A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
MPN： A3PE3000-FG324 ✓ 啟用中A3PE3000-FG324 概覽
A field-programmable gate array (FPGA) is a semiconductor device containing configurable logic blocks (CLBs) and programmable interconnects that designers configure in the field after manufacturing. The ProASIC3E family sits within the broader hierarchy of programmable logic: FPGA -> programmable logic device -> digital logic IC -> semiconductor. Unlike SRAM-based FPGAs, ProASIC3E devices use flash cells for configuration, so they are single-chip, non-volatile solutions that boot instantly without an external configuration PROM.
Key features include low total cost of ownership (TOC) through single-chip operation, in-system programmability (ISP), 128-bit AES decryption via JTAG (IEEE 1532-compliant), and FlashLock security designed to protect FPGA contents. The flash fabric also offers inherent resistance to configuration upset, important in avionics and industrial environments.
Technically, the device provides 75,264 CLBs on a 130nm CMOS process, supporting high-performance 32-bit soft CPU implementations, and the ProASIC3E family adds embedded memory and enhanced I/O structures targeted at ASIC-replacement designs in consumer, networking/communications, computing, and avionics markets, per the Microchip ProASIC3E Flash Family FPGAs datasheet.
Typical applications include ASIC replacement and prototyping, network and communications line cards, industrial control, and avionics subsystems where reprogrammability and single-chip boot matter.
A key design consideration: the standard commercial grade A3PE3000-FG324 is listed by some datasheet aggregators as containing lead (RoHS non-compliant); the lead-free FGG variant (A3PE3000-FGG324) should be chosen where RoHS compliance is required.
This page synthesizes distributor pricing, drop-in alternatives, FAQs, and design notes not found in the manufacturer datasheet.
直接替換替代品，適用於 A3PE3000-FG324 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： A3PE3000-FG324 （相同外形與佔位） — 差異在於 RoHS Status, Process Technology, System Gates, Package, Configuration Memory.
A3PE3000-FGG324
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000-FG324I
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000-1FG324I
✅ 直接替換聯絡詢價
查看資料表 →M1A3PE3000-1FGG324
✅ 直接替換📋 參考替代品（不在目錄中）
M1A3PE3000-2FGG324I
✅ 直接替換📋 參考替代品（不在目錄中）
A3PE3000L-FG324
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000-FG324 最大額定值與電氣特性
| Family | ProASIC3E Flash Family |
| System Gates | 3,000,000 |
| Logic Elements / CLBs | 75,264 |
| Maximum System Frequency | 231 MHz |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| User I/Os | 221 |
| Configuration Technology | Flash (non-volatile, single-chip) |
| In-System Programming | Yes (JTAG, IEEE 1532-compliant) |
| Security | 128-bit AES decryption via JTAG; FlashLock |
| 封裝 | 324-ball FBGA (FG324), 19 x 19 mm, 1.63 mm height, 1.0 mm pitch |
| 安裝類型 | Surface Mount |
| Packaging | Tray |
| RoHS 狀態 | RoHS Non-Compliant (contains lead, per digichip listing) |
| Lead Free Status | Contains Lead (per digichip listing) |
A3PE3000-FG324 324-ball fbga (fg324), 19 x 19 mm, 1.63 mm height, 1.0 mm pitch 腳位配置指南
A3PE3000-FG324（324-ball fbga (fg324), 19 x 19 mm, 1.63 mm height, 1.0 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： A3PE3000-FG324.
請參閱 資料表 以查看完整腳位配置。
典型應用
A3PE3000-FG324 適用於 6 應用s: ASIC Replacement and Prototyping, Networking and Communications Equipment, Avionics and Defense Subsystems, Industrial Control and Automation, Test and Measurement Instrumentation, Consumer and Display Electronics.
ASIC Replacement and Prototyping
The ProASIC3E family is explicitly positioned by Microchip as a cost-effective ASIC replacement solution. With 3 million system gates and 75,264 CLBs, the A3PE3000-FG324 can host multi-million-gate ASIC netlists for prototyping or low-volume production, avoiding mask charges and NRE costs. The flash fabric boots as a single chip without a configuration PROM, simplifying the BOM versus SRAM FPGAs. Designers iterate RTL in Libero and reprogram in-system via JTAG, cutting respin cycles from months to days. For ASIC-like I/O flexibility, the 221 user I/Os support common single-ended and differential standards, letting the prototype match the target ASIC's interface plan with minimal glue logic.
推薦
Networking and Communications Equipment
Microchip targets ProASIC3E at networking/communications markets, where the A3PE3000-FG324 serves as glue logic, interface bridging, and line-card control fabric. The 231 MHz system performance supports timing closure for typical PHY-to-MAC bridging at rates up to Gigabit-class serial via external transceivers, while 75,264 CLBs implement packet framing, buffering control, and board management state machines. Non-volatile flash configuration means line cards power up functional without a host CPU loading a bitstream - a meaningful reliability benefit in telecom racks. The 324-ball FBGA at 1.0 mm pitch fits standard telecom PCB stackups, and the RoHS-compliant FGG324 variant keeps designs compliant with EU requirements.
推薦
Avionics and Defense Subsystems
Flash-based FPGAs are preferred in avionics because their configuration cells are inherently immune to configuration upset from radiation and vibration, unlike SRAM fabrics that require scrubbing. The A3PE3000-FG324 provides 3M gates of non-volatile programmable logic for sensor interface, ARINC-style bus bridging, and built-in-test controllers. The IEEE 1532-compliant JTAG path with 128-bit AES decryption and FlashLock protects proprietary bitstreams in the field, a defense-program requirement. Industrial-grade variants (A3PE3000-FG324I, A3PE3000-1FG324I) are pin-compatible in the same FBGA-324 footprint, allowing a single PCB layout to span commercial and extended-temperature builds during qualification.
