XC6SLX16-2CSG324I - 375 MHz Spartan-6 LX FPGA | AMD
MPN： XC6SLX16-2CSG324I ✓ 啟用中XC6SLX16-2CSG324I 概覽
A field-programmable gate array is a semiconductor whose digital logic and interconnect are configured after fabrication. An FPGA belongs to the broader programmable-logic hierarchy, combining configurable logic blocks, block RAM, digital clock managers, programmable I/O, and dedicated fabric resources. This integration allows a single Spartan-6 device to replace combinations of discrete programmable and fixed-function logic while shortening development schedules for industrial, communications, consumer, and automotive-infotainment equipment.
The XC6SLX16-2CSG324I provides 14,579 logic cells and 232 I/Os in a CSBGA-324 package. Its advertised internal frequency is 375 MHz, while its core supply range is 1.14 V to 1.26 V. The part also incorporates DCM and PLL resources for clock generation and phase management. These resources make it suitable for protocol bridges, custom interface controllers, display and control logic, industrial automation modules, and communication equipment requiring programmable high-speed I/O.
The Spartan-6 architecture uses 45 nm FPGA technology and combines programmable logic with hardwired resources for common design functions. The -2 designation identifies the performance grade, while the I suffix identifies the industrial-temperature option. The CSG324 package exposes 232 user I/Os in a compact 19 mm by 19 mm, 0.80 mm-pitch lead-free CSBGA arrangement. Its extensive I/O count allows a board to connect external memory, control signals, communications transceivers, sensors, and display peripherals without requiring a separate large companion device.
Typical implementations include industrial automation and bridging, automotive-infotainment interfaces, protocol conversion, image and data acquisition, embedded control, and communications infrastructure. The large I/O count is especially useful when a design must connect several external buses or high-pin-count memory devices. The device should be selected only after confirming that the required clocks, RAM, I/O standards, pin assignments, and peripheral resources fit the selected CSG324 variant.
PCB implementation requires careful attention to power, ground, and signal integrity across the dense BGA. Follow the manufacturer's CSG324 pinout files when assigning PCB balls, and verify each I/O standard, voltage, and termination requirement against the design. Because no explicit XC6SLX16-2CSG324I pin table appears in the retrieved records, use the official AMD Spartan-6 package pinout file rather than inferring ball assignments from another package variant.
This page combines the exact device identity, operating figures, package information, drop-in options, comparison parameters, and engineering guidance needed for initial design review. It also highlights the distinction between device-level alternatives that preserve the CSG324 footprint and unrelated packages that are not true drop-in replacements.
直接替換替代品，適用於 XC6SLX16-2CSG324I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC6SLX16-2CSG324I （相同外形與佔位） — 差異在於 Package, Device Type, Speed Grade, Lead-Free Status, Operating Temperature.
XC6SLX16-2CSG324C
✅ 直接替換聯絡詢價
查看資料表 →XC6SLX16-3CSG324I
✅ 直接替換聯絡詢價
查看資料表 →XC6SLX25-2CSG324I
✅ 直接替換聯絡詢價
查看資料表 →XC6SLX9-2CSG324I
✅ 直接替換📋 參考替代品（不在目錄中）
XA6SLX16-2CSG324I
✅ 直接替換📋 參考替代品（不在目錄中）
XC6SLX16-2CSG324I 最大額定值與電氣特性
| Device Type | FPGA |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 14,579 cells |
| User I/O Count | 232 I/Os |
| Internal Frequency | 375 MHz |
| Supply Voltage Range | 1.14 V to 1.26 V |
| Speed Grade | -2 |
| 封裝 | CSBGA-324 |
| Package Dimensions | 19 mm x 19 mm |
| Package Pitch | 0.80 mm |
| Package Type | Lead-free CSPBGA |
| 工作溫度 | -40 C to 85 C |
| Process Technology | 45 nm |
| Clock Management Resources | DCM and PLL |
| Memory Resource Value | 589824 |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
| REACH Status | Compliant |
XC6SLX16-2CSG324I lead-free cspbga 腳位配置指南
XC6SLX16-2CSG324I（lead-free cspbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： XC6SLX16-2CSG324I.
請參閱 資料表 以查看完整腳位配置。
典型應用
XC6SLX16-2CSG324I 適用於 6 應用s: Industrial Automation Controller, Automotive Infotainment Bridge, Communication Protocol Converter, Data Acquisition and Signal Processing, Video and Display Interface, Embedded Control and Sensor Hub.
Industrial Automation Controller
The XC6SLX16-2CSG324I fits programmable machine-control logic where a board must coordinate sensors, actuators, safety interlocks, and communications links. Its 14,579 logic cells provide room for control algorithms and protocol state machines, while 232 user I/Os support multiple sensors and discrete outputs without requiring extensive I/O expansion. The -2 grade and 375 MHz internal frequency suit timed control paths, and DCM and PLL resources assist deterministic clock distribution. For industrial deployments, the -40 C to 85 C rating is important; verify timing, I/O standards, and transient requirements in the final Vivado implementation.
推薦
Automotive Infotainment Bridge
The XC6SLX16-2CSG324I can implement interface bridging between automotive audio, display, navigation, and vehicle-network domains. Its 232 user I/Os are valuable when the FPGA must connect several bus transceivers, control lines, and data converters while executing protocol conversion in programmable logic. A 375 MHz internal frequency supports demanding datapaths, and the available DCM and PLL resources simplify clocking for multiple interface domains. Where automotive qualification is mandatory, evaluate XA6SLX16-2CSG324I and confirm the exact ordering, temperature, and production requirements rather than inferring automotive suitability solely from the Spartan-6 family.
