10M25DCF256A7G vs 10CL025YU256A7G 比較

詳細並排比較 10M25DCF256A7G 由 Intel 與 10CL025YU256A7G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
10M25DCF256A7G 10M25DCF256A7G - MAX 10 FPGA, 25K LE, 256-FBGA | Intel

10M25DCF256A7G - MAX 10 FPGA, 25K LE, 256-FBGA | Intel

10M25DCF256A7G ✓ 啟用中

規格比較

參數 10M25DCF256A7G 10CL025YU256A7G
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family MAX 10 Cyclone 10 LP
Logic Elements (LE) 25,000 —
Adaptive Logic Modules (ALM) [DATA_NEEDED: ALM count] —
Embedded Memory (Kbits) 1,728 —
Embedded Memory (M9K Blocks) [DATA_NEEDED: M9K block count] —
Maximum User I/Os 178 —
DSP Blocks (18x18 Multipliers) 45 —
PLLs 4 4
Global Clock Networks [DATA_NEEDED: global clock count] —
Process Technology TSMC 55nm NOR Flash —
Core Voltage (VCCINT) 1.2 V —
I/O Voltage (VCCIO) 3.3 V (supports 1.2/1.5/1.8/2.5/3.3 V) —
Configuration Internal dual-configuration flash (non-volatile) —
Integrated ADC 12-bit, up to 1 Msps, 17 channels —
封裝 256-ball FBGA (F256) 256-UBGA (Ultra FineLine BGA)
Speed Grade -7 —
Temperature Grade Commercial (0C to +85C) —
工作溫度 0C to +85C —
Maximum Core Frequency 450 MHz —
RoHS 狀態 Compliant Compliant
Logic Elements — 24,624
Embedded Memory (bits) — 608,256
Embedded 18x18 Multipliers — 66
User I/O Count — 150
Package Body Size — 17 mm x 17 mm
Ball Pitch — 1.0 mm
Process Node — 60 nm
Operating Temperature Grade — Automotive / Industrial
Configuration Modes — AS, PS, JTAG
安裝類型 — Surface Mount
MSL 等級 — 3

資料表與資源

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