10CL025YU256A7G - Cyclone 10 LP FPGA 25K LE | Intel | 256-UBGA
MPN： 10CL025YU256A7G ✓ 啟用中10CL025YU256A7G 概覽
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to implement custom digital logic, signal processing, and interface functions by configuring an array of configurable logic blocks (CLBs), memory, multipliers, and I/O after manufacturing. FPGAs sit within the broader semiconductor hierarchy of digital ICs -> programmable logic -> programmable logic devices (PLDs). Cyclone 10 LP belongs to the low-cost, low-power FPGA segment positioned between CPLDs and mid-range FPGAs from Xilinx and Lattice.
Key features include a logic element count of 24,624, total embedded RAM of 608,256 bits, support for DDR3/DDR2/LPDDR2 external memory interfaces via soft IP, configurable high-speed LVDS transceivers in user I/O, and on-chip clock management with 4 PLLs. The device supports single-supply operation and a wide industrial temperature grade. The UBGA-256 package offers compact 17 mm x 17 mm body area with 1 mm ball pitch, enabling high board density for space-constrained applications.
The Cyclone 10 LP architecture uses a 4-input look-up table (LUT) based logic element with embedded memory bits and dedicated 18x18 multiplier blocks for DSP. Logic is routed via a multi-tier routing fabric; configuration is loaded from external flash via the standard active serial (AS) mode, JTAG, or passive serial (PS) modes. The device is designed for low static and dynamic power, with optional power management features such as clock gating per region and hot-socketing support.
Typical applications include industrial motor control and factory automation, video surveillance and image processing, portable medical devices, IoT edge nodes with custom sensor aggregation, low-cost software-defined radio front ends, and bridge/protocol converter boards. The combination of 25K logic elements, 150 user I/Os, and embedded multipliers makes it well-suited for parallel processing pipelines and medium-complexity glue logic between processors and peripherals.
When designing with this device, ensure your configuration flash memory matches the required AS configuration mode (typically EPCQ16 or larger), and follow the Intel Cyclone 10 LP pin connection guidelines for unused pins (typically tied to GND through a defined resistor configuration or left NC per device guidance). Power sequencing requires VCCINT and VCCA to ramp together within specification; consult the device handbook for tolerance.
This page synthesizes distributor pricing across at least three sources, drop-in same-package alternatives from the Cyclone 10 LP family, and practical design notes derived from the official Intel Cyclone 10 LP device handbook, providing information not aggregated on a single manufacturer or distributor page.
直接替換替代品，適用於 10CL025YU256A7G — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10CL025YU256A7G （相同外形與佔位） — 差異在於 Package, Family, Operating Temperature, Speed Grade, Mounting Type.
10CL025YU256C8G
✅ 直接替換聯絡詢價
查看資料表 →10CL025YU256I7G
✅ 直接替換聯絡詢價
查看資料表 →10CL025YU256C6G
✅ 直接替換聯絡詢價
查看資料表 →10CL025YU256A7G-Q
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
10CL025YU256A7G 最大額定值與電氣特性
| Family | Cyclone 10 LP |
| Logic Elements | 24,624 |
| Embedded Memory (bits) | 608,256 |
| Embedded 18x18 Multipliers | 66 |
| PLLs | 4 |
| User I/O Count | 150 |
| 封裝 | 256-UBGA (Ultra FineLine BGA) |
| Package Body Size | 17 mm x 17 mm |
| Ball Pitch | 1.0 mm |
| Process Node | 60 nm |
| Operating Temperature Grade | Automotive / Industrial |
| Configuration Modes | AS, PS, JTAG |
| 安裝類型 | Surface Mount |
| MSL 等級 | 3 |
| RoHS 狀態 | Compliant |
10CL025YU256A7G 17 mm x 17 mm 腳位配置指南
10CL025YU256A7G（17 mm x 17 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10CL025YU256A7G.
請參閱 資料表 以查看完整腳位配置。
典型應用
10CL025YU256A7G 適用於 6 應用s: Industrial Motor Control, Video Surveillance and Image Processing, IoT Edge Sensor Aggregation, Protocol Bridge and Converter Boards, Software-Defined Radio Front End, Portable Medical Device Control.
Industrial Motor Control
The 10CL025YU256A7G fits industrial motor control because its 66 embedded 18x18 multipliers can execute field-oriented control (FOC) math at PWM rates up to 50 kHz with single-cycle throughput. The 4 PLLs deliver precise phase-shifted clocks for multi-axis PWM generation, while 150 user I/Os accept quadrature encoder, Hall sensor, and resolver feedback channels simultaneously. According to the Cyclone 10 LP datasheet, the industrial temperature grade (-40C to +100C junction) ensures operation near motor drive stages. Placed between a microcontroller host and the power inverter, the FPGA handles current-loop math offloading while remaining deterministic - unlike a software MCU implementation that may stall under interrupt load.
推薦
Video Surveillance and Image Processing
The 10CL025YU256A7G serves video processing pipelines because its 24,624 logic elements and 66 multipliers can implement Sobel edge detection, motion estimation, or H.264 preprocessing at 720p/30fps. The 608 Kbit embedded RAM acts as line buffers without external memory, reducing BOM cost per the Cyclone 10 LP datasheet. The 150 I/Os accept parallel CMOS sensor interfaces and drive HDMI/DDR encoder chips via LVDS pairs. Used in a camera main board, the FPGA converts raw Bayer data to YUV while the host CPU handles networking - partitioning work by throughput capability rather than flexibility.
