XC6SLX75T-3FG484I - 74,637-Cell Spartan-6 FPGA | AMD
MPN： XC6SLX75T-3FG484I ✓ 啟用中XC6SLX75T-3FG484I 概覽
A field-programmable gate array, or FPGA, is a programmable digital semiconductor within the broader logic IC and semiconductor hierarchy. Its configurable logic blocks, programmable interconnect, and I/O resources implement digital control, signal processing, interface, and embedded systems without requiring a custom mask-programmed ASIC. Spartan-6 devices combine configurable fabric with hard DSP and memory resources for cost-sensitive embedded and high-volume logic designs.
The XC6SLX75T-3FG484I provides 74,637 logic cells and 268 user I/O in the LXT Spartan-6 family. Its 45 nm CMOS construction supports integration of programmable logic with dedicated DSP resources, while the -3 designation identifies the device's performance grade. The 484-ball FBGA package provides a high-pin-count connection option for designs requiring substantial external interface resources.
The LXT family supports communications-oriented designs that combine programmable logic with dedicated hardware suitable for DSP, interface, and embedded processing workloads. A maximum internal frequency of 667 MHz is listed for this device, although achievable system performance depends on the selected clocking architecture, routing, I/O standards, memory interface configuration, and timing constraints implemented in the FPGA design.
Typical uses include industrial control, communications infrastructure, consumer-oriented signal processing, embedded systems, video and image processing, and test equipment. The XC6SLX75T-3FG484I is appropriate when a design requires more logic and I/O than a smaller FPGA while retaining the same 484-pin package used by compatible Spartan-6 options. The -3 grade is suited to designs prioritizing higher performance over lower-speed alternatives.
Board design must account for the large 484-ball FBGA footprint, multilayer PCB construction, controlled-impedance routing, clean power and ground distribution, and adequate thermal management. Designers should use the AMD Spartan-6 package pinout files and device-specific pin constraints when assigning package balls. Configuration storage, clocking, decoupling, and bank-specific voltage requirements also require careful implementation before schematic and PCB signoff.
This product page combines package, density, speed-grade, temperature, and sourcing information with application guidance, engineering design notes, and same-package replacement analysis. It is intended to help engineers assess Spartan-6 LXT design fit, identify pin-compatible options, and prepare a robust 484-FBGA implementation.
直接替換替代品，適用於 XC6SLX75T-3FG484I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
XC6SLX75T-2FG484I
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查看資料表 →XC6SLX75T-2FGG484I
✅ 直接替換📋 參考替代品（不在目錄中）
XC6SLX75T-3FGG484I
✅ 直接替換📋 參考替代品（不在目錄中）
XC6SLX75T-3FG484C
✅ 直接替換📋 參考替代品（不在目錄中）
XC6SLX75T-N3FG484I
✅ 直接替換📋 參考替代品（不在目錄中）
XC6SLX75T-3FG484I 最大額定值與電氣特性
| Device Type | Spartan-6 LXT field-programmable gate array |
| Logic Cells | 74,637 cells |
| User I/O | 268 I/O |
| 封裝 | 484-pin FBGA |
| Package Dimensions | 23 mm x 23 mm |
| Ball Pitch | 1.0 mm |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Maximum Internal Frequency | 667 MHz |
| Speed Grade | -3 |
| 工作溫度 | 0 C to 85 C |
| FPGA Family | Spartan-6 LXT |
| Total Pins | 484 pins |
| 安裝類型 | Surface Mount |
| Qualification | Industrial temperature range |
XC6SLX75T-3FG484I 23 mm x 23 mm 腳位配置指南
XC6SLX75T-3FG484I（23 mm x 23 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： XC6SLX75T-3FG484I.
請參閱 資料表 以查看完整腳位配置。
典型應用
XC6SLX75T-3FG484I 適用於 6 應用s: Industrial Control and Automation, Communications Interface Equipment, Consumer-Oriented DSP Processing, Embedded Instrumentation, Video and Image Processing, Test and Measurement Equipment.
Industrial Control and Automation
The XC6SLX75T-3FG484I fits industrial controllers that combine machine sequencing, sensor acquisition, actuator control, and communications in one programmable device. Its 74,637 logic cells provide substantial configurable logic, while 268 user I/O support multiple digital interfaces and control signals. The listed 0 C to 85 C operating range is appropriate for many factory environments. Designers can partition the fabric among real-time control, data validation, diagnostics, and communication protocols. The -3 grade offers additional timing margin for synchronous control paths, although final clock rates must be verified through post-route timing analysis.
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Communications Interface Equipment
The XC6SLX75T-3FG484I is suitable for communications interface equipment requiring programmable packet handling, parallel-to-serial conversion, and dedicated control logic. The large I/O count allows the design to connect multiple buses and data sources, while the Spartan-6 LXT fabric can implement protocol state machines, packet filters, and timing controls. Its listed 667 MHz maximum internal frequency provides resources for wide synchronous interfaces. Engineers should use the AMD package pinout files to plan high-speed routing and assign I/O standards carefully, particularly for interfaces requiring controlled impedance or differential clocking.