推薦
Industrial Control and Automation
In factory automation, the A3PE3000-FG324 implements deterministic control sequencers, multi-axis PWM generation, and machine-vision pre-processing where a hard CPU is unnecessary but custom logic is essential. The 1.5V flash core keeps static power modest, and the non-volatile fabric lets machinery restart instantly after power loss without reconfiguration latency - critical for production-line uptime. With 221 user I/Os in a 19 x 19 mm FBGA, one device can aggregate encoders, sensors, and fieldbus transceivers on a single compact control card. Designs needing an embedded processor can drop in the pin-compatible M1A3PE3000 variant and instantiate an ARM Cortex-M1 without PCB change.
推薦
Test and Measurement Instrumentation
Bench and automated test equipment uses the A3PE3000-FG324 as reconfigurable timing generators, pattern generators, and acquisition logic. The 231 MHz fabric performance and 75,264 CLBs cover trigger engines, counters, and protocol analysis state machines, while field reprogrammability lets one hardware platform serve multiple instrument personalities via JTAG firmware updates - reducing SKU count. Flash configuration means instruments are ready at power-on without a boot controller. The 128-bit AES decryption protects proprietary instrument firmware when units are serviced in the field. Low gate utilization headroom concerns are minimal at 3M gates, leaving room for feature expansion across product revisions.
推薦
Consumer and Display Electronics
Microchip lists consumer markets among ProASIC3E targets: the A3PE3000-FG324 acts as display timing controllers, interface converters, and system glue in consumer products where ASIC volume never materialized. Its single-chip flash boot removes the configuration flash cost and board area that SRAM FPGAs require - significant at consumer BOM levels - and the 130nm process delivers low unit cost versus newer FPGA families. Note the standard FG324 contains lead; consumer products shipping to RoHS jurisdictions must specify the FGG324 lead-free variant, which is drop-in identical. The 19 x 19 mm FBGA suits the dense two- and four-layer boards typical of consumer display hardware.
推薦
推薦產品摘要
工程參考資料，適用於 A3PE3000-FG324 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | A3PE3000-FGG324 | A3PE3000-FG324I | A3PE3000-1FG324I | M1A3PE3000-2FGG324I |
|---|---|---|---|---|---|
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 324-ball FBGA (FG324) | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/Os | 221 | 221 | 221 | 221 | 221 |
| Speed Grade | Standard | Standard | Standard | -1 (faster) | -2 |
| Embedded CPU Support | Soft cores (no Cortex-M1) | Soft cores | Soft cores | Soft cores | ARM Cortex-M1 supported |
| Core Voltage / Performance | 1.5 V / 231 MHz | 1.5 V / 231 MHz | 1.5 V / 231 MHz | 1.5 V / 231 MHz family | 1.5 V / 231 MHz family |
主要差異化特點
- Non-volatile single-chip flash configuration (對比A3PE3000-FGG324)
- ARM Cortex-M1 upgrade path on same footprint (對比M1A3PE3000-2FGG324I)
- Industrial temperature availability (對比A3PE3000-FG324I / A3PE3000-1FG324I)
- Speed-grade timing headroom (對比A3PE3000-1FG324I)
設計說明
The A3PE3000-FG324 runs a 1.5V core; ProASIC3E devices also require auxiliary and I/O supply rails per the datasheet power section. Estimate static and dynamic power with Microchip's power calculator in Libero before finalizing regulators - 130nm flash fabric has low static power, but dynamic power scales with clock frequency toward the 231 MHz maximum and I/O toggle rates. Provide decoupling per the datasheet power distribution network guidance, with bulk capacitance near each supply ball group of the FBGA-324 and local 0.1uF ceramics distributed across the 19 x 19 mm package.
The FG324 FBGA uses a 1.0 mm ball pitch on a 19 x 19 mm body - plan fanout with via-in-pad or dogbone escape on outer layers, and verify your PCB fabricator supports the 0.5 mm via finished diameter typical for 1.0 mm pitch BGA escape. Because all same-family variants (FG, FGG, I, M1) share the ball map, allocate any I/O you might later reassign so a future speed-grade or lead-free migration needs no layout change. Follow ball-map tables in the ProASIC3E datasheet (50003270B) exactly; do not copy FG484 assignments.
The most common sourcing pitfall is RoHS: the standard FG324 is listed as containing lead (RoHS non-compliant), so EU-market production should order A3PE3000-FGG324 instead - same die, same footprint. Second, do not confuse speed grades: a bitstream meeting timing on a -1 part may fail on the standard grade; constrain timing in Libero against the ordered speed grade. Third, JTAG programming requires the IEEE 1532-compliant chain configuration; keep the TMS pull-up and proper TRST handling per the datasheet JTAG chapter to avoid ISP failures in production programming.
With 221 user I/Os on a 1.0 mm pitch BGA, manage simultaneous switching noise by distributing ground return balls among high-toggle banks and following the datasheet I/O bank current limits. Series-terminate single-ended outputs (22-33 ohm) when driving long traces, and use differential standards for clocks. The flash fabric's lack of configuration readback during operation helps EMI-sensitive designs since no configuration bus activity occurs after boot.
合規資訊
Per digichip datasheet listing, A3PE3000-FG324 contains lead and is RoHS non-compliant; the A3PE3000-FGG324 is the lead-free variant. FindIC lists a GREEN package description for family parts, but verify the compliance letter for your date code. Not an automotive AEC-Q100 part.
