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XC6SLX75-2FG676I - 74,637-Cell Spartan-6 LX FPGA
XC6SLX75-2FG676I

XC6SLX75-2FG676I - 74,637-Cell Spartan-6 LX FPGA

The AMD XC6SLX75-2FG676I is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 408 I/O, and a stated internal frequency of 667 MHz, supplied in a 676-BGA package. It combines programmable logic, block RAM, and DSP resources in one reconfigurable semiconductor for embedded control, signal processing, communications, and industrial systems. A field-programmable gate array is a digital integrated circuit whose interconnect and logic functions are configured after manufacture. An FPGA sits above fixed-function logic in the hardware hierarchy: designers implement parallel datapaths, state machines, interfaces, and protocol engines using hardware description code. Unlike a microcontroller that primarily executes software, the XC6SLX75 can execute many operations concurrently, making it suitable for deterministic control and high-throughput digital processing. The verified source data identifies the device as a Spartan-6 LX FPGA with 74,637 logic cells, 5,831 configurable logic blocks, and up to 400 inputs or outputs according to one distributor result. The package is identified as 676-BGA by DigiKey and Mouser listings. One secondary result instead associates an FBGA-484 designation with the MPN, creating a source conflict; engineers should therefore validate the exact ball map and package drawing before releasing a PCB footprint. The -2 suffix identifies the performance-grade ordering used by the source listings, while the trailing I indicates the industrial temperature designation in the verified comparison data. One source reports an operating range of 0 to 85 C, while another distributor source reports -40 to 100 C. Because the range is inconsistent across retrieved snippets, use the manufacturer ordering guide and package drawing as the controlling documents for production qualification. Typical uses include industrial control, data acquisition, communications gateways, embedded vision, instrumentation, and digital signal processing. The large pin count supports broad parallel connectivity to external memory, transceivers, converters, and custom interfaces. FPGA designs still require careful partitioning for timing closure, clocking, power integrity, and thermal performance. A robust integration decision starts with AMD package pinout files, Vivado tool compatibility, memory-interface requirements, and I/O standards. Do not treat a distributor description as a substitute for the official Spartan-6 documentation. This page separates verified values, flags conflicts, and avoids asserting unverified voltage, pin-level, lifecycle, and compliance details.

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XC6SLX75-2FGG484C - 74,637-Cell Spartan-6 FPGA | AMD
XC6SLX75-2FGG484C

XC6SLX75-2FGG484C - 74,637-Cell Spartan-6 FPGA | AMD

The AMD Xilinx XC6SLX75-2FGG484C is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 5,831 configurable logic blocks, 280 I/O, and a maximum internal frequency of 667 MHz. It is manufactured on a 45 nm CMOS process and supplied in a 484-pin FBGA package measuring 23 mm by 23 mm with a 1 mm pitch. The device combines programmable logic, fixed-function resources, and extensive high-speed I/O in one cost-focused platform for high-volume embedded systems. A field-programmable gate array is a semiconductor whose digital functions are configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, connecting lookup tables, flip-flops, routing fabric, block RAM, DSP resources, and I/O blocks. This configurability allows one hardware design to support multiple protocols, control algorithms, or product variants without changing the PCB layout. The Spartan-6 LX family was positioned for cost-sensitive applications requiring more integration than simple programmable logic devices. The XC6SLX75-2FGG484C provides 74,637 logic cells and 5,831 CLBs, creating a practical balance between processing capacity, fixed resources, and package complexity. Its 280 I/O positions support interfaces to external memory, control peripherals, communications transceivers, and industrial equipment. The -2 speed designation identifies the device's performance grade, while the 484-pin FBGA package supports dense connection to multilayer PCBs and substantial external I/O requirements. Spartan-6 devices integrate configurable logic with dedicated resources for memory and DSP processing. This architecture allows designers to implement parallel control, signal processing, protocol conversion, and data acquisition in a single programmable device. At 45 nm, the XC6SLX75 family combines a large logic fabric with a package suited to high-pin-count mixed-signal and embedded-control systems. The 667 MHz internal-frequency figure describes the device's stated performance class rather than the operating speed of every implemented design. Typical applications include industrial automation, motor control, machine vision, real-time networking, telecommunications equipment, and embedded control systems. The large I/O count is particularly useful when a design must connect multiple sensors, converters, memory devices, and communications interfaces while retaining programmable timing and logic. The 484-pin package also helps when signal count, rather than raw logic capacity alone, determines the required footprint. Board design must follow the AMD Spartan-6 package and pinout files for the 484-pin FBGA, including ball assignments, power planes, decoupling, and high-speed routing rules. The commercial-temperature suffix C corresponds to the stated 0 °C to 85 °C operating range. Configuration storage, clocking, power sequencing, and I/O standards should be verified in the manufacturer datasheet before schematic sign-off. This product page combines the exact device identity, package data, temperature grade, logic resources, searchable alternatives, application guidance, and design-focused comparison information. That engineering context helps engineers identify board-level consequences beyond basic part-number matching while keeping the core specifications traceable to the AMD Spartan-6 LX documentation.

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XC6SLX75-2FGG484I - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD
XC6SLX75-2FGG484I

XC6SLX75-2FGG484I - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD

The AMD (formerly Xilinx) XC6SLX75-2FGG484I is a Spartan-6 LX Field Programmable Gate Array (FPGA) with 74,637 logic cells, 3,170,304 system gates, 280 user I/Os, and 4,824 Kbits of Block RAM, housed in a 484-ball fine-pitch BGA (FBGA-484) package at the -2 speed grade and industrial (I) temperature rating. It is built on a 45 nm CMOS process and operates from a 1.14 V to 1.26 V core supply, delivering up to 667 MHz internal performance. A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks, programmable interconnect, and dedicated silicon resources (Block RAM, DSP slices, PLLs, transceivers on some variants) that can be hardware-tailored after PCB assembly. FPGAs sit between fixed-function ASICs and software-programmable processors in the compute taxonomy: integrated circuit -> digital IC -> programmable logic -> FPGA -> Spartan-6 family -> LX (logic-optimized) sub-family. They are used when time-to-market, parallel processing, and hardware reconfigurability outweigh the unit-cost advantage of mass-produced ASICs. Key features of the XC6SLX75-2FGG484I include 11,650 logic slices (each containing four 6-input LUTs and eight flip-flops), 3,170 Kbits of dedicated Block RAM (180 18-Kbit blocks), 132 DSP48A1 slices for fixed- and floating-point arithmetic, six clock management tiles (CMTs) with PLL + DLL capability, integrated PCIe endpoint block (only on LXT, NOT on LX), and on-chip 100 MHz clock support with up to 667 MHz DCM/PLL output. The -2 speed grade balances performance and power versus the -3 (highest performance) and -1L (lowest power) grades. Industrial temperature grade (-40 °C to +100 °C ambient, with junction allowed up to +125 °C) supports harsh-environment deployment. Spartan-6 LX uses a 45 nm 9-metal-layer CMOS process and a power-optimized core that supports 1.2 V core operation. Hard IP blocks (Block RAM, DSP slices, multi-boot controller, JTAG/ICAP/SPI configuration ports) live alongside the programmable fabric, enabling deterministic single-chip solutions for bridging, motor control, video processing, and embedded compute. Typical applications include industrial automation controllers, automotive infotainment bridging, video processing pipelines, software-defined radio, portable medical imaging, LED video walls, and PCIe endpoint expansion bridges. The 280 user I/Os make the 484-BGA package especially well-suited for high-pin-count industrial designs where several external buses must be addressed simultaneously. When designing with this FPGA, allocate at least 0.5 A per 100 K logic cells for VCCINT, and follow AMD UG393 (Spartan-6 PCB Design Guide) for decoupling, pinout, and signal-integrity rules. Industrial-grade parts cost roughly 20-30 % more than commercial-grade XC6SLX75-2FGG484C and should be chosen only when the operating environment exceeds 0 °C to +85 °C. This page synthesizes distributor pricing, drop-in replacement candidates, and design notes that are not consolidated in the AMD Spartan-6 datasheet alone.

