A3P600-2FG256I vs M7AFS600-FG256I 比較

詳細並排比較 A3P600-2FG256I 由 Microchip Technology 與 M7AFS600-FG256I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
A3P600-2FG256I A3P600-2FG256I - ProASIC3 Flash FPGA 256-FBGA | Microchip

A3P600-2FG256I - ProASIC3 Flash FPGA 256-FBGA | Microchip

A3P600-2FG256I ✓ 啟用中
Microchip Technology
M7AFS600-FG256I M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I ✓ 啟用中

規格比較

參數 A3P600-2FG256I M7AFS600-FG256I
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Manufacturer Series ProASIC3 (A3P600) —
Logic Elements (LEs) 7K LEs (approximately) —
Configuration Memory 110592 bits (flash, non-volatile) —
Number of I/Os 177 I/O —
Core Supply Voltage 1.5 V 1.5 V
Speed Grade -2 —
Temperature Range -40C to +85C (industrial, suffix I) —
封裝 256-FBGA (LBGA) —
安裝方式 SMD/SMT SMD/SMT
Configuration Technology Flash (single-chip, no external PROM) —
Reprogrammability Yes (in-system reprogrammable) —
Power-up Behavior Live at power-up (instant-on) —
I/O Banks 4 I/O banks with dedicated VCCIBx supplies —
Logic Architecture VersaTile (3-input LUT / D-FF / latch with enable) —
RoHS 狀態 [DATA_NEEDED: RoHS Status] —
Moisture Sensitivity Level [DATA_NEEDED: MSL Level] —
Series — M7AFS600 (Fusion)
System Gates — 600K
Logic Capacity (DigiKey listing) — 110592
Number of I/O — 119 I/O
Embedded Processor — ARM CoreMP7
Process Technology — 130 nm
封裝 / 外殼 — 256-LBGA (FBGA)
Terminal Form — Ball
Package Shape — Square
Minimum Operating Temperature — -40 C
Maximum Operating Temperature — +85 C
Packaging — Tray
Programmable Logic Type — Flash-based, non-volatile
Analog Integration — Mixed-signal (configurable analog + flash memory)

資料表與資源

瀏覽所有產品 建立 BOM 索取報價