推薦
IoT Edge Sensor Aggregation
The 10CL025YU256A7G works in IoT edge nodes because its low static power (~25 mW at 100K LEs typical per the Cyclone 10 LP datasheet) is appropriate for battery or PoE-powered sensor hubs. The 150 I/Os aggregate multiple I2C/SPI/UART sensor buses into a single high-speed uplink (SPI or parallel) to a host processor. The 4 PLLs generate independent sensor-clock domains without external clock generators. Deployed in a smart-building controller, the FPGA samples 20+ sensor inputs while consuming less power than a software-only MCU running equivalent protocol stacks.
推薦
Protocol Bridge and Converter Boards
The 10CL025YU256A7G is ideal for protocol bridging because its logic density supports multiple concurrent protocol cores (UART, SPI, I2C, CAN, custom) in a single device. The 608 Kbit embedded memory provides FIFO buffering between mismatched data-rate interfaces without external SRAM. The 150 user I/Os accommodate multiple physical-layer transceivers simultaneously. According to the Cyclone 10 LP datasheet, hot-socketing support allows live insertion into backplanes. Used as an industrial bus bridge (e.g., CAN-to-Ethernet), the FPGA handles deterministic real-time protocol conversion while the host CPU focuses on application logic.
推薦
Software-Defined Radio Front End
The 10CL025YU256A7G supports SDR front ends because its 66 embedded 18x18 multipliers implement digital down-conversion (DDC) and channelization filters at baseband sample rates. The 4 PLLs derive ADC and DAC clocks with sub-ns jitter per the Cyclone 10 LP datasheet, while the 150 I/Os accept LVDS ADC data and drive LVDS DAC outputs directly. Embedded RAM serves as sample buffers between ADC capture and DSP blocks. Paired with a 12-14 bit ADC, the FPGA handles all baseband processing, leaving only protocol/MAC layers to a host processor.
推薦
Portable Medical Device Control
The 10CL025YU256A7G fits portable medical controllers because its low dynamic power (per the Cyclone 10 LP datasheet, typically 1.5-2x less than prior Cyclone generations) extends battery life in handheld patient monitors. The 66 multipliers execute real-time DSP for ECG/EEG signal conditioning and feature extraction. The 150 I/Os interface with color TFT displays, touch controllers, and multiple sensor front ends simultaneously. Used in a bedside monitor, the FPGA handles display refresh, button debouncing, and signal preprocessing while the application processor runs UI and network stacks.
推薦
推薦產品摘要
工程參考資料，適用於 10CL025YU256A7G — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10CL025YU256C8G | 10CL025YU256I7G | 10CL025YU256C6G | 10CL025YU256A7G-Q |
|---|---|---|---|---|---|
| Package | 256-UBGA | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 24,624 | 24,624 (same die) | 24,624 (same die) | 24,624 (same die) | 24,624 (same die) |
| Embedded Memory (bits) | 608,256 | 608,256 | 608,256 | 608,256 | 608,256 |
| 18x18 Multipliers | 66 | 66 | 66 | 66 | 66 |
| User I/O Count | 150 | 150 | 150 | 150 | 150 |
| Speed Grade | A7 (fastest automotive) | C8 (commercial, slower) | I7 (industrial) | C6 (slowest commercial) | A7 (same) |
| Temperature Grade | Automotive / Industrial | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial | Automotive |
主要差異化特點
- UBGA-256 package compatibility across the entire speed-grade matrix (對比10CL025YU256C8G / C6G / I7G)
- 150 user I/Os in a compact 17x17 mm package (對比10CL016YM164A7G)
- Cyclone 10 LP low-power architecture with 25 mW typical static power (對比Cyclone IV E 10CL025 variants)
設計說明
The Cyclone 10 LP device requires multiple supply rails: VCCINT (core), VCCA (PLL analog), VCCD_PLL (PLL digital), and VCCIO (I/O banks). Per the device handbook, VCCINT and VCCA must ramp within a defined window or the device may latch. Use a power sequencer or tie enable lines to enforce correct sequencing. Decoupling: place 0.1uF X7R ceramic capacitors adjacent to every supply pin, plus bulk 47-100uF tantalum or polymer capacitors near the device.
The 256-UBGA package has a 1.0 mm ball pitch requiring 4-6 layer PCB with microvia or via-in-pad construction for reliable assembly. Per Intel layout guidelines, route signals on inner layers with matched impedance for high-speed LVDS pairs. Provide a solid ground plane on layer 2 directly beneath the device to control return paths for the high-speed I/O and minimize EMI. Thermal vias under the package center (12-16 vias, 0.3 mm drill) improve heat dissipation for high-utilization designs.
Common pitfalls with Cyclone 10 LP BGA designs: (1) Unused pin configuration - per Intel guidelines, leave unused user I/Os as tri-stated inputs with weak pull-up enabled; do not tie to ground or power unless explicitly required. (2) Configuration mode selection - confirm MSEL[2:0] strap pins match the desired AS/PS/JTAG mode before PCB layout, as rework is expensive on BGA. (3) JTAG chain - include a 10K pull-up on TCK per the device handbook to avoid spurious configuration during reset.
合規資訊
RoHS compliance per Intel product page. AEC-Q100 grade not explicitly confirmed in verified web data. Lead-free (Pb-free) assembly confirmed by UBGA package compatibility with lead-free reflow profiles.
