5CSEBA4U23C7N vs 5CSEBA4U23C6N 比較
詳細並排比較 5CSEBA4U23C7N 由 Intel 與 5CSEBA4U23C6N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | 5CSEBA4U23C7N | 5CSEBA4U23C6N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Device Variant | 5CSEA4 (Logic Element density) | — |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Logic Elements | 40,000 | 40,000 |
| HPS Maximum Core Frequency | 800 MHz | — |
| DSP Blocks (18x18) | 224 | — |
| Embedded Memory | Approximately 2.7 Mbits (M10K + M9K) | — |
| 封裝 | 672-ball UBGAs (UBGA), 23x23 mm | 672-pin UFBGA / UBGA, 23 x 23 mm, 0.8 mm pitch |
| Core Voltage | 1.1 V | — |
| User I/O Count | 364 | — |
| High-Speed Transceivers | 6 (up to 3.125 Gbps) | — |
| PCIe Hard IP | 2 Gen2 blocks | — |
| 工作溫度 | Commercial 0C to +85C (C7 speed grade) | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS 狀態 | Compliant | Compliant |
| Process Technology | TSMC 28 nm low-power | TSMC 28 nm low-power |
| HPS Memory Interface | DDR3, DDR3L, LPDDR2 (16-bit + ECC option) | — |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (M10K + MLAB) | — | 2,460 Kbits |
| DSP Blocks (18x18 Multipliers) | — | 112 |
| HPS Processor Cores | — | Dual ARM Cortex-A9 MPCore |
| HPS Maximum CPU Clock | — | 925 MHz |
| Hard Memory Controller | — | DDR3 / DDR3L / LPDDR2 |
| Core Voltage (VCC) | — | 1.1 V |
| General-Purpose FPGA I/Os | — | 188 |
| Transceivers | — | Not integrated on SE device |
| 工作接面溫度 | — | -40 C to +100 C (typical SE spec; exact C6 grade per datasheet) |
| Configuration Modes | — | JTAG (IEEE 1149.1), Active Serial (AS) via EPCS/EPCQ |