A3PE600-1FGG256 vs M1AFS600-1FGG256 비교
다음의 상세 나란히 비교: A3PE600-1FGG256 제조: Microchip Technology 및 M1AFS600-1FGG256 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
A3PE600-1FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
A3PE600-1FGG256 ✓ 활성Microchip Technology
M1AFS600-1FGG256 - Fusion FPGA, Cortex-M1, 600K Gates | Microchip
M1AFS600-1FGG256 ✓ 활성사양 비교
| 파라미터 | A3PE600-1FGG256 | M1AFS600-1FGG256 |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $38.90 | $191.10 |
| Family | ProASIC3E | Fusion Mixed-Signal FPGA |
| System Gates | 600000 | 600000 |
| Logic Elements | 7K LEs | — |
| User I/O | 165 | 119 |
| Registers | 110592 | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Maximum System Frequency | 272 MHz | — |
| Process Technology | 130-nm, 7-layer metal (6 copper) flash-based CMOS | 130 nm CMOS, flash-based |
| Configuration Memory | On-chip flash (single-chip, live-at-power-up) | Flash (non-volatile, live at power-up) |
| Speed Grade | -1 | — |
| 동작 온도 | 0 C to +70 C | 0C to +85C |
| 패키지 | 256-LBGA (FBGA-256, 1 mm ball pitch) | 256-ball LBGA (FGG256), 17x17x1.7 mm |
| 실장 유형 | Surface Mount | Surface Mount |
| Logic Family | CMOS | — |
| Embedded Memory (family max) | Up to 504 kbits True Dual-Port SRAM | — |
| Power-Up Support | Live-At-Power-Up Level 0 | — |
| Reprogrammability | Yes (flash-based, in-system reprogrammable) | — |
| Processor Core | — | ARM Cortex-M1 (hard core) |
| Configurable Logic Blocks (CLBs) | — | 13824 |
| Flip-Flops | — | 110592 |
| Analog Features | — | Configurable analog blocks, clock generation and management |
| RoHS 상태 | — | Compliant |
| Packaging | — | Tray |