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XC6SLX75-2FGG676I - 74,637-Cell Spartan-6 FPGA | AMD
XC6SLX75-2FGG676I

XC6SLX75-2FGG676I - 74,637-Cell Spartan-6 FPGA | AMD

The AMD XC6SLX75-2FGG676I is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 5,831 configurable logic blocks, 408 I/O, and a maximum internal frequency of 667 MHz. The device is supplied in a lead-free 676-ball FBGA package measuring 27 mm by 27 mm with a 1 mm ball pitch, and its -2 speed grade supports a nominal 1 V supply. A field-programmable gate array is a programmable semiconductor in the FPGA category of digital logic devices. An FPGA combines configurable logic blocks, programmable interconnect, memory resources, and input/output blocks into an integrated circuit whose circuit behavior can be modified after manufacture. Within the broader semiconductor hierarchy, the Spartan-6 LX device provides a programmable alternative to application-specific integrated circuits when interfaces, parallel processing, or logic capacity must change between product variants. Principal device characteristics include 74,637 logic cells, 5,831 configurable logic blocks, 408 I/O, 667 MHz internal frequency, and operation from approximately -40°C to +100°C for the industrial-temperature ordering indicated by the I suffix. The 676-ball FBGA package supports dense board-level integration, while the lead-free construction is explicitly identified in the available product records. The -2 designation identifies the device's performance grade within the Spartan-6 LX family, which is manufactured on 45 nm CMOS technology. Its 676-ball package provides a high pin count for high-performance design implementations, including parallel data interfaces, embedded control, industrial automation, networking equipment, and general-purpose signal processing. System timing must still be evaluated against the specific clock, I/O, and resource requirements of each implemented design. Typical applications include industrial control systems, embedded video processing, communication infrastructure, test equipment, and high-density programmable logic. The combination of 408 I/O and 74,637 logic cells permits multiple interfaces to be consolidated in one device, reducing the need for separate programmable or discrete interface components when pin and performance requirements are satisfied. A primary design consideration is BGA assembly. The 1 mm pitch, 676-ball package requires a suitable land pattern, multilayer PCB construction, appropriate thermal management, and assembly-process controls. Designers should also confirm timing closure, power budget, configuration method, bank voltage requirements, and I/O standards against the manufacturer datasheet before releasing a production design. This page consolidates verified distributor specifications, package details, availability information, comparable Spartan-6 device options, and practical selection guidance. It supplements the manufacturer datasheet with decision-oriented information for engineers evaluating the XC6SLX75-2FGG676I as an industrial-grade, high-density FPGA.

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XC6SLX75-3CSG484C - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD
XC6SLX75-3CSG484C

XC6SLX75-3CSG484C - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD

The AMD (formerly Xilinx) XC6SLX75-3CSG484C is a Spartan-6 LX family Field-Programmable Gate Array (FPGA) built on a 45 nm low-power copper CMOS process, integrating 74,637 logic cells and 3,170,304 system gates into a 484-ball Chip-Scale BGA (CSBGA) package measuring 23 x 23 mm with 1.0 mm ball pitch. It targets high-volume cost-sensitive applications requiring high logic density with low static and dynamic power. What is a Spartan-6 FPGA? The Spartan-6 family is the sixth generation of Xilinx's low-cost, high-volume FPGA line, sitting within the broader taxonomy of programmable logic devices (PLD) -> FPGA -> SRAM-based FPGA -> low-power FPGA. Built on a mature 45 nm process, Spartan-6 devices combine programmable logic fabric, Block RAM, DSP slices, and hard IP cores (clock management, PCIe, memory controllers) into a single die, offering ASIC-like integration at FPGA-like flexibility. Key features of the XC6SLX75 include 5831 Configurable Logic Blocks (CLBs), up to 309 Kbits of Block RAM, a maximum internal operating frequency of 667 MHz, and 328 user I/O pins. The device is offered in the -3 speed grade (the highest performance tier of the LX family), commercial temperature range (0 to 85 C), and supports supply voltages from 1.2 V core to 3.3 V I/O. Integrated hard IP includes DSP48A1 slices for fixed- and floating-point arithmetic, SelectIO with support for multiple I/O voltages, and a memory controller block for DDR, DDR2, DDR3, and LPDDR. The LX sub-family is positioned below the LXT (which adds transceivers) and above the Spartan-6 lower-density LX devices. Architecture highlights include 6-input LUTs, dual-port Block RAM with byte-wide parity, and dedicated 18 x 18 multipliers. The 45 nm process yields approximately 50% lower static power than the prior Spartan-3A generation while supporting higher clock rates through dedicated carry chains and pipelined DSP blocks. Typical applications for the XC6SLX75-3CSG484C include industrial motor control and machine vision, video processing pipelines (display controllers, surveillance DVRs), wireline communication bridges, automotive driver assistance, and consumer display interfaces. The 484-BGA footprint and high I/O count suit designs that need many LVCMOS or LVDS pairs. When designing with this device, provide multiple decoupling caps around the BGA and follow AMD's PCB layout guidelines for chip-scale BGAs (escape routing for the 1.0 mm pitch grid). Use the ISE Design Suite (iMPACT + ISE Project Navigator) or Vivado (legacy support) for bitstream generation and JTAG programming. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not typically aggregated on DigiKey or Mouser product pages.

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XC6SLX75-3CSG484I - 74637-Cell Spartan-6 LX FPGA | AMD
XC6SLX75-3CSG484I

XC6SLX75-3CSG484I - 74637-Cell Spartan-6 LX FPGA | AMD

The AMD XC6SLX75-3CSG484I is a Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology, with 74,637 logic cells, 5,831 configurable logic blocks, and a 484-pin CSBGA package. It operates from a 1.2 V core supply, reaches an internal frequency of 667 MHz according to the retrieved specifications, and supports a 0 to 85 °C operating-temperature range. The device combines programmable logic, block RAM, dedicated DSP resources, and high-speed serial transceivers in one package. A field-programmable gate array, or FPGA, is a reconfigurable semiconductor whose internal digital circuitry is defined by a configuration bitstream rather than fixed mask programming. Within the product hierarchy, an FPGA belongs to the programmable-logic and semiconductor families. The Spartan-6 LX family is positioned for cost-sensitive embedded systems requiring substantial parallel processing, deterministic interfaces, and flexible hardware updates without changing the printed circuit board. The XC6SLX75 combines 74,637 configurable logic cells with 5,831 CLBs and 328 reported I/O locations in the 484-pin CSPBGA package. Its 45 nm CMOS construction supports integration of logic, memory, and DSP blocks, while its -3 speed grade identifies one of the higher-performance grades described for the Spartan-6 LX family. The CSBGA package has a 1 mm pitch and a reported body size of 23 × 23 mm according to the retrieved distributor data. Spartan-6 devices support parallel processing, serial connectivity, and programmable logic through configurable I/O resources. This device family can implement control logic, communication bridges, data acquisition pipelines, embedded processors, and hardware signal-processing functions. Because a complete system can be implemented in programmable logic, the FPGA can also support field upgrades, product differentiation, and reduced external-component count when its resources match the design requirements. Typical uses include industrial automation and factory control, networked communications, test and measurement equipment, embedded video processing, data acquisition, and embedded processing platforms. The 74,637-cell count is particularly useful for designs that need multiple parallel channels or a combination of control logic and DSP. Designers must still verify the exact pin assignments, power rails, supported I/O standards, memory configuration, and transceiver features against the applicable AMD package and device documentation. Board-level implementation requires careful high-speed layout, continuous supply planes, correct BGA escape routing, and decoupling near the package power and ground balls. The 1 mm-pitch CSPBGA also demands controlled assembly processes, including suitable stencil design, solder-paste inspection, and thermal verification. External memory interfaces, serial links, and user I/O should be routed according to the official package pinout files and device-specific layout guidance. This product record combines verified distributor specifications, package information, pricing references, and same-package replacement findings with practical selection guidance. The alternative list is intentionally limited to candidates supported by the supplied cross-reference results, avoiding unsupported cross-package substitutions or packaging-only variants presented as drop-in replacements.

