A3PE600-1FGG256 vs M1AFS600-1FGG256 比較
詳細並排比較 A3PE600-1FGG256 由 Microchip Technology 與 M1AFS600-1FGG256 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Microchip Technology
A3PE600-1FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
A3PE600-1FGG256 ✓ 啟用中Microchip Technology
M1AFS600-1FGG256 - Fusion FPGA, Cortex-M1, 600K Gates | Microchip
M1AFS600-1FGG256 ✓ 啟用中規格比較
| 參數 | A3PE600-1FGG256 | M1AFS600-1FGG256 |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | ProASIC3E | Fusion Mixed-Signal FPGA |
| System Gates | 600000 | 600000 |
| Logic Elements | 7K LEs | — |
| User I/O | 165 | 119 |
| Registers | 110592 | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Maximum System Frequency | 272 MHz | — |
| Process Technology | 130-nm, 7-layer metal (6 copper) flash-based CMOS | 130 nm CMOS, flash-based |
| Configuration Memory | On-chip flash (single-chip, live-at-power-up) | Flash (non-volatile, live at power-up) |
| Speed Grade | -1 | — |
| 工作溫度 | 0 C to +70 C | 0C to +85C |
| 封裝 | 256-LBGA (FBGA-256, 1 mm ball pitch) | 256-ball LBGA (FGG256), 17x17x1.7 mm |
| 安裝類型 | Surface Mount | Surface Mount |
| Logic Family | CMOS | — |
| Embedded Memory (family max) | Up to 504 kbits True Dual-Port SRAM | — |
| Power-Up Support | Live-At-Power-Up Level 0 | — |
| Reprogrammability | Yes (flash-based, in-system reprogrammable) | — |
| Processor Core | — | ARM Cortex-M1 (hard core) |
| Configurable Logic Blocks (CLBs) | — | 13824 |
| Flip-Flops | — | 110592 |
| Analog Features | — | Configurable analog blocks, clock generation and management |
| RoHS 狀態 | — | Compliant |
| Packaging | — | Tray |