10M08DCF256I7G vs 10M25DCF256I7G 比較

詳細並排比較 10M08DCF256I7G 由 Intel 與 10M25DCF256I7G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
10M08DCF256I7G 10M08DCF256I7G - MAX 10 FPGA, 8K LE, 256-FBGA | Intel

10M08DCF256I7G - MAX 10 FPGA, 8K LE, 256-FBGA | Intel

10M08DCF256I7G ✓ 啟用中
Intel
10M25DCF256I7G 10M25DCF256I7G - MAX 10 FPGA, 25K LE, 256-BGA | Intel

10M25DCF256I7G - MAX 10 FPGA, 25K LE, 256-BGA | Intel

10M25DCF256I7G ✓ 啟用中

規格比較

參數 10M08DCF256I7G 10M25DCF256I7G
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Series MAX 10 MAX 10
Family MAX 10 FPGA —
Logic Elements (LE) 8,000 25,000
Embedded Memory (bits) 387,072 —
User I/O Count 178 —
DSP Blocks (18x18) [DATA_NEEDED: 18x18 multiplier count] —
封裝 256-FBGA (FineLine BGA) —
安裝類型 Surface Mount Surface Mount
工作溫度 -40C to +100C (Industrial) -40C to +100C (Industrial)
Supply Voltage - Core [DATA_NEEDED: core voltage range] —
Supply Voltage - I/O Banks 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) —
Configuration Memory On-chip dual-configuration flash (non-volatile) On-chip flash (non-volatile, instant-on)
On-die ADC 12-bit, up to 1 MSa/s —
External Memory Interface LPDDR2 / DDR3 / DDR3L —
RoHS 狀態 Compliant Compliant
Lead-Free Yes —
Process Technology 55 nm NOR-flash-backed CMOS —
Number of LABs/CLBs — 1,563
Total RAM Bits — 691,200 (675 Kbit)
Number of I/O Pins — 178
封裝 / 外殼 — 256-LBGA (F256, 17x17 mm, 1.0 mm pitch)
Speed Grade — I7 (fastest industrial speed grade)
User Flash Memory — [DATA_NEEDED: user flash size in Mbit]
Embedded ADC — 12-bit, multi-channel (per MAX 10 family)
PLLs — [DATA_NEEDED: PLL count per F256 variant]
DSP Blocks — [DATA_NEEDED: DSP block count]
Programming Method — JTAG / Passive Serial (via Quartus Prime)
MSL 等級 — 3 (per BGA handling)
Lead-Free / Halogen-Free — Yes
Packaging — Tray

資料表與資源

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