推薦
Communication Protocol Converter
The XC6SLX16-2CSG324I is suitable for translating between serial, parallel, or packet-oriented interfaces in communications equipment. Parallel programmable logic can manage framing, checksums, buffering, and timing while the 232 I/Os connect multiple transceivers and control registers. The 375 MHz internal frequency supports high-rate datapaths, and dedicated clock-management resources help coordinate related interface domains. Designers should verify supported I/O standards, clock-input constraints, and achievable timing at the selected -2 speed grade. A larger design that exceeds the XC6SLX16 resource budget can evaluate XC6SLX25-2CSG324I while preserving the CSG324 footprint.
推薦
Data Acquisition and Signal Processing
The XC6SLX16-2CSG324I can act as the central programmable element in acquisition systems that digitize, filter, time-stamp, or route sensor data. Its 14,579 logic cells support parallel processing stages, while 232 I/Os simplify connections to converters, sensors, memory, and host processors. The 375 MHz internal frequency enables multi-stage datapaths, and DCM and PLL blocks can derive or align clock domains for sampled data. Selection must account for the number and speed of supported I/O standards, RAM requirements, and expected clock-jitter tolerance. If resource utilization approaches the limit, move the design to the XC6SLX25-2CSG324I and repeat the timing analysis.
推薦
Video and Display Interface
The XC6SLX16-2CSG324I can implement timing generation, pixel-format conversion, data alignment, and control for display or video interfaces. Its 232 user I/Os provide broad connectivity to memory and display-related circuitry, while the 375 MHz internal frequency supports clocked parallel datapaths. Programmable logic offers a practical way to combine several interface functions and adapt the board as display timing changes. Engineering review should include pixel-clock margin, supported I/O standards, external memory interface requirements, and synchronization between the fabric and peripherals. The XC6SLX25-2CSG324I is useful when parallel processing, additional buffering, or more complex control logic exceeds the XC6SLX16 capacity.
推薦
Embedded Control and Sensor Hub
The XC6SLX16-2CSG324I is well matched to sensor aggregation, condition-control, and protocol-hub designs in which many external devices must be coordinated. Its 232 I/Os allow sensors, memory, transceivers, and host interfaces to share one programmable platform, while 14,579 logic cells accommodate control state machines and data-routing functions. The -40 C to 85 C range supports industrial environments, and the 375 MHz internal frequency supports time-sensitive digital processing. Designers should reserve logic for diagnostics, verify clock-domain relationships, and confirm that the -2 timing grade closes at system temperature. XC6SLX16-3CSG324I offers another same-package timing choice when additional speed margin is required.
推薦
推薦產品摘要
工程參考資料，適用於 XC6SLX16-2CSG324I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC6SLX16-2CSG324C | XC6SLX16-3CSG324I | XC6SLX25-2CSG324I | XC6SLX9-2CSG324I | XA6SLX16-2CSG324I |
|---|---|---|---|---|---|---|
| Package | CSBGA-324 | CSBGA-324 | CSBGA-324 | CSBGA-324 | CSBGA-324 | CSBGA-324 |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | -2 | -2 | -3 | -2 | -2 | -2 |
| Temperature Suffix | I | C | I | I | I | I |
| Resource Tier | XC6SLX16 | XC6SLX16 | XC6SLX16 | XC6SLX25 | XC6SLX9 | XA6SLX16 |
| Process Technology | 45 nm | 45 nm | 45 nm | 45 nm | 45 nm | 45 nm |
主要差異化特點
- Balanced logic density and I/O availability (對比XC6SLX9-2CSG324I)
- Exact speed grade with industrial-temperature ordering (對比XC6SLX16-2CSG324C)
- Additional speed-grade margin without changing package (對比XC6SLX16-3CSG324I)
- Expandable same-package resource option (對比XC6SLX25-2CSG324I)
設計說明
Use AMD's official CSG324 package files to assign every PCB ball and verify the completed schematic before release. The package is a 19 mm by 19 mm, 0.80 mm-pitch CSBGA-324 with 232 user I/Os, so a single wrong BGA assignment can prevent programming or damage adjacent circuitry. Confirm the selected alternative uses the same CSG324 package and review any changes to power, configuration, clock, and dedicated pins before committing the layout.
Plan the core and I/O supplies separately according to the manufacturer power guidelines. The device operates over a 1.14 V to 1.26 V core supply range, but external interfaces and configuration pins may impose additional rail requirements. Place stable decoupling at the appropriate supply and ground balls, keep return paths continuous under the dense BGA, and verify sequencing and voltage tolerances in the complete power tree. Do not infer full power-pin connectivity from the package name alone.
Define the intended I/O standard and data rate before assigning a bank, then use the manufacturer pin constraints to prevent incompatible standards from being combined. For high-speed links, inspect reference-plane continuity, matched-length constraints, stub length, and return-path discontinuities with the actual PCB stack-up. The 375 MHz internal device frequency does not guarantee that every external interface can operate at that rate, so timing and signal-integrity analysis must use the final constraints.
Do not treat every same-family Spartan-6 LX device as an unconditional substitute. AMD states that devices supported in the same package are pinout compatible, but speed grade, temperature range, automotive qualification, resource tier, and timing closure still affect suitability. Migrate the design, recompile it, compare utilization, check constraints and timing, and complete the required qualification review before approving a replacement for production.
合規資訊
The package description identifies a lead-free CSPBGA, and the comparison material identifies RoHS and REACH compliance. AEC-Q100 status for the standard XC6SLX16-2CSG324I and halogen-free status were not established.
