XC6SLX150-3FG676I - 147443-Cell Spartan-6 LX FPGA | AMD
MPN： XC6SLX150-3FG676I ✓ 啟用中XC6SLX150-3FG676I 概覽
A field-programmable gate array is a reconfigurable digital semiconductor in which the logic fabric, input/output blocks, clocking resources, and embedded memory are programmed after manufacture. The Spartan-6 LX family targets the FPGA > programmable logic > semiconductor hierarchy, combining high logic density with a broad set of embedded resources for communications, industrial control, instrumentation, embedded processing, and high-volume electronic systems. The XC6SLX150-3FG676I is the large-density member of that family.
The device provides 147443 logic cells on a mature 45 nm low-power copper CMOS process. Its 1.2 V core voltage identifies the core operating rail, while separate I/O supply options allow interface standards to be matched to board requirements when their supported values are confirmed in the Spartan-6 documentation. The 676-BGA package provides a high pin count and a compact body measuring 19 x 19 mm with 0.80 mm pitch, according to the package listing. The -3 grade is intended for the highest performance in the LX speed-grade range.
Its operating temperature range is 0 to 85 degrees Celsius, making the device appropriate for industrial-temperature equipment that remains within this specified envelope. Designers should use the AMD Spartan-6 package pinout files when assigning balls to power, ground, configuration pins, clock pins, and user I/O. The architecture is particularly useful when a design needs parallel channels, deterministic latency, hardware timing, or configurable logic that can be updated independently of a general-purpose software runtime.
Typical applications include industrial automation, test and measurement equipment, communications infrastructure, embedded control systems, video and image processing, and signal acquisition. These uses benefit from the device's combination of logic density, programmable I/O, and parallel processing resources. System designs must still account for external memory, clock jitter, power sequencing, decoupling, signal integrity, and thermal performance at the selected operating speed.
For PCB implementation, follow the manufacturer package and pinout files for ball assignment and escape routing, provide continuous power and ground planes, and keep high-speed clocks and differential interfaces away from noisy switching nodes. Configuration storage and its interface should also follow the Spartan-6 design guidance. The key engineering trade-off is that the -3 grade prioritizes performance, whereas a lower-speed grade may offer a different balance of timing margin, power, and thermal requirements.
This product overview combines the device's package, density, process, speed-grade, temperature, and electrical attributes with practical FPGA design guidance. It also distinguishes same-package alternatives by logic density, speed grade, and temperature suffix, helping engineers verify pin compatibility and performance requirements before approving a replacement.
直接替換替代品，適用於 XC6SLX150-3FG676I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC6SLX150-3FG676I （相同外形與佔位） — 差異在於 Device Type, Package, Temperature Grade, Speed Grade, Lead-Free Status.
XC6SLX150-3FGG676I
✅ 直接替換📋 參考替代品（不在目錄中）
XC6SLX150-2FGG676I
✅ 直接替換📋 參考替代品（不在目錄中）
XC6SLX150-2FG676I
✅ 直接替換聯絡詢價
查看資料表 →XC6SLX150T-3FG676I
✅ 直接替換📋 參考替代品（不在目錄中）
XC6SLX150T-3FGG676I
✅ 直接替換📋 參考替代品（不在目錄中）
XC6SLX150-3FG676I 最大額定值與電氣特性
| Device Type | Spartan-6 LX FPGA |
| Logic Cells | 147443 cells |
| FPGA Family | Spartan-6 LX |
| Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Internal Frequency | 667 MHz |
| Speed Grade | -3 |
| 封裝 | 676-BGA, 19 x 19 mm, 0.80 mm pitch |
| Package Family | FBGA |
| 工作溫度 | 0 to 85 C |
| Temperature Grade | Industrial |
| Lead-Free Status | Lead-free package |
| 安裝類型 | Surface Mount |
| Device Pin Count | 676 pins |
| Programmability | Field programmable |
XC6SLX150-3FG676I fbga 腳位配置指南
XC6SLX150-3FG676I（fbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： XC6SLX150-3FG676I.
請參閱 資料表 以查看完整腳位配置。
典型應用
XC6SLX150-3FG676I 適用於 6 應用s: Industrial Automation and Control, Test and Measurement Instrumentation, Communications Interface Equipment, Embedded Video and Image Processing, Signal Acquisition and Processing, High-Performance Embedded Processing.
Industrial Automation and Control
The XC6SLX150-3FG676I fits industrial automation controllers because 147443 logic cells can implement parallel motion, sequencing, interlocks, and machine-control functions in dedicated hardware. Its 0 to 85 C operating range supports industrial-temperature equipment when the complete board remains inside that envelope. The -3 grade favors demanding timing paths, while the 1.2 V core rail requires a clean, well-decoupled power design. For a controller with multiple machine axes, deterministic hardware execution can reduce dependence on a real-time software scheduler, although timing closure, safe-state I/O behavior, and industrial EMC requirements still need complete verification.
推薦
Test and Measurement Instrumentation
The XC6SLX150-3FG676I is suitable for parallel data-acquisition and instrument-control logic because a large programmable fabric can combine acquisition control, timing, data formatting, and interface functions. Its 147443 logic cells provide room for concurrent channels, while the -3 speed grade supports designs with demanding sequential timing. The 1.2 V core supply and 676-ball FBGA require careful power-plane design, clock routing, and thermal analysis. Compared with a processor-only controller, programmable parallel logic can produce deterministic transfers and flexible channel counts, but calibration, trigger latency, I/O voltage selection, and signal-integrity margins must be evaluated at the system level.