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XC6SLX75-3FG484I - 74637-Cell Spartan-6 FPGA | AMD
XC6SLX75-3FG484I

XC6SLX75-3FG484I - 74637-Cell Spartan-6 FPGA | AMD

The AMD XC6SLX75-3FG484I is a Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology, with 74,637 logic cells, 280 I/O, and a 484-ball FBGA package. The -3 speed grade is identified by the provided sources as the highest-performance Spartan-6 LX grade, while the I suffix denotes the industrial-temperature option listed at 0°C to 85°C. One distributor specification lists 5,831 configurable logic blocks and 667 MHz internal frequency, while another catalog listing states 862 MHz; engineers should verify the exact timing interpretation against the applicable AMD datasheet and selected device documentation before using either figure as a design limit. A field-programmable gate array, or FPGA, is a programmable logic device whose configurable logic blocks, programmable interconnect, block RAM, and digital signal-processing resources can be interconnected after manufacture. Within the semiconductor hierarchy, this device is a Spartan-6 FPGA, then a programmable-logic IC and digital semiconductor. Its large logic capacity and high pin count suit parallel control, protocol bridging, data acquisition, embedded signal processing, and industrial automation systems that need deterministic hardware parallelism. The verified listings identify 74,637 cells, 45 nm CMOS fabrication, a nominal 1.2 V supply, 280 user I/O, and a 23 mm by 23 mm FBGA-484 package with 1 mm pitch. The -3 grade provides the family’s highest performance positioning according to the supplied specification source. This matters in timing-sensitive designs, but nominal family speed alone does not determine achievable clock frequency; routing, resource type, voltage, temperature, timing constraints, and design effort remain decisive. The 484-ball package exposes substantially more interconnect than a typical low-pin-count FPGA, making it appropriate for high-bandwidth parallel systems and substantial external memory or peripheral interfaces. Conversely, it requires careful escape routing, via-in-pad-aware assembly, thermal analysis, and BGA-aware inspection. Configuration storage, bank supply requirements, supported I/O standards, and pin constraints must be checked in the official pinout and package files. Typical uses include industrial machine vision, robotics, test-and-measurement front ends, networking equipment, embedded video control, and high-throughput digital acquisition. The programmable resources allow parallel pipelines and multiple interfaces to coexist without relying entirely on a microcontroller for timing-critical control. For each deployment, engineers should validate memory-mapper resources, clocking, pin assignments, configuration mode, and timing closure in AMD development tools. A critical design step is to preserve BGA thermal and assembly margin by following AMD package guidelines and validating the completed PCB stack-up. Power rails should be decoupled according to the manufacturer guidance, while clocks and high-speed interfaces require controlled return paths. This page combines verified catalog specifications, sourcing data, and engineering guidance while clearly separating confirmed facts from values requiring further documentation.

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XC6SLX75-3FG676C - 74,637-Cell Spartan-6 LX FPGA
XC6SLX75-3FG676C

XC6SLX75-3FG676C - 74,637-Cell Spartan-6 LX FPGA

The AMD Xilinx XC6SLX75-3FG676C is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 5,831 configurable logic blocks, and a listed internal frequency of 667 MHz, housed in a 676-ball FBGA package. It is built on 45 nm CMOS technology and targets systems requiring high integration, programmable logic, and a broad range of I/O. The device is identified as a -3 speed-grade part, while its commercial operating-temperature range is listed as 0°C to 85°C. A field-programmable gate array is a semiconductor device whose digital logic and interconnect can be configured after fabrication. FPGAs belong to the programmable-logic hierarchy, alongside CPLDs, and are commonly used for rapid prototyping, embedded control, signal processing, interface bridging, and hardware acceleration. Unlike a fixed-function ASIC, an FPGA allows logic, memory, and interfaces to be changed during design revisions by updating the configuration bitstream. The XC6SLX75-3FG676C provides 74,637 logic cells and 5,831 CLBs according to the supplied distributor records. Its 676-ball package supports a large pin count for high-I/O designs, while the 45 nm Spartan-6 process provides programmable logic, block RAM, DSP resources, and selectable I/O standards. The listed internal frequency is 667 MHz, although achievable system clocking and interface rates depend on the selected clocking resources, I/O standards, timing constraints, and PCB implementation. Typical uses include industrial automation, automotive infotainment, consumer electronics, communications infrastructure, and embedded processing systems. The -3 grade is described in the supplied comparison material as the highest-performance Spartan-6 LX speed grade. A 676-BGA package also requires careful PCB layout, including adequate escape routing, controlled-length clock paths, solid power distribution, and thermal management for sustained operation. The most important design tradeoff is integration versus package complexity. The large FBGA footprint offers substantial programmable resources and I/O capacity, but it requires fine-pitch layout capability, via-in-pad or escape-routing strategies, and careful assembly controls. Before releasing a design, engineers should verify the exact pin assignments, configuration requirements, power rails, clocking plan, and I/O voltage limits against the manufacturer datasheet. This page combines verified distributor specifications, cross-reference results, package details, pricing context, and practical integration guidance. Because the supplied data does not include complete electrical tables or a validated manufacturing quote, unavailable values are explicitly identified rather than inferred.

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XC6SLX75-3FG676I - 74,637-Cell Spartan-6 FPGA | AMD
XC6SLX75-3FG676I

XC6SLX75-3FG676I - 74,637-Cell Spartan-6 FPGA | AMD

The AMD XC6SLX75-3FG676I is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 5,831 configurable logic blocks, 408 I/O, and an industrial temperature grade in a 676-ball FCBGA package. Verified listings identify an 862 MHz maximum device frequency, a 27 mm by 27 mm body, a 1 mm ball pitch, and CMOS fabrication. The -3 speed grade is the highest-performance Spartan-6 LX grade presented in the verified comparison data. An FPGA is a programmable semiconductor in the broader logic and semiconductor hierarchy. Instead of fixing Boolean logic at fabrication, its configurable lookup tables, routing networks, block RAM, DSP resources, and I/O blocks can be programmed after manufacture. The Spartan-6 LX family is designed for high-volume systems requiring broad programmable logic integration at relatively low cost. The XC6SLX75-3FG676I provides 74,637 logic cells organized as 5,831 CLBs and exposes 408 I/O. Its verified maximum frequency is 862 MHz, although achievable user logic frequency depends on the selected clocking, routing, device resources, and timing constraints. The industrial suffix denotes industrial temperature grading, while the -3 code identifies the high-performance speed grade. The 676-ball, 1 mm-pitch package supports dense board integration but requires advanced PCB layout and assembly capability. Its architecture fits parallel data acquisition, control, signal generation, protocol bridging, image processing, and embedded system integration. The available logic, memory, and I/O resources can consolidate functions that otherwise require multiple programmable or fixed-function devices. Engineers must still verify the exact RAM, DSP, transceiver, clock, and I/O capability required by each design against the AMD family documentation. The target is supplied in a 676-ball FCBGA package reported as 27 mm by 27 mm with a 1 mm pitch. BGA assembly requires board escape routing, via-in-pad or fanout strategy, appropriate solder-mask and paste design, X-ray inspection capability, and controlled reflow. Although the package supports high I/O density, routing to its 676 balls is materially more demanding than leaded-package assembly. Design planning should begin with the AMD Spartan-6 package pinout files and the device-specific timing, power, and configuration guidance. Confirm the exact bill of materials, pin mapping, supported I/O standards, clocking resources, configuration interface, decoupling requirements, and thermal assumptions before release. Vendor snippets conflict on frequency and package details, so this page treats the direct DigiKey, Mouser, LCSC, and FindIC records as separate evidence sources rather than merging contradictory fields. This page consolidates verified distributor availability, package and resource comparisons, procurement context, and practical BGA implementation guidance. It also distinguishes device-grade variants from unqualified replacements so engineers can evaluate alternatives without assuming that a similar FPGA name guarantees timing, temperature, or pin compatibility.

