ATSAMA5D22C-CU - 500MHz Cortex-A5 MPU, 196-TFBGA | Microchip
MPN： ATSAMA5D22C-CU ✓ 啟用中ATSAMA5D22C-CU 概覽
An ARM Cortex-A5 based microprocessor (MPU) is a high-integration system-on-chip that executes a full operating system (typically Linux) and exposes the full ARMv7-A architecture to application code. The Cortex-A5 family sits in the application-processor hierarchy above Cortex-M microcontrollers and below Cortex-A7/A9 cores, balancing deterministic performance, low power consumption, and rich peripheral integration for cost-sensitive embedded products such as industrial HMIs, smart gateways, and point-of-sale terminals.
The SAMA5D22C variant delivers up to 500 MHz CPU clock, 32 KB L1 instruction cache, 32 KB L1 data cache, and 128 KB L2 cache. It features an advanced 2D graphics engine (up to WXGA 1366x768), a 24-bit LCD interface, dual EMAC with 1588 PTP, dual CAN-FD, USB HSIC, and a hardware cryptographic accelerator. The 196-TFBGA package at 11x11 mm with 0.8 mm pitch reduces PCB design complexity and supports low-cost 4-layer stack-up.
Typical applications include industrial control panels, building automation gateways, IoT edge nodes with secure TLS, point-of-sale terminals, medical patient interfaces, and smart energy HMI displays. The wide memory controller flexibility (DDR2/DDR3L/LPDDR2/LPDDR3) lets designers choose the most cost-effective DRAM for their BOM without a silicon change.
When designing with the ATSAMA5D22C-CU, ensure the 0.8 mm pitch BGA is fabricated on ENIG or ENEPIG finish with proper microvia stack-up. Use at least 4-layer PCB with continuous GND planes under the BGA, and follow Microchip's hardware design checklist for decoupling (100 nF + 4.7 uF per supply rail) and DDR3L routing (length-matched, impedance-controlled).
直接替換替代品，適用於 ATSAMA5D22C-CU — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： ATSAMA5D22C-CU （相同外形與佔位） — 差異在於 Ethernet, Package, USB, Operating Temperature, CAN.
ATSAMA5D22B-CUR
✅ 直接替換聯絡詢價
查看資料表 →ATSAMA5D22A-CN
✅ 直接替換聯絡詢價
查看資料表 →ATSAMA5D22A-CNR
✅ 直接替換聯絡詢價
查看資料表 →ATSAMA5D21C-CUR
✅ 直接替換聯絡詢價
查看資料表 →ATSAMA5D21B-CU
✅ 直接替換聯絡詢價
查看資料表 →ATSAMA5D225C-D1M-CU
✅ 直接替換聯絡詢價
查看資料表 →ATSAMA5D22C-CU 最大額定值與電氣特性
| Core Architecture | ARM Cortex-A5 (32-bit) |
| Core Count | 1 |
| Maximum CPU Clock | 500 MHz |
| NEON Media Engine | Yes |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Cache | 128 KB |
| External Memory Support | DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC |
| 2D Graphics Engine | Yes (up to WXGA 1366x768) |
| LCD Interface | 24-bit, up to 1366x768 |
| Ethernet | Dual 10/100 Mbps EMAC with 1588 PTP |
| USB | USB HSIC + USB Host/Device |
| CAN | Dual CAN-FD |
| 封裝 | 196-TFBGA (CSBGA) 11x11 mm |
| Ball Pitch | 0.8 mm |
| 工作溫度 | -40C to +85C (industrial) |
| Cryptographic Accelerator | AES, SHA, TRNG (hardware) |
| Peripheral Touch Controller | PTC (embedded) |
| Audio Subsystem | Embedded (I2S, SSC) |
| RoHS 狀態 | Compliant |
| 安裝類型 | Surface Mount (BGA) |
ATSAMA5D22C-CU 196-tfbga (csbga) 11x11 mm 腳位配置指南
ATSAMA5D22C-CU（196-tfbga (csbga) 11x11 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： ATSAMA5D22C-CU.
請參閱 資料表 以查看完整腳位配置。
典型應用
ATSAMA5D22C-CU 適用於 6 應用s: Industrial Human-Machine Interface (HMI), Building Automation Gateway, IoT Edge Node with Secure Connectivity, Point-of-Sale (POS) Terminal, Medical Patient Interface Device, Smart Energy / Metering HMI.
Industrial Human-Machine Interface (HMI)
The ATSAMA5D22C-CU is purpose-built for industrial HMIs, with its ARM Cortex-A5 core at 500 MHz running full Linux plus LVGL or Qt graphics, and the integrated 2D engine driving a 24-bit LCD up to WXGA 1366x768. The 196-TFBGA footprint allows compact panel-mount board designs, and the Peripheral Touch Controller (PTC) supports projected-capacitive touchscreens with on-die hardware scanning. Compared with