ADTF3175D-NXZ vs ADTF3175 比較
詳細並排比較 ADTF3175D-NXZ 由 Analog Devices 與 ADTF3175 由 Analog Devices. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Analog Devices
ADTF3175D-NXZ - 1MP ToF Eval Kit w/ ADSD3500 ISP | Analog Devices
ADTF3175D-NXZ ✓ 啟用中規格比較
| 參數 | ADTF3175D-NXZ | ADTF3175 |
|---|---|---|
| 品牌 | Analog Devices | Analog Devices |
| 類別 | Image Sensors | Image Sensors |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Product Type | Time-of-Flight (ToF) Evaluation Kit | Time-of-Flight (ToF) module |
| Main Module | ADTF3175 | — |
| Depth ISP | ADSD3500 | — |
| Imager | ADSD3100 (CMOS indirect ToF) | ADSD3100 CMOS indirect ToF (iToF) |
| 解析度 | 1 megapixel (1024 x 1024) | 1024 H x 1024 V (1 megapixel) |
| ToF Technique | Indirect ToF (iToF), continuous-wave modulation | — |
| Integrated Optics | Lens, optical band-pass filter, IR illumination optics | — |
| Illumination Source | Laser diode with integrated driver and photodetector | — |
| Host Interface | Ethernet over USB | — |
| Host Software | Windows host GUI + open-source multi-platform SDK | — |
| Operating System Support | Windows host; ROS / ROS 2 via adi_3dtof_image_stitching package | — |
| 功能 | 3D depth sensing and vision system evaluation | — |
| 安裝類型 | Bench / lab evaluation board | Board mount (open frame) |
| RoHS 狀態 | [DATA_NEEDED: rohs status] | Compliant |
| Form Factor | Complete EVK (PCB + module + cabling) | — |
| Pixel Size | — | 3.5 µm x 3.5 µm |
| Output Interface | — | MIPI CSI-2 Tx (4-lane) |
| Integrated Components | — | Lens, optical band-pass filter, IR illuminator, power regulators |
| Module Form Factor | — | 75 mm x 75 mm open frame |
| Calibration | — | Factory calibrated, multi-range + multi-resolution modes |
| Packaging Type | — | Open-frame module (Distance Sensor Module) |
| Orderable Part Number | — | ADTF3175BMLZ |
| 生命週期狀態 | — | Recommended for new designs |
| Matching Evaluation Kit | — | EVAL-ADTF3175D-NXZ (with ADSD3500 depth ISP) |
| Manufacturer | — | Analog Devices Inc. |