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XC6SLX75-3FGG484C - Spartan-6 LX FPGA, 74,637 Logic Cells | AMD
XC6SLX75-3FGG484C

XC6SLX75-3FGG484C - Spartan-6 LX FPGA, 74,637 Logic Cells | AMD

AMD (formerly Xilinx) XC6SLX75-3FGG484C is a Spartan-6 LX field-programmable gate array (FPGA) in a 484-ball FBGA package (MS-034, 23 x 23 mm body, 1.0 mm pitch) providing 74,637 logic cells and 280 user I/O, with a maximum internal clock frequency of 667 MHz and a commercial-grade 0 °C to 85 °C operating temperature range. An FPGA is a semiconductor device whose logic, interconnects and I/O are defined by a configuration bitstream loaded from an external memory rather than by fixed mask wiring. Within the broader taxonomy, the XC6SLX75 belongs to the Spartan-6 LX family, which sits between low-cost CPLDs and higher-density FPGAs: it is a programmable logic device (PLD) built on 45 nm SRAM logic fabric with hard DSP slices and block RAM. The -3 suffix designates the fastest speed grade available in the family, while the FGG484 suffix defines the 484-ball flip-chip BGA package, and the trailing C identifies the commercial temperature grade. Key features of this device include the 667 MHz internal clock frequency, 280 I/O pins for external interfacing, and 74,637 logic cells for parallel datapath and control logic. Because the fabric is SRAM-based, the same silicon can be reconfigured in the field, allowing firmware-driven function updates, partial reconfiguration of individual regions, and in-field repair of deployed equipment. The 484-ball BGA package also exposes a large number of dedicated clock, configuration and power pins required for high-fanout designs. Architecturally, the Spartan-6 LX device combines programmable logic arrays, dedicated DSP48A slices for multiply-accumulate operations, and block RAM for on-chip buffering. The -3 speed grade delivers the highest logic performance of the Spartan-6 LX family, so designs that were previously timing-limited on -2 or -1L grades can close timing at lower clock periods without a device change. The same FGG484 land pattern is shared across several LX75 and LX100 variants, which simplifies PCB respins between density levels. Typical applications include industrial control and PLC I/O expansion, industrial Ethernet and protocol bridging, motor and motion control front-ends, test and measurement data acquisition, video and image processing pipelines, and embedded instrumentation gateways where deterministic parallel logic and re programmability are valuable. When designing around this device, budget careful for the 484-ball BGA escape routing and for decoupling across the many distributed power and ground balls. Confirm the bitstream configuration interface levels and the required I/O standard for each bank, and verify that the -3 speed grade is genuinely needed before paying the performance premium over the -2 grade. This page consolidates verified distributor pricing, package and pinout references, drop-in same-footprint alternatives, and practical design guidance that are spread across many separate distributor and datasheet listings for the XC6SLX75-3FGG484C.

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XC6SLX75-3FGG676C - Spartan-6 LX FPGA, 74637 Cells, 408 I/O | Xilinx
XC6SLX75-3FGG676C

XC6SLX75-3FGG676C - Spartan-6 LX FPGA, 74637 Cells, 408 I/O | Xilinx

The Xilinx XC6SLX75-3FGG676C is a Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology, providing 74,637 logic cells in 5,831 configurable logic blocks (CLBs), 132 DSP48A1 slices, 3,096 Kbit of block RAM, and 408 user I/O in a 676-ball FBGA package. The device operates from a 1.14 V to 1.26 V supply voltage and is offered in the -3 (highest performance) speed grade with a commercial ambient temperature range of 0 C to 85 C. An FPGA is a programmable logic device in which the digital interconnect and processing elements are configured at power-up from a bitstream held in external flash or configuration EEPROM. The Spartan-6 LX family sits in the Xilinx/AMD product hierarchy below Artix-7 and Kintex-7, and is positioned as a low-cost, high-volume platform for bridging, interface, and control logic rather than ultra-high-speed serial fabrics. Key features of this device include a 27 mm x 27 mm FBGA-676 package on a 1 mm ball pitch, 408 user I/O for high connectivity, integrated Digital Clock Managers (DCM) and PLLs for clock generation and jitter cleanup, and hard DSP48A1 multipliers for signal-processing datapaths. The LX variant is logic-optimized, prioritizing logic density and I/O count over the high-speed serial transceivers found in the LXT line. Technically, the XC6SLX75-3FGG676C is a 45 nm FPGA whose logic fabric is built from 4-input LUT-based CLBs. Third-party listings for this device cite internal frequency figures of 400 MHz, 667 MHz, and 862 MHz depending on the metric quoted (logic maximum, DSP, or memory performance); the authoritative per-clock-domain Fmax tables should be taken from the manufacturer data sheet for the exact speed grade. Typical applications include automotive infotainment and cluster bridging, industrial automation and factory control, consumer set-top and video scaling, industrial networking gateways, and general-purpose embedded control platforms that need abundant parallel I/O. The key design consideration is ball-pitch and thermal compliance: FBGA-676 with 1 mm pitch requires a fine-pitch PCB layout with filled thermal vias under the package, and derating of junction temperature must be checked against the -3 speed grade power envelope in the datasheet. This page consolidates distributor availability, package and pin-assignment references, verified parametric alternatives, and practical PCB and clocking design notes that are typically spread across the manufacturer data sheet, selector guides, and separate package documents.

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XC6SLX75-3FGG676I - 74,637-Cell Spartan-6 LX FPGA | AMD
XC6SLX75-3FGG676I

XC6SLX75-3FGG676I - 74,637-Cell Spartan-6 LX FPGA | AMD

AMD Xilinx XC6SLX75-3FGG676I is a high-density Spartan-6 LX field-programmable gate array with 74,637 logic cells, 5,831 configurable logic blocks, 408 I/O, and a 667 MHz internal clock in a 676-ball FBGA package. The -3 speed grade is the highest-performance Spartan-6 LX grade, while the industrial suffix I supports operation from -40°C to +100°C. The device combines programmable logic, block RAM, dedicated DSP resources, and configurable I/O in one CMOS FPGA. A field-programmable gate array is a digital semiconductor whose interconnect and logic functions are configured after manufacture. The Spartan-6 LX family belongs to the broader FPGA and programmable-logic hierarchy, providing more integration and parallel processing capability than a fixed-function logic device. It is designed for cost-sensitive embedded systems that require adaptable hardware, deterministic control, high-speed interfaces, and substantial I/O density without designing a custom ASIC. The XC6SLX75-3FGG676I provides 74,637 logic cells and 408 I/O, making it suitable for control, interface, image-processing, and communication designs requiring hundreds of external connections. Its -3 performance grade is intended for designs that prioritize operating speed over the lower-cost -2 grade. The FPGA also supports configurable I/O standards, allowing board designers to connect the device to multiple logic families when voltage, slew, and timing requirements are satisfied. Spartan-6 LX devices integrate dedicated memory and DSP resources alongside configurable logic. This permits parallel algorithms, packet handling, signal conditioning, and control functions to share one device. Because the available product data does not enumerate RAM, DSP, transceiver, and power specifications, designers should consult the Spartan-6 family documentation and device-specific tables for exact resource counts, voltage requirements, banking rules, and speed characteristics before finalizing a board. Typical uses include industrial automation, machine vision, motor control, test and measurement, embedded signal processing, and communications infrastructure. The 676-ball package provides a high pin count but demands careful PCB layout, including dense escape routing, controlled power distribution, and comprehensive BGA assembly verification. For a new design, verify the selected XC6SLX75 speed grade, industrial-temperature requirement, package drawing, pin assignments, power sequencing, and I/O voltage plan against the official device documentation. The -3 grade and I suffix define the performance and temperature order code, so substitutions must match both the FBGA-676 footprint and the intended operating requirements. This product page consolidates the identified device specifications, verified source links, application guidance, and same-footprint alternatives into an engineering-focused reference for FPGA selection and PCB planning.

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XC6SLX75-L1FG676I - 74,637-Cell Spartan-6 LX FPGA | AMD
XC6SLX75-L1FG676I

XC6SLX75-L1FG676I - 74,637-Cell Spartan-6 LX FPGA | AMD

The AMD/Xilinx XC6SLX75-L1FG676I is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 408 I/O, a 1 V core supply, and a 676-ball FBGA package. Designed for industrial applications, it combines programmable logic resources with a 45 nm CMOS process in a 27 x 27 mm package with 1 mm ball pitch. The -L1 designation identifies the device speed and temperature grades, while FG676 identifies the 676-ball package configuration. A field-programmable gate array is a reconfigurable digital semiconductor in which the logic, interconnect, and input/output functions are defined by a bitstream rather than permanently etched during fabrication. Within the device hierarchy, an FPGA is a programmable logic device and a semiconductor. Spartan-6 LX belongs to AMD/Xilinx's Spartan-6 product family, which is intended to balance logic capacity, embedded memory, I/O availability, and cost in compact embedded systems. The XC6SLX75 provides 74,637 logic cells organized as 5,831 configurable logic blocks and offers 408 I/O. Its 408 I/O provide substantial connectivity for parallel buses, control interfaces, memory interfaces, and general-purpose digital peripherals. A 1 V core voltage supports modern FPGA implementation practices, while the 45 nm CMOS process establishes the device's process technology and helps define its performance and power characteristics. The 676-ball FBGA package supports dense board routing and is suitable for compact systems in which a large programmable logic resource must coexist with processors, external memory, transceivers, or high-speed interface components. The 27 x 27 mm body and 1 mm pitch require careful PCB layout, power planning, via-in-pad or microvia strategies, and a multilayer board structure capable of supporting hundreds of power, ground, and signal connections. Typical applications include industrial control systems, data acquisition, communications equipment, embedded processing platforms, video processing, and high-density digital interfaces. The Spartan-6 LX fabric can implement parallel protocols, control logic, state machines, packet processing, and custom accelerators. Systems requiring a large number of user I/O can use the device as the central programmable element rather than relying exclusively on discrete programmable logic. A primary design consideration is power integrity. Because the 676-ball package contains many supply and ground connections, the power grid must be designed according to the package power and ground assignments rather than distributed mechanically. Decoupling, layer transitions, thermal management, signal-integrity analysis, and exact pin constraints must be checked against the Spartan-6 device documentation before schematic capture or PCB release. This product overview combines the exact device identity, package characteristics, cell and I/O counts, family relationships, replacement analysis, and practical design guidance needed to evaluate the XC6SLX75-L1FG676I before it is assigned to an industrial FPGA design.

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XC6SLX75-N3FG484C - 74,637 LE Spartan-6 LX FPGA | AMD
XC6SLX75-N3FG484C

XC6SLX75-N3FG484C - 74,637 LE Spartan-6 LX FPGA | AMD

AMD XC6SLX75-N3FG484C is a Spartan-6 LX field-programmable gate array with 74,637 logic elements, 280 I/O, 3,170,304 RAM bits, and a 484-ball BGA package. The -3 speed designation identifies the device performance grade, while the FG484 suffix identifies the 484-ball package configuration. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, interconnect, and programmable I/O resources can be configured after fabrication. An FPGA sits within the broader programmable-logic hierarchy and can be described as a programmable logic device, digital integrated circuit, and semiconductor. Spartan-6 LX devices combine configurable logic blocks, block RAM, programmable input/output resources, and dedicated hardwired functions in one integrated circuit. The XC6SLX75 family provides 74,637 logic elements, 5,831 logic array blocks or configurable logic blocks, and 3,170,304 total RAM bits. Its 280 I/O positions support connections to external memory, control interfaces, communications links, and mixed-signal system inputs and outputs. The 484-BBGA package is intended for compact, high-density professional printed-circuit-board designs requiring numerous ball-grid connections. The -3 suffix selects the -3 performance grade, while the FG484 package code identifies the 484-ball configuration used by the target. Configuration and programming behavior, supported interfaces, electrical limits, and timing constraints must be established from the manufacturer datasheet and the Spartan-6 package pinout files. Designers should also validate the complete device configuration, system interface assignments, and PCB escape-routing capacity before release to fabrication. Typical uses include industrial control, embedded instrumentation, communications equipment, video processing, networking infrastructure, and general-purpose programmable logic. The Spartan-6 LX architecture is useful when a design requires substantially more parallel logic and memory resources than a small microcontroller or fixed-function digital device can provide, while retaining reconfigurability for product updates. PCB implementation should follow the AMD package pinout files, preserve the required power and ground distribution, and route every assigned ball according to the selected PCB stack-up. Because the package contains 484 balls, escape routing and via-in-pad or microvia strategy can materially affect routability, signal integrity, assembly yield, and thermal performance. Confirm BGA land pattern, solder-mask definition, and assembly process compatibility with the board manufacturer. This product guide combines the target device's 74,637 logic elements, 280 I/O, 3,170,304 RAM bits, and 484-BBGA configuration with same-package speed-grade options and practical implementation guidance. It supports faster part selection while directing engineers to the authoritative datasheet, package files, and design guidance for final engineering sign-off.

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XC6SLX75-N3FG484I - 74,637-Cell Spartan-6 LX FPGA | AMD
XC6SLX75-N3FG484I

XC6SLX75-N3FG484I - 74,637-Cell Spartan-6 LX FPGA | AMD

The AMD XC6SLX75-N3FG484I is a Spartan-6 LX field-programmable gate array with 74,637 logic elements, 5,831 logic cells, 3,170,304 RAM bits, and 280 user I/O, packaged in a 484-ball FBGA measuring 23 mm by 23 mm. It operates from a 1.14 V to 1.26 V supply and is specified for a junction-temperature range of -40 °C to 100 °C. A field-programmable gate array is a semiconductor whose digital logic, memory, and I/O behavior is defined by a configuration bitstream. The Spartan-6 LX family belongs to the FPGA hierarchy, where programmable logic is combined with block RAM, digital clock managers, DSP resources, and SelectIO interfaces. This combination allows one physical device to implement control logic, signal processing, communications, and programmable I/O without requiring a custom application-specific integrated circuit. The XC6SLX75 provides unusually high logic density for a 45 nm FPGA family while maintaining 280 user I/O. Its 3,170,304 RAM bits support buffering, packet storage, data acquisition, and embedded-memory functions. The N3 speed designation identifies a higher-performance speed grade than the -2 variants, while the I suffix identifies the industrial-temperature configuration associated with the -40 °C to 100 °C junction-temperature specification. Within the Spartan-6 LX architecture, configurable logic blocks implement Boolean and sequential functions, while dedicated DSP48A1 slices accelerate arithmetic-heavy pipelines. Memory controllers support external memory interfaces, and the enhanced clock-management resources address regional and global clocking requirements. These resources make the device useful when a design needs both substantial parallel processing and numerous external connections. Typical applications include industrial control systems, network-interface equipment, embedded video processing, data-acquisition modules, and communication infrastructure. Its 280 I/O are particularly useful for parallel buses, sensor aggregation, control signals, and high-speed memory interfaces. The 484-ball FBGA also requires careful escape-routing and power-delivery planning on multilayer boards. When designing around this FPGA, verify every bank supply requirement and the permitted voltage range for each I/O standard. Use the AMD Spartan-6 package pinout files when assigning balls, and preserve the recommended power and ground plane arrangement. Confirm signal-integrity, configuration, thermal, and system-timing requirements before committing the PCB layout. This product record combines the exact device identity, key logic and memory resources, package characteristics, operating limits, application guidance, and verified same-family alternatives to support early design selection and sourcing decisions.

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XC6SLX75-N3FG676C - Spartan-6 LX FPGA | AMD | Industrial
XC6SLX75-N3FG676C

XC6SLX75-N3FG676C - Spartan-6 LX FPGA | AMD | Industrial

The AMD XC6SLX75-N3FG676C is a Spartan-6 LX field-programmable gate array with 74,637 logic elements, 408 user I/O, and 3,170,304 bits of block RAM in a 676-ball BGA package. It operates from a 1.14 V to 1.26 V core supply and supports an industrial junction-temperature range of 0°C to 85°C. A field-programmable gate array, or FPGA, is a programmable semiconductor whose logic, memory, and I/O can be configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic blocks, block RAM, programmable I/O, clocking resources, and dedicated multipliers in one device. This integration supports parallel processing, high-speed interfaces, and flexible hardware upgrades without changing the printed circuit board. The Spartan-6 LX family provides 74,637 logic elements organized into 5,831 logic activity blocks or configurable logic blocks, alongside 408 user I/O and 3,170,304 bits of block RAM. The -N3 speed grade and industrial temperature designation make the XC6SLX75-N3FG676C appropriate for embedded systems requiring sustained parallel processing under controlled commercial-industrial conditions. The 676-ball BGA package supports dense PCB routing and a large pin budget for external memory, high-speed serial links, parallel buses, and control peripherals. The device operates with a 1.14 V to 1.26 V supply. Its 408 user I/O provide substantial connectivity, while the large block-RAM capacity allows local buffering, packet storage, waveform capture, and data-processing pipelines to be implemented inside the FPGA rather than entirely in external memory. Typical applications include industrial control and acquisition, high-speed networking, video processing, instrumentation, communications infrastructure, and embedded signal-processing systems. The Spartan-6 LX architecture is especially useful when several buses or real-time channels must be processed concurrently, because each configurable logic block and RAM block can operate as a dedicated pipeline stage. PCB design should follow the AMD Spartan-6 package pinout files and the device power, decoupling, configuration, clocking, and differential-pair guidance. The 676-ball BGA requires careful escape-routing, via-in-pad considerations where applicable, and uninterrupted supply and ground planes. Configuration signals and clock inputs should be protected against ringing and noise during power-up. This page organizes the device’s principal specifications, verified drop-in options, application guidance, package considerations, and selection trade-offs into a practical engineering reference for designers evaluating the XC6SLX75-N3FG676C.

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XC6SLX75T-2CSG484C - Spartan-6 FPGA 74,637 LEs | AMD
XC6SLX75T-2CSG484C

XC6SLX75T-2CSG484C - Spartan-6 FPGA 74,637 LEs | AMD

The AMD XC6SLX75T-2CSG484C is a Field Programmable Gate Array (FPGA) from the Spartan-6 LXT family, built on a mature 45 nm low-power copper process technology. It delivers 74,637 logic cells, 3,170,304 total RAM bits, and 292 user I/O pins in a 484-pin CSBGA (19x19 mm) package. Operating from a 1.2V core supply (1.14V to 1.26V range), this device is designed for high-volume applications requiring leading system integration at the lowest total cost. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks, interconnects, and I/O blocks that can be programmed to implement any digital logic function. The Spartan-6 family sits within the broader FPGA hierarchy: FPGA -> SRAM-based FPGA -> mid-range FPGA -> Spartan-6 family -> Spartan-6 LXT. This mid-range family balances logic density, DSP capability, and I/O performance for cost-sensitive applications. Key features of the XC6SLX75T-2CSG484C include 74,637 logic cells, 3,170,304 RAM bits, 292 user I/O pins, and support for multiple I/O standards including LVCMOS, LVDS, and HSTL. The device also includes DSP48A1 slices for high-performance digital signal processing, memory controller blocks for DDR/DDR2/DDR3 support, and advanced clock management tiles (CMT) with PLL and DCM. The 45nm process delivers half the power consumption of previous Spartan families while providing faster, more comprehensive connectivity. Technically, the Spartan-6 LXT architecture integrates a hard PCI Express endpoint, tri-mode Ethernet MACs, and high-speed GTP transceivers (on T variants) for serial connectivity. The device supports configuration via SPI, BPI, JTAG, or SelectMAP interfaces. The -2 speed grade offers a balanced performance point, with internal block RAM operating up to 400 MHz and DSP slices supporting 250 MHz operation. The 484-CSBGA package provides a compact 19x19 mm footprint with 292 user I/Os, enabling dense board designs. Typical applications include industrial automation, automotive infotainment, medical imaging, video processing, and communications infrastructure. The device's combination of logic density, DSP capability, and low power makes it suitable for motor control, machine vision, and software-defined radio systems. The 1.2V core voltage and 45nm process ensure efficient operation in power-constrained environments. When designing with this device, ensure adequate decoupling on the 1.2V core supply and 2.5V/3.3V auxiliary rails. Use the dedicated configuration pins for reliable programming, and consider the thermal profile of the CSBGA package in high-density designs. The device supports partial reconfiguration for flexible system updates.

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XC6SLX75T-2FG484I - 74K Spartan-6 LXT FPGA | AMD
XC6SLX75T-2FG484I

XC6SLX75T-2FG484I - 74K Spartan-6 LXT FPGA | AMD

The AMD XC6SLX75T-2FG484I is a Spartan-6 LXT field-programmable gate array containing 74,637 configurable logic elements organized into 5,831 configurable logic blocks, with a stated operating speed of 667 MHz and 268 I/Os in a 484-ball FBGA package measuring 23 x 23 mm with 1 mm ball pitch. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, memory, and I/O behavior are configured after manufacture. An FPGA belongs to the programmable-logic hierarchy and combines parallel programmable logic blocks with configurable input/output resources. This integration allows one physical device to implement control logic, signal processing, interface bridging, and embedded system functions without relying on a large collection of fixed-function logic ICs. The Spartan-6 LX device family combines substantial programmable logic capacity with a high number of user I/Os. In the XC6SLX75T-2FG484I, 268 I/Os support communication with external processors, memory, converters, sensors, and industrial peripherals. The -2 performance grade and 667 MHz stated operating speed place the device in the Spartan-6 LX performance range, while the industrial-temperature suffix supports equipment designed for extended commercial and industrial operating environments. The 484-ball FBGA package uses a 1 mm pitch and provides a compact, high-pin-count surface-mount footprint. Its 23 x 23 mm body makes it appropriate for dense control boards, but the fine ball pitch requires careful PCB layout, manufacturing control, inspection, and connector or test-point planning. The LXT designation also identifies this as a Spartan-6 member intended for designs requiring more logic resources and I/O capacity than smaller LX variants. Typical uses include industrial automation, data acquisition, motion control, communications gateways, embedded instrumentation, and general-purpose digital signal processing. Its combination of 74,637 logic elements, 5,831 configurable logic blocks, and 268 I/Os is particularly useful when several parallel control paths, high-speed interfaces, and protocol conversion functions must share one programmable device. PCB design should follow the AMD Spartan-6 package pinout files for every ball assignment and keep sensitive interfaces away from noisy power and switching paths. Decoupling, clock routing, configuration handling, bank voltage planning, and thermal performance require careful implementation before the FPGA is released for production. This page organizes the principal device characteristics, practical application guidance, verified package details, and compatible Spartan-6 orderable variants into a focused engineering reference for design evaluation and component sourcing.

