ATSAMA5D22C-CU vs ATSAMA5D23A-CU 比較
詳細並排比較 ATSAMA5D22C-CU 由 Microchip Technology 與 ATSAMA5D23A-CU 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Microchip Technology
ATSAMA5D22C-CU - 500MHz Cortex-A5 MPU, 196-TFBGA | Microchip
ATSAMA5D22C-CU ✓ 啟用中Microchip Technology
ATSAMA5D23A-CU - ARM Cortex-A5 MPU 500MHz 196-TFBGA | Microchip
ATSAMA5D23A-CU ✓ 啟用中規格比較
| 參數 | ATSAMA5D22C-CU | ATSAMA5D23A-CU |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Core Architecture | ARM Cortex-A5 (32-bit) | ARM Cortex-A5 with NEON SIMD and FPU |
| Core Count | 1 | — |
| Maximum CPU Clock | 500 MHz | 500 MHz |
| NEON Media Engine | Yes | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Cache | 128 KB | — |
| External Memory Support | DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC | — |
| 2D Graphics Engine | Yes (up to WXGA 1366x768) | — |
| LCD Interface | 24-bit, up to 1366x768 | — |
| Ethernet | Dual 10/100 Mbps EMAC with 1588 PTP | 10/100 Mbps MAC with GMII/RMII/MII |
| USB | USB HSIC + USB Host/Device | USB 2.0 Host + Device + HSIC |
| CAN | Dual CAN-FD | CAN-FD |
| 封裝 | 196-TFBGA (CSBGA) 11x11 mm | 196-ball TFBGA (CSBGA) |
| Ball Pitch | 0.8 mm | — |
| 工作溫度 | -40C to +85C (industrial) | -40C to +85C (Industrial) |
| Cryptographic Accelerator | AES, SHA, TRNG (hardware) | — |
| Peripheral Touch Controller | PTC (embedded) | — |
| Audio Subsystem | Embedded (I2S, SSC) | — |
| RoHS 狀態 | Compliant | ROHS3 Compliant |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| Instruction Set | — | ARMv7-A 32-bit |
| Internal SRAM | — | 128 KB |
| External Memory Bus | — | 16-bit DDR2/DDR3L/LPDDR2/LPDDR3 controller |
| Supply Voltage (Core) | — | 1.2 V (typical) |
| Supply Voltage (I/O) | — | 3.3 V (typical) |
| LCD Controller | — | 24-bit, up to 1024x768 |
| ADC | — | 12-bit, up to 12 channels |
| Security | — | Hardware AES, secure boot, TRNG, tamper pins |
| Packaging | — | Tray |