compact embedded control platforms for aerospace, telecommunications and consumer networking equipment. When designing with this device, plan the power budget and thermal design around the 1.2 V core supply and the I/O supply rails, and confirm the pinout against the AMD Spartan-6 package pinout files for the FT256 package before layout. Because the FT256 package is a dense 1.0 mm-pitch BGA, a fine-pitch assembly and adequate solder mask and paste control are required to avoid bridging defects. This page consolidates distributor pricing, verified drop-in replacement options, and packaging and thermal design notes for the XC6SLX16-3FT256I that are not consolidated in any single manufacturer document, so engineers can evaluate the device and its alternates before committing a PCB layout.

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XC6SLX16-3FTG256C - Spartan-6 LX FPGA, 14k LCs, 256-FTBGA | AMD
XC6SLX16-3FTG256C

XC6SLX16-3FTG256C - Spartan-6 LX FPGA, 14k LCs, 256-FTBGA | AMD

The AMD (formerly Xilinx) XC6SLX16-3FTG256C is a Spartan-6 LX field-programmable gate array (FPGA) providing 14,579 logic cells, 186 maximum user I/Os, and 256 Kbits of distributed RAM in a 256-ball fine-pitch thin-ball grid array (FTBGA-256, 17 x 17 mm, 1.0 mm pitch). It uses 45 nm CMOS process technology and operates from a 1.2 V core supply with multi-voltage I/O support. An FPGA (Field-Programmable Gate Array) is a programmable logic device that lets engineers implement arbitrary digital circuits using configurable logic blocks (CLBs), programmable I/Os, on-chip memory, and dedicated hard IP such as transceivers, DSP slices, and clock management tiles. FPGAs are part of the programmable logic hierarchy alongside CPLDs and sit between discrete logic and ASICs in system design trade-offs. The XC6SLX16-3FTG256C features 1139 CLBs, 32 DSP48A1 slices, two clock management tiles (CMTs) with mixed-mode clock managers (MMCMs) and PLLs, and SelectIO high-performance I/O supporting LVDS, LVCMOS, LVTTL, SSTL, and HSTL standards across 8 I/O banks. The -3 speed grade targets high-performance designs with up to 667 MHz internal clocking. Typical applications include industrial motor control, video processing pipelines, automotive driver assistance, low-cost wireline aggregation, and embedded control systems. Its small 17 x 17 mm BGA footprint suits cost-sensitive high-volume designs. Design tips: pay careful attention to the banked I/O supply pins (VCCO), keep the auxiliary supply VCCAUX at 2.5 V to 3.3 V, and use the -C commercial temperature grade (0 C to +85 C) only inside chassis environments. This page aggregates DigiKey/Mouser distributor pricing, same-footprint alternatives in the Spartan-6 family, and 45 nm power-rail guidance not found in the manufacturer datasheet.

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XC6SLX16-3FTG256I - Spartan-6 LX FPGA, 14K Logic Cells, 256-FTBGA | AMD Xilinx
XC6SLX16-3FTG256I

