5CSEBA6U19I7N vs 5CSEBA2U19I7N 比較
詳細並排比較 5CSEBA6U19I7N 由 Intel 與 5CSEBA2U19I7N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Intel
5CSEBA6U19I7N - Cyclone V SE SoC FPGA, 110K LE, Dual ARM Cortex-A9 800MHz | Intel
5CSEBA6U19I7N ✓ 啟用中
規格比較
| 參數 | 5CSEBA6U19I7N | 5CSEBA2U19I7N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Series | 5CSEBA6 | — |
| Device Variant | 5CSEA6 (U19 package, 110K LE) | — |
| Logic Elements | 110,000 | 25K |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore | — |
| HPS Maximum Frequency | 800 MHz | — |
| Embedded Memory | 4.45 Mbits (M10K + MLAB) | 1,400 Kbits |
| Hard Memory Controller | DDR3, DDR3L, LPDDR2 | — |
| Transceivers | Up to 9 channels, 3.125 Gbps | — |
| DSP Blocks | 112 (18x18 multipliers) | — |
| PLLs | 6 (FPGA) + 3 (HPS) | — |
| User I/O Banks | 8 | — |
| Maximum User I/O | 288 (package-dependent) | — |
| 封裝 | 484-pin UBGAFBGA (UBGA-484, 19x19 mm) | 484-UBGA (19x19 mm) |
| 工作溫度 | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Process Technology | TSMC 28 nm low-power | 28 nm TSMC low-power |
| 供應電壓 | Multi-rail (1.1 V core, 1.5/1.8/2.5/3.0/3.3 V I/O) | — |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) | — |
| RoHS 狀態 | Compliant | Compliant |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| HPS | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | — | 800 MHz |
| DSP Blocks (18x18 Multipliers) | — | 66 |
| User I/O Pins | — | 145 |
| LVDS Support | — | Up to 1.25 Gbps |
| Voltage - Input (Max) | — | 1.1 V core |
| Peripherals | — | USB 2.0 OTG, Gigabit Ethernet, CAN, UART, SPI, I2C, NAND/NOR flash controllers |
| HPS-FPGA Interconnect | — | AXI bridges (3 master / 3 slave), FPGA-to-HPS SDRAM, DMA |