ATPL230AG55J19-Y vs ATPL230AG55J19-R 比較

詳細並排比較 ATPL230AG55J19-Y 由 Microchip Technology 與 ATPL230AG55J19-R 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
ATPL230AG55J19-Y ATPL230AG55J19-Y - PRIME PLC Bundle MCU Kit | Microchip

ATPL230AG55J19-Y - PRIME PLC Bundle MCU Kit | Microchip

ATPL230AG55J19-Y ✓ 啟用中
Microchip Technology
ATPL230AG55J19-R ATPL230AG55J19-R - PRIME PLC MCU Bundle | Microchip Technology

ATPL230AG55J19-R - PRIME PLC MCU Bundle | Microchip Technology

ATPL230AG55J19-R ✓ 啟用中

規格比較

參數 ATPL230AG55J19-Y ATPL230AG55J19-R
品牌 Microchip Technology Microchip Technology
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 啟用中
Product Type Network Controller & Processor ICs Bundle (CPN) Power Line Communications Microcontroller IC (bundle)
Bundle Contents PL230A-AKU-Y (PRIME PLC modem) + SAMG55J19A-MU (microcontroller) PL230A-AKU-R PLC PHY + SAMG55J19A-MUT Cortex-M4 MCU
Standard / Protocol PRIME narrowband PLC —
Application Segment Smart metering / AMI PLC modems —
封裝 LQFP (surface mount) LQFP
安裝類型 Surface Mount Surface Mount
Manufacturer Microchip Technology (Atmel) —
供應電壓 [DATA_NEEDED: supply voltage] [DATA_NEEDED: supply voltage]
工作溫度 [DATA_NEEDED: operating temperature] [DATA_NEEDED: operating temperature range]
Flash Memory [DATA_NEEDED: flash memory size] [DATA_NEEDED: flash size]
SRAM [DATA_NEEDED: sram size] —
CPU Core [DATA_NEEDED: cpu core] —
Max CPU Frequency [DATA_NEEDED: max cpu frequency] —
Carrier Frequency Band [DATA_NEEDED: carrier frequency band] —
Modulation Scheme [DATA_NEEDED: modulation scheme] —
腳位數 [DATA_NEEDED: pin count] —
RoHS 狀態 [DATA_NEEDED: rohs status] [DATA_NEEDED: RoHS status]
MSL 等級 [DATA_NEEDED: msl level] [DATA_NEEDED: moisture sensitivity level]
Target Protocol — PRIME PLC
Core — ARM Cortex-M4 (SAMG55J19A)
Packaging Suffix — -R (Tape and Reel)
Application — PRIME PLC modules/modems, smart metering
Modulation — [DATA_NEEDED: modulation scheme]
資料速率 — [DATA_NEEDED: PLC data rate]

資料表與資源

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