XC6SLX16-3FTG256I - Spartan-6 LX FPGA, 14K Logic Cells, 256-FTBGA | AMD Xilinx

The AMD Xilinx XC6SLX16-3FTG256I is a Spartan-6 LX field-programmable gate array (FPGA) integrating 14,579 logic cells (1,139 Configurable Logic Blocks), 589,824 bits of block RAM, and 186 user I/O into a 256-ball fine-pitch thin-ball grid array (FTBGA, 17 x 17 mm, 1.0 mm pitch) package, qualified to the industrial temperature range (-40C to +100C). It belongs to the -3 speed grade, the highest performance tier within the Spartan-6 LX family, and is fabricated on a 45 nm CMOS process that lowers static power relative to earlier 65 nm Spartan generations while preserving the 667 MHz internal operation supported by the silicon. A field-programmable gate array (FPGA) is a semiconductor device built from an array of programmable logic blocks, programmable interconnect, programmable I/O cells, and dedicated hard IP such as block RAM, DSP slices, and clock management tiles. Within the broader taxonomy it sits alongside CPLDs, gate arrays, and ASICs as a re-programmable digital logic device; FPGAs differ from CPLDs mainly in density and architectural granularity, and differ from ASICs by being configurable post-fabrication. The Spartan-6 LX family is positioned by AMD Xilinx as the cost-optimized, low-power member of the Spartan-6 generation, ideal for bridging, display, and motor-control in ASICs and ASSPs. Key features include integrated block RAM up to 589,824 bits, dual 10/100/1000 Mbps Ethernet MAC hardening options, a low-power 45 nm process with 1.2 V core voltage, integrated PCI Express endpoint block in LXT variants, and a programmable I/O voltage range that supports common single-ended and differential standards. The CLB array contains 1,139 logic cells arranged to deliver balanced logic, memory, and DSP resources, and the package's fine-pitch BGA delivers compact board area while keeping signal integrity manageable for the supported I/O rates. Spartan-6 LX uses the proven 45 nm CMOS process and the 6th-generation Xilinx FPGA architecture, bringing logic, block RAM, DSP48A1 slices, and clock management tiles (CMT) into a low-cost fabric. Memory controllers (hard MCBs) support DDR, DDR2, DDR3, and LPDDR external memory interfaces up to 800 Mb/s data rates, and the integrated GTP serial transceivers in LXT parts deliver multi-gigabit connectivity for cost-sensitive serial links. Typical applications for the XC6SLX16-3FTG256I include industrial motor-control and PLC backplanes, low-cost video bridging and consumer display controllers, automotive infotainment and telematics subsystems, machine-vision front ends, and PCIe endpoint cards in cost-sensitive computing. The wide industrial temperature range and high I/O count make it a frequent building block in factory automation and embedded vision designs. When designing with this FPGA, ensure that the I/O bank voltages reference the classfree reference design, ensure that the configuration memory (typically a SPI or BPI flash) is sized for the bitstream, and ensure that the FPGA's power-on sequencing and decoupling network match the Spartan-6 power distribution guidance in UG393 to ensure reliable industrial-temperature operation. Designers should also budget for ISE Design Suite or Vivado (legacy) toolchain support and the appropriate license. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers an at-a-glance view of where the XC6SLX16-3FTG256I fits in the Spartan-6 LX family and what alternatives exist for sourcing continuity.

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XC6SLX16-L1FT256I - 14579-Cell Spartan-6 FPGA | AMD
XC6SLX16-L1FT256I

XC6SLX16-L1FT256I - 14579-Cell Spartan-6 FPGA | AMD

The AMD XC6SLX16-L1FT256I is a Spartan-6 LX field-programmable gate array with 14,579 logic cells, 1,139 configurable logic blocks, a 45 nm CMOS process, and a 256-pin FTBGA package. Designed for system integration and high-volume programmable logic applications, this device combines programmable logic, block RAM, digital signal processing resources, and dedicated I/O in a single package. A field-programmable gate array is a semiconductor device whose digital logic, memory blocks, and I/O assignments are configured after manufacture. The Spartan-6 LX FPGA family sits within the broader hierarchy of programmable logic devices, FPGAs, and semiconductors. This architecture makes the XC6SLX16 suitable when fixed-function logic would be inflexible or when product configurations, interface assignments, and firmware updates must evolve after board fabrication. The Spartan-6 LX configuration provides 14,579 cells and 1,139 CLBs. The listed 1 V supply value identifies the device's low-voltage CMOS operating class, while the 45 nm CMOS process provides the physical technology basis for the logic and embedded resources. The -L1 portion identifies the device speed grade, -I identifies the industrial temperature grade, and FT256 identifies the 256-ball package configuration. The XC6SLX16 family is intended for moderate-complexity embedded systems requiring a higher level of integration than basic programmable logic. Its resources can support parallel data processing, control logic, protocol bridging, memory-intensive control functions, and mixed peripheral interfaces. Because an FPGA configuration determines which circuit is implemented, engineers must account for routing, timing closure, resource utilization, configuration memory, and startup behavior during system design. Typical applications include industrial control equipment, communications infrastructure, embedded data-acquisition systems, test and measurement platforms, video or image-processing modules, and compact embedded systems that require programmable hardware. The 256-ball package also supports dense I/O arrangements, although board construction and signal-integrity performance depend on the selected package, PCB stack-up, and interface rates. Before schematic capture, use the AMD Spartan-6 package pinout files to confirm ball assignments, power rails, configuration pins, and user I/O. Validate every proposed alternative against those package files and the timing constraints of the design; sharing the XC6SLX16 family name alone does not establish interchangeability. This product record combines the verified device identity, package, process, cell count, CLB count, and temperature grade with engineering guidance, comparison data, and design considerations. It helps distinguish the exact ordered part number from related Spartan-6 devices that differ in speed grade, temperature grade, package suffix, or board footprint.

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