A3PE3000-FGG324I vs A3PE3000-2FG324I 比較

詳細並排比較 A3PE3000-FGG324I 由 Microchip Technology 與 A3PE3000-2FG324I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
A3PE3000-FGG324I A3PE3000-FGG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-FGG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-FGG324I ✓ 啟用中
Microchip Technology
A3PE3000-2FG324I A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip

A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip

A3PE3000-2FG324I ✓ 啟用中

規格比較

參數 A3PE3000-FGG324I A3PE3000-2FG324I
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family ProASIC3E (ProASIC3E Flash Family) ProASIC3E
System Gates 3000000 gates 3M gates
Logic Elements (CLBs) 75264 —
Total User I/O 221 —
Embedded Memory 516096 bits —
Maximum Frequency 350 MHz —
Core Supply Voltage 1.5 V 1.5 V
Technology 130 nm CMOS, nonvolatile flash —
封裝 324-BGA (FBGA/PBGA324), 19 x 19 mm —
Ball Pitch 1 mm —
Package Height 1.63 mm —
工作溫度 -40 C to +125 C (Industrial, I grade) —
Configuration Memory Nonvolatile flash, reprogrammable, Instant-On Non-volatile Flash (single chip)
安裝類型 Surface Mount —
Moisture Sensitivity Level [DATA_NEEDED: MSL Level] —
RoHS 狀態 [DATA_NEEDED: RoHS status] —
Manufacturer — Microchip Technology (Microsemi)
Logic Elements (LEs) — 35000 LEs
Maximum System Performance — 310 MHz
Process Technology — 130 nm flash
Number of I/Os — 221 I/O
封裝 / 外殼 — 324-Ball FBGA
安裝方式 — SMD/SMT
Operating Temperature (Min) — -40 C
Operating Temperature (Max) — +85 C
Speed Grade — -2
Temperature Grade — Industrial (I)
Packaging — Tray
Product Series — A3PE3000

資料表與資源

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