A3PE3000-FG324 vs A3PE3000-FGG324 比較
詳細並排比較 A3PE3000-FG324 由 Microchip Technology 與 A3PE3000-FGG324 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Microchip Technology
A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FG324 ✓ 啟用中Microchip Technology
A3PE3000-FGG324 - ProASIC3E FPGA 3M Gates 221 I/O | Microchip
A3PE3000-FGG324 ✓ 啟用中規格比較
| 參數 | A3PE3000-FG324 | A3PE3000-FGG324 |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | ProASIC3E Flash Family | ProASIC3E |
| System Gates | 3,000,000 | 3000000 gates |
| Logic Elements / CLBs | 75,264 | — |
| Maximum System Frequency | 231 MHz | 231 MHz |
| Process Technology | 130 nm CMOS | 130 nm flash |
| Core Supply Voltage | 1.5 V | 1.425 V to 1.575 V |
| User I/Os | 221 | — |
| Configuration Technology | Flash (non-volatile, single-chip) | — |
| In-System Programming | Yes (JTAG, IEEE 1532-compliant) | — |
| Security | 128-bit AES decryption via JTAG; FlashLock | — |
| 封裝 | 324-ball FBGA (FG324), 19 x 19 mm, 1.63 mm height, 1.0 mm pitch | 324-Ball FBGA (FGG324) |
| 安裝類型 | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: Operating Temperature] |
| Embedded Memory | [DATA_NEEDED: embedded SRAM bits] | — |
| PLLs | [DATA_NEEDED: number of PLLs] | — |
| I/O Standards Supported | [DATA_NEEDED: supported I/O standards] | — |
| RoHS 狀態 | RoHS Non-Compliant (contains lead, per digichip listing) | Green (compliant) |
| Lead Free Status | Contains Lead (per digichip listing) | — |
| Device ESD/HBM Rating | [DATA_NEEDED: ESD rating] | — |
| Logic Cells | — | 75264 cells |
| Number of I/O | — | 221 |
| Embedded Flash Bits | — | 516096 bits |
| Configuration Type | — | Flash (nonvolatile, single-chip) |
| Package Dimensions | — | 19 x 19 mm, 1.63 mm height, 1 mm pitch |
| Soft ARM Support | — | Yes (optional soft ARM core support) |
| Technology Node Family | — | CMOS flash FPGA |