推薦
Consumer-Oriented DSP Processing
The Spartan-6 LXT architecture makes the XC6SLX75T-3FG484I suitable for cost-sensitive consumer DSP, filtering, waveform, and mixed signal-interface designs. Its 74,637 logic cells can accommodate parallel datapaths, control state machines, and digital filtering, while the -3 grade is appropriate for designs with tighter synchronous timing requirements. Dedicated DSP resources should be evaluated against the required sample rate and arithmetic precision during device selection. A practical implementation places high-speed memory and converter interfaces close to their assigned FPGA balls, with separate attention to clock jitter, grounding, and impedance-controlled signal paths.
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Embedded Instrumentation
The XC6SLX75T-3FG484I can implement embedded instrumentation systems that combine acquisition control, digital signal processing, local storage, and a host interface. Its 268 user I/O allow multiple sensors, status indicators, memories, and communication ports to share a single FPGA. The -3 speed grade supports demanding synchronous control logic, while the Spartan-6 LXT family provides a balance of programmable resources and device integration. For laboratory or field equipment, designers should define clock domains carefully, validate acquisition timing at each interface, and provide clean references for sensitive converter and analog front-end circuitry.
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Video and Image Processing
The XC6SLX75T-3FG484I is suitable for parallel video processing, image preprocessing, pixel transport, and test-pattern generation. Its 74,637 logic cells provide enough parallel capacity for timing control, line and pixel counters, lookup logic, and data-path transformations, while 268 I/O support wide synchronous interfaces. The listed maximum internal frequency of 667 MHz is useful for synchronous video timing, although actual pixel-clock performance depends on routing and memory bandwidth. PCB design should use short matched routes for source-synchronous interfaces and separate noisy digital switching from sensitive reference and power networks.
推薦
Test and Measurement Equipment
The XC6SLX75T-3FG484I fits programmable test systems requiring deterministic sequencing, pattern generation, protocol capture, and real-time analysis. The 74,637-cell Spartan-6 LXT device can combine acquisition logic, counters, timing engines, and buffer management within a single package, while 268 I/O support dense fixture or backplane connections. The -3 performance grade is advantageous for synchronous test-clock domains. Engineers should establish timing budgets in the RTL, use the package pinout to optimize clock and data routes, and maintain separate clock, data, and power-supply distribution to preserve measurement repeatability and signal integrity.
推薦
推薦產品摘要
工程參考資料，適用於 XC6SLX75T-3FG484I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC6SLX75T-2FG484I | XC6SLX75T-2FGG484I | XC6SLX75T-3FGG484I | XC6SLX75T-3FG484C | XC6SLX75T-N3FG484I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 484-BBGA | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same |
| FPGA Family | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT |
| Logic Cells | 74,637 cells | 74,637 cells | 74,637 cells | 74,637 cells | 74,637 cells | 74,637 cells |
| User I/O | 268 I/O | 268 I/O | 268 I/O | 268 I/O | 268 I/O | 268 I/O |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | -3 | -2 | -2 | -3 | -3 | -N3 |
| Maximum Internal Frequency | 667 MHz | 667 MHz | 667 MHz | 667 MHz | 667 MHz | 667 MHz |
主要差異化特點
- Higher selected speed grade than the -2 replacement (對比XC6SLX75T-2FG484I)
- Industrial-temperature ordering suffix (對比XC6SLX75T-3FG484C)
- Same density, package, and I/O count across the replacement set (對比XC6SLX75T-N3FG484I)
設計說明
Use the AMD Spartan-6 package-device pinout files to assign all 484 package balls before routing. Treat VCC, GND, configuration, clock, and general-purpose I/O balls as separate constraint groups. A 23 mm by 23 mm FBGA with 1 mm pitch requires multilayer PCB construction, short escape routes, uninterrupted reference planes, and via arrays placed where they preserve current flow without obstructing neighboring signal escape channels.
Plan the 1.2 V core supply and configurable I/O supplies as separate distribution networks, with local decoupling placed directly beneath or close to the assigned device balls. Use the device datasheet for the exact bank voltage, current, sequencing, and decoupling requirements. Check startup current and worst-case utilization rather than relying on typical power estimates, because the FPGA can draw substantially more current as logic, DSP, and I/O activity increase.
Assign clocks and source-synchronous interfaces according to the device's package and bank constraints. Keep clock traces short, use matched routing for data groups, and provide clean references without routing over split power or ground planes. The listed 667 MHz internal frequency does not by itself guarantee 667 MHz I/O performance; timing analysis must include package delay, board loss, skew, external component delay, and the selected FPGA I/O standard.
Estimate junction temperature from the actual configuration, utilization, switching activity, supply voltage, ambient temperature, and board thermal resistance. A 484-FBGA design can concentrate heat beneath the device even when the air temperature is moderate. Provide uninterrupted copper planes, thermal vias, a balanced placement of decoupling components, and enough enclosure airflow or heat-spreading structure to prevent localized junction temperature from exceeding the device limit.
Do not treat a shared 484-BBGA package as proof that every suffix is an automatic drop-in replacement. Speed grade, temperature grade, configuration method, supported I/O standards, and bitstream compatibility can differ. Rebuild or verify timing with the exact replacement device, confirm the package drawing, and review the AMD device constraints and pinout files before releasing production artwork.
合規資訊
The manufacturer documentation identifies the device as a Spartan-6 LXT FPGA, but no explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status was identified for this ordering code.
