A3P1000-2FG256M vs A3P1000-FGG256M 比較

詳細並排比較 A3P1000-2FG256M 由 Microchip Technology 與 A3P1000-FGG256M 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
A3P1000-2FG256M A3P1000-2FG256M - ProASIC3 FPGA 11K LE 256-FBGA | Microchip

A3P1000-2FG256M - ProASIC3 FPGA 11K LE 256-FBGA | Microchip

A3P1000-2FG256M ✓ 啟用中
Microchip Technology
A3P1000-FGG256M A3P1000-FGG256M ProASIC3 FPGA 256-LBGA | Microchip

A3P1000-FGG256M ProASIC3 FPGA 256-LBGA | Microchip

A3P1000-FGG256M ✓ 啟用中

規格比較

參數 A3P1000-2FG256M A3P1000-FGG256M
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family ProASIC3 —
Logic Elements 11000 LE —
Number of I/Os 177 I/O —
System Frequency 310 MHz —
Technology 130 nm CMOS, flash-based —
工作電源電壓 1.5 V —
Speed Grade 2 [DATA_NEEDED: Speed Grade]
封裝 / 外殼 FBGA-256 (256-LBGA) 256-LBGA
安裝方式 SMD/SMT —
Minimum Operating Temperature 0 C —
Maximum Operating Temperature +85 C —
Packaging Tray —
Programmability Reprogrammable, non-volatile flash —
I/O Banks 4 banks (banked VCCIB) —
Configuration Single-chip, instant-on (no external config PROM) —
Series A3P1000 ProASIC3
RoHS 狀態 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS Status]
Number of Logic Elements — 11KLEs
Number of I/O — 177
RAM Bits — 147456
Number of I/O Banks — 4
安裝類型 — Surface Mount
Supplier Package — FBGA
Core Supply Voltage — [DATA_NEEDED: Core Supply Voltage]
工作溫度範圍 — [DATA_NEEDED: Operating Temperature Range]
Maximum Operating Frequency — [DATA_NEEDED: Maximum Operating Frequency]
Total System Gates — [DATA_NEEDED: Total System Gates]
I/O Standards Supported — [DATA_NEEDED: I/O Standards Supported]

資料表與資源

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