推薦
Communications Interface Equipment
The XC6SLX150-3FG676I can implement parallel protocol engines, packet-processing pipelines, and multiple interface adapters in a single Spartan-6 LX device. Its 147443 logic cells permit concurrent datapaths, while the -3 speed grade is useful when timing margins are limited. A communications board can place framing, buffering, and error-control logic beside a processor, reducing off-chip transfers and making behavior programmable. The principal engineering constraints are the 1.2 V core rail, supported I/O standards, clock quality, board-level signal integrity, and synchronization across parallel channels. Complete timing analysis should cover every clock domain and interface crossing before the design is released to production.
推薦
Embedded Video and Image Processing
The XC6SLX150-3FG676I offers substantial programmable logic for parallel pixel pipelines, format conversion, thresholding, and interface timing in embedded imaging systems. Using 147443 logic cells allows designers to implement deterministic stages that process multiple samples simultaneously instead of relying solely on sequential software instructions. The -3 grade helps preserve timing margin in pipelined datapaths, while the 676-BGA package offers a high pin count for external memories and image sensors. Designers must verify supported I/O voltages, memory-interface timing, clock jitter, power consumption, and heat dissipation. Pipeline latency and frame synchronization should also be documented because programmable logic can deliver predictable results when its clocking architecture is properly constrained.
推薦
Signal Acquisition and Processing
The XC6SLX150-3FG676I is appropriate for parallel signal-processing front ends that require deterministic sampling, filtering, correlation, or real-time decision logic. The large 147443-cell fabric can host multiple parallel lanes, and the -3 speed grade supports demanding timing relationships between acquisition and processing stages. The 1.2 V core supply should be generated with low-noise, stable regulation and local high-frequency decoupling, while analog front-end isolation remains the responsibility of the surrounding circuitry. Timing analysis, jitter budgeting, channel skew, and input-voltage compatibility are essential because FPGA performance alone cannot compensate for an inadequately conditioned analog signal. The final design should also verify thermal margin at the selected ambient temperature.
推薦
High-Performance Embedded Processing
The XC6SLX150-3FG676I can surround a hard or soft processor with dedicated accelerators, custom peripherals, memory interfaces, and real-time control logic. Its 147443 logic cells provide substantial capacity for parallel work while the -3 grade improves available timing margin over lower speed grades. This architecture can move repetitive operations into programmable hardware and reduce processor bottlenecks, provided the accelerator interface is partitioned carefully. The 676-BGA footprint requires dense escape routing, uninterrupted power planes, and careful via placement around the device. Designers should assess cache, memory bandwidth, interrupt latency, clock-domain crossings, and tool-supported processor integration. A soft processor also requires initialization, bus arbitration, and verification resources.
推薦
推薦產品摘要
工程參考資料，適用於 XC6SLX150-3FG676I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC6SLX150-3FGG676I | XC6SLX150-2FGG676I | XC6SLX150-2FG676I | XC6SLX150T-3FG676I | XC6SLX150T-3FGG676I |
|---|---|---|---|---|---|---|
| Package | 676-BGA, 19 x 19 mm, 0.80 mm pitch | 676-BGA | 676-BGA | 676-BGA | 676-BGA | 676-BGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LXT | Spartan-6 LXT |
| Logic Cells | 147443 cells | 147443 cells | 147443 cells | 147443 cells | 147443 cells | 147443 cells |
| Speed Grade | -3 | -3 | -2 | -2 | -3 | -3 |
| Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
主要差異化特點
- Uses the -3 performance grade (對比XC6SLX150-2FGG676I)
- Remains within the Spartan-6 LX family (對比XC6SLX150T-3FG676I)
- Combines 147443 logic cells with a 1.2 V core (對比XC6SLX150-3FGG676I)
設計說明
The device uses a 1.2 V core supply, so separate the core rail from I/O supplies according to the AMD power-architecture guidance. Place the required bulk and high-frequency decoupling capacitors at the associated supply and ground balls, with very short return paths. Validate startup sequencing, voltage tolerances, and power-consumption limits for the exact speed grade and design utilization before releasing the schematic.
Use the AMD Spartan-6 package device pinout files as the authority for all 676 ball assignments and PCB land pattern details. Keep clock routing short and controlled, provide uninterrupted reference planes beneath the device, and route high-speed or differential signals away from switching power-conversion nodes. Because this page does not include a verified 676-ball package diagram, do not infer ball numbering from a similar smaller FPGA package.
The XC6SLX150-3FG676I is specified for a 0 to 85 C operating range, but the board and enclosure determine the actual ambient environment. Estimate the FPGA power from the final utilization and timing report, then check junction temperature against the package-specific limit. Provide copper area and thermal vias under the BGA where permitted by the package guidance, and avoid enclosing the board without a defined heat-transfer path.
Do not approve a replacement solely because it has 676 balls or 147443 logic cells. The XC6SLX150T alternatives identify the LXT family, while -2 alternatives use a lower speed grade, and FGG ordering codes differ from FG676I. Compare package files, temperature grade, pin multiplexing, embedded resources, timing constraints, and the generated bitstream target before changing the approved part number.
合規資訊
The package listing identifies the 676-BGA device as lead-free. RoHS, REACH, halogen-free, and conflict-minerals status require confirmation from the applicable manufacturer product documentation.
