A3P600-FG256 vs M7AFS600-FG256I 比較
詳細並排比較 A3P600-FG256 由 Microchip Technology 與 M7AFS600-FG256I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Microchip Technology
A3P600-FG256 - ProASIC3 Flash FPGA 600K Gates 256-BGA | Microchip
A3P600-FG256 ✓ 啟用中Microchip Technology
M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-FG256I ✓ 啟用中規格比較
| 參數 | A3P600-FG256 | M7AFS600-FG256I |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | ProASIC3 (Flash FPGAs) | — |
| System Gates | 600000 | 600K |
| Logic Elements | 7K LEs (VersaTiles) | — |
| Embedded SRAM | 110592 bits (True Dual-Port) | — |
| User I/O | 177 | — |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | 1.5 V |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | 130 nm |
| Maximum System Performance | Approx. 231 MHz | — |
| Configuration Technology | On-chip flash, reprogrammable, single-chip | — |
| Power-Up Behavior | Instant On Level 0 support | — |
| 封裝 | 256-LBGA / FBGA (17x17 mm, 1 mm pitch) | — |
| 安裝類型 | Surface Mount | — |
| 工作溫度 | 0 C to 85 C (TJ) | — |
| I/O Banks | 4 (independent VCCIBx supplies) | — |
| Packaging | Tray | Tray |
| RoHS 狀態 | RoHS non-compliant (per Microchip USA listing) | — |
| Manufacturer Lead Time | 8 weeks | — |
| Series | — | M7AFS600 (Fusion) |
| Logic Capacity (DigiKey listing) | — | 110592 |
| Number of I/O | — | 119 I/O |
| Embedded Processor | — | ARM CoreMP7 |
| 封裝 / 外殼 | — | 256-LBGA (FBGA) |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| 安裝方式 | — | SMD/SMT |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Programmable Logic Type | — | Flash-based, non-volatile |
| Analog Integration | — | Mixed-signal (configurable analog + flash memory) |