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XC6SLX75T-2FG676I - Spartan-6 LXT 74,637-Cell FPGA | AMD
XC6SLX75T-2FG676I

XC6SLX75T-2FG676I - Spartan-6 LXT 74,637-Cell FPGA | AMD

AMD XC6SLX75T-2FG676I is a Spartan-6 LXT field-programmable gate array with 74,637 logic cells, 5,831 configurable logic blocks, 348 user I/O, and a maximum stated clock frequency of 667 MHz. It is manufactured on 45 nm CMOS technology, operates from a 1.2 V core supply, and is packaged in a 676-ball FBGA measuring 27 x 27 mm with 1 mm ball pitch. The -2 suffix identifies the speed grade, FG676 identifies the package configuration, and the final I designates the industrial temperature grade. A field-programmable gate array is a programmable digital semiconductor within the broader FPGA and semiconductor hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA combines configurable logic blocks, programmable interconnect, block RAM, digital signal processing resources, and programmable input/output resources on one device. This allows parallel digital architectures to be implemented in hardware and updated through a configuration bitstream without changing the printed circuit board. The XC6SLX75T-2FG676I provides 74,637 logic cells for medium-density systems requiring substantially more parallel processing capacity than small programmable logic devices. Its 5,831 configurable logic blocks and 348 user I/O support interfaces for control logic, data acquisition, industrial automation, communications, embedded vision, and test equipment. A 667 MHz stated clock frequency establishes the device family’s speed context, while designers must still apply the appropriate timing constraints for each implemented path. Technically, the device belongs to the Spartan-6 LXT family and uses 45 nm CMOS fabrication with a 1.2 V core supply. Its large 676-ball FBGA exposes a substantial bank of user I/O and dedicated configuration, power, clock, and ground resources. The 27 x 27 mm body and 1 mm pitch require a dense PCB escape-routing strategy, careful power-plane planning, and assembly-process control. Configuration storage and serial or parallel programming behavior should be designed according to the AMD package pinout files. Typical applications include industrial automation controllers, embedded video processing, communications infrastructure, instrumentation, aerospace and defense equipment, and high-speed bridging designs. Its combination of programmable logic, DSP capability, block RAM, and a large I/O count makes it suitable for systems that must consolidate parallel control, data acquisition, and protocol conversion functions into a single FPGA. The primary design trade-off is package density rather than electrical function. A 676-ball FBGA supports many connections but demands fine-pitch PCB layout, adequate layer count, controlled impedance, and assembly capability. Engineers should preserve the AMD package pinout and Spartan-6 package files when assigning pins and planning the board stack-up. This page combines package identification, application guidance, design considerations, and structured comparisons that help engineers evaluate the XC6SLX75T-2FG676I for new FPGA designs, industrial control platforms, and legacy Spartan-6 LXT board upgrades.

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XC6SLX75T-3FG484I - 74,637-Cell Spartan-6 FPGA | AMD
XC6SLX75T-3FG484I

XC6SLX75T-3FG484I - 74,637-Cell Spartan-6 FPGA | AMD

The AMD XC6SLX75T-3FG484I is a Spartan-6 LXT field-programmable gate array with 74,637 logic cells, 268 I/O, a -3 speed grade, and a 484-pin FBGA package. The device is manufactured on 45 nm CMOS technology, operates from a 1.2 V core supply, and is listed with an internal frequency of 667 MHz. Its 23 mm by 23 mm package uses a 1 mm ball pitch. A field-programmable gate array, or FPGA, is a programmable digital semiconductor within the broader logic IC and semiconductor hierarchy. Its configurable logic blocks, programmable interconnect, and I/O resources implement digital control, signal processing, interface, and embedded systems without requiring a custom mask-programmed ASIC. Spartan-6 devices combine configurable fabric with hard DSP and memory resources for cost-sensitive embedded and high-volume logic designs. The XC6SLX75T-3FG484I provides 74,637 logic cells and 268 user I/O in the LXT Spartan-6 family. Its 45 nm CMOS construction supports integration of programmable logic with dedicated DSP resources, while the -3 designation identifies the device's performance grade. The 484-ball FBGA package provides a high-pin-count connection option for designs requiring substantial external interface resources. The LXT family supports communications-oriented designs that combine programmable logic with dedicated hardware suitable for DSP, interface, and embedded processing workloads. A maximum internal frequency of 667 MHz is listed for this device, although achievable system performance depends on the selected clocking architecture, routing, I/O standards, memory interface configuration, and timing constraints implemented in the FPGA design. Typical uses include industrial control, communications infrastructure, consumer-oriented signal processing, embedded systems, video and image processing, and test equipment. The XC6SLX75T-3FG484I is appropriate when a design requires more logic and I/O than a smaller FPGA while retaining the same 484-pin package used by compatible Spartan-6 options. The -3 grade is suited to designs prioritizing higher performance over lower-speed alternatives. Board design must account for the large 484-ball FBGA footprint, multilayer PCB construction, controlled-impedance routing, clean power and ground distribution, and adequate thermal management. Designers should use the AMD Spartan-6 package pinout files and device-specific pin constraints when assigning package balls. Configuration storage, clocking, decoupling, and bank-specific voltage requirements also require careful implementation before schematic and PCB signoff. This product page combines package, density, speed-grade, temperature, and sourcing information with application guidance, engineering design notes, and same-package replacement analysis. It is intended to help engineers assess Spartan-6 LXT design fit, identify pin-compatible options, and prepare a robust 484-FBGA implementation.

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XC6SLX75T-3FG676I - Spartan-6 LXT FPGA | Xilinx
XC6SLX75T-3FG676I

XC6SLX75T-3FG676I - Spartan-6 LXT FPGA | Xilinx

The Xilinx XC6SLX75T-3FG676I is a Spartan-6 LXT field-programmable gate array built on 45 nm CMOS technology, with 74,637 logic cells, 5,831 configurable logic blocks, and a 667 MHz internal frequency. The device provides 348 I/Os in a 676-pin FCBGA package measuring 27 x 27 mm with a 1 mm pitch, and it is intended for industrial-temperature operation from 0°C to 85°C. An FPGA is a semiconductor whose digital logic, I/O paths, memory blocks, and embedded processing elements are configured after manufacture. The Spartan-6 LXT family combines programmable logic with dedicated DSP blocks, block RAM, clock management, and high-speed serial transceivers. This hierarchy places the XC6SLX75T within FPGA and CPLD devices, programmable-logic semiconductors, and the broader embedded-computing market. The -3 speed grade provides the highest performance among the Spartan-6 LXT speed grades identified for this family. Its 74,637 logic cells and 348 I/Os make it suitable for interfaces, control logic, image processing, industrial automation, communications bridging, and embedded signal-processing systems. The 5,831 CLBs provide substantial parallel-processing capacity, while the 667 MHz internal frequency supports demanding synchronous designs and clocked interfaces. The 676-pin FCBGA construction provides a high pin count for external memory, parallel buses, high-speed I/O, and dedicated transceiver connections. The 45 nm CMOS process combines relatively high programmable-logic density with low-cost implementation. Spartan-6 devices are also recognized for integrated system connectivity, including high-speed serial transceivers, memory controllers, DSP processing, and Ethernet-related interface capabilities. Typical applications include industrial control systems, automotive infotainment interfaces, network-bridge designs, video-processing pipelines, test equipment, and embedded communications equipment. The 348 I/Os are especially useful when a design needs multiple parallel buses, control signals, external memory interfaces, or several differential links in one device. Design work should begin with the 676-ball package pinout, power rails, decoupling requirements, configuration interface, clocking plan, and pin-speed constraints. Signal-integrity checks are particularly important for high-speed transceiver links, while power sequencing and thermal analysis should be completed before layout release. Validate the selected bitstream, I/O standards, and timing constraints on hardware representative of the production design. This product page combines package, logic-density, speed-grade, and I/O information with practical configuration guidance and drop-in comparison options. It is intended to help engineers shorten device selection, footprint review, migration, and design-planning time before consulting the complete AMD/Xilinx Spartan-6 device documentation.

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XC6SLX9-2CPG196I - Spartan-6 LX FPGA, 9152 Cells, 196-CSBGA | AMD
XC6SLX9-2CPG196I

XC6SLX9-2CPG196I - Spartan-6 LX FPGA, 9152 Cells, 196-CSBGA | AMD

The AMD (Xilinx) XC6SLX9-2CPG196I is a Spartan-6 LX family Field Programmable Gate Array (FPGA) built on a 45 nm CMOS process, integrating 9,152 logic cells across 715 configurable logic blocks (CLBs) in a 196-ball Chip-Scale BGA (CSBGA) package. The device provides up to 106 user I/O pins, 576 Kbit embedded block RAM, dedicated DSP48A1 slices, and operates across the industrial -40C to +100C temperature range with a -2 speed grade offering up to 667 MHz internal clock performance. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic function is defined after manufacturing by configuration bitstream loading, belonging to the programmable logic device family within the broader digital semiconductor taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit). Unlike fixed-function ASICs, FPGAs use an array of configurable logic blocks (CLBs), programmable routing, and dedicated hard IP blocks (Block RAM, DSP slices, transceivers, clock management tiles) to implement arbitrary digital logic. The Spartan-6 LX family targets cost-sensitive, high-volume applications requiring low static and dynamic power without sacrificing performance. Key features of the XC6SLX9-2CPG196I include 576 Kbits of block RAM, 16 DSP48A1 slices at 18x18 multiplication, an integrated hard IP for PCI Express endpoint (Gen1), dedicated Memory Controller block supporting DDR, DDR2, DDR3, and QDR II+ interfaces, plus the security-enhanced SelectIO technology. The 196-ball CSBGA package supports up to 106 user I/Os with 1.2V core operation and 2.5V/3.3V tolerant SelectIO interfaces, simplifying multi-voltage system integration. Architecturally, the Spartan-6 LX FPGA uses a 6-input LUT-based logic fabric with dedicated carry chains for arithmetic, dual-port Block RAM columns distributed throughout the fabric, and DSP48A1 slices combining an 18x18 multiplier with a 48-bit accumulator. On-chip clock management tiles (CMTs) integrate PLLs and DLLs for flexible clock synthesis. The -2 speed grade balances die cost against timing closure in mainstream applications. Typical applications include industrial motor control, video processing front-ends, low-cost consumer electronics with custom logic, legacy industrial protocol bridging, and PCIe endpoint cards. The wide operating temperature and DSP slices make it suitable for portable test instruments and embedded vision pre-processing. When designing with this part, verify that the 196-ball CSBGA footprint is within PCB layout capability for fine-pitch BGA assembly, and confirm that Vivado (or legacy ISE for older toolchain compatibility) supports the Spartan-6 family design flow, since newer Vivado versions may require legacy installation. This page synthesizes cross-reference equivalents, applied design context, and distributor pricing not found in the standalone AMD datasheet, giving engineers a one-stop selection resource for the XC6SLX9-2CPG196I.

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XC6SLX9-2CSG225C - Spartan-6 LX FPGA, 9152 Cells, 160 I/O | AMD
XC6SLX9-2CSG225C

XC6SLX9-2CSG225C - Spartan-6 LX FPGA, 9152 Cells, 160 I/O | AMD

The AMD (Xilinx) XC6SLX9-2CSG225C is a Spartan-6 LX field programmable gate array (FPGA) integrating 9,152 logic cells (715 Configurable Logic Blocks) into a 225-ball Chip-Scale BGA (CSG225) package with 160 user I/Os. Built on a 45 nm CMOS process node, this cost-optimized FPGA operates from a 1.14 V to 1.26 V core supply, supports maximum I/O toggle rates up to 667 MHz, and targets high-volume bridging, consumer, and industrial designs. An FPGA (Field Programmable Gate Array) is a programmable logic device that lets engineers implement any digital circuit in hardware via LUTs (Look-Up Tables) and programmable interconnects. In the broader taxonomy, an FPGA sits between a CPLD (Complex Programmable Logic Device) and an ASIC (Application Specific Integrated Circuit): faster to deploy than an ASIC, denser than a CPLD, and reprogrammable in-system. FPGAs are typically classified by family, logic cell count, I/O count, and package. Key features include 9,152 logic cells, 589,824 bits of embedded block RAM, dedicated DSP48A1 slices, integrated DCM and PLL clock-management tiles, and a -2 speed grade balanced for both logic speed and low power. Hard IP blocks such as memory controllers (MCB), PCIe Endpoint (LXT/SXT variant only), and GTP transceivers (LXT variant only) reduce soft-logic area. The 225-pin CSBGA package is RoHS-compliant, lead-free, and measures 13 x 13 mm with a 0.8 mm ball pitch. Architecturally the Spartan-6 family uses 6-input LUTs, dual 18 Kb block RAM blocks per slice, and dedicated carry chains that support fast arithmetic. The Xilinx ISE / Vivado toolchain with the Spartan-6 device libraries delivers RTL-to-bitstream synthesis, supporting Verilog, VHDL, and high-level synthesis flows. Compared with Spartan-7 (28 nm), Spartan-6 (45 nm) is older but remains in service for cost-sensitive designs where users have stable tool flows. Typical applications include LED and video display controllers, automotive infotainment bridging, industrial control and automation boards, motor control back-ends, and low-cost consumer peripherals. The wide I/O count and 45 nm efficiency make it suitable for parallel sensor aggregation and protocol bridging (e.g. UART/SPI/I2C to high-speed LVDS). Designers should be aware that the XC6SLX9 CSG225 contains 160 user I/Os rather than the 225 ball count; remaining balls are power, ground, and configuration. JTAG programming via the standard Xilinx platform cable (USB or parallel-IV) is supported, and the part uses SelectMAP / Serial (SPI) configuration modes from common flash memories. The ISE 14.7 toolchain is the final supported design environment, with migration paths to Spartan-7 recommended for new designs. This page synthesizes distributor pricing (DigiKey/Mouser), drop-in Spartan-6 family alternatives, and engineering-relevant design notes that go beyond the raw manufacturer datasheet.

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XC6SLX9-2CSG225I - 9152-Cell Spartan-6 FPGA | AMD
XC6SLX9-2CSG225I

XC6SLX9-2CSG225I - 9152-Cell Spartan-6 FPGA | AMD

AMD/Xilinx XC6SLX9-2CSG225I is a Spartan-6 LX field-programmable gate array containing 9,152 programmable logic cells, 589,824 RAM bits, 160 user I/O, and 715 configurable logic blocks in a 225-ball CSPBGA package. The supplied data identifies a 1.14 V to 1.26 V operating-supply range, a -2 speed grade, and an industrial temperature designation. An FPGA is a semiconductor whose digital logic, interconnects, memory resources, and I/O behavior are configured after manufacture. The Spartan-6 family belongs to the FPGA and CPLD hierarchy and is commonly used where parallel logic, embedded block RAM, programmable interfaces, and deterministic control must be consolidated into one configurable device. Unlike a fixed-function microcontroller, this device does not execute software as its primary operating model; it implements a hardware circuit defined by a bitstream. Verified listings report 160 I/O, 589,824 total RAM bits, 9,152 logic cells, and 715 CLBs. This resource mix makes the part suitable for control logic, protocol bridging, data acquisition, preprocessing, industrial automation, and embedded signal-processing systems. The -2 suffix denotes the device speed grade, while the I suffix identifies the industrial-grade ordering variant. Its CSPBGA-225 package measures 13 mm by 13 mm according to the supplied comparison data. The XC6SLX9 device combines programmable logic with dedicated block RAM and user I/O in one package. Exact I/O standards, supported interfaces, pin functions, clocking limits, configuration requirements, and AC timing values are not provided in the verified excerpts and must therefore be confirmed against AMD documentation before schematic capture or PCB release. The package is a complex BGA device requiring careful escape routing and controlled assembly. Typical installations include industrial controllers, sensor and measurement interfaces, communications equipment, video or imaging control, and compact embedded systems requiring deterministic parallel behavior. Designers should select I/O standards and voltage domains supported by the selected bank, preserve configuration access, validate pin assignments, and confirm timing against the design’s clock and interface requirements. A critical integration concern is BGA layout quality: layer count, via strategy, solder-mask definition, pad-to-mask ratios, and assembly capability should be reviewed early because the CSPBGA-225 footprint is difficult to inspect visually after assembly. Use AMD’s package and pinout resources rather than inferring ball assignments from the commercial suffix. This page consolidates verified distributor specifications, source availability, cross-reference findings, and engineering-oriented cautions that are not presented as one unified block in the original product snippets. It distinguishes confirmed values from missing technical data rather than estimating pinout, timing, or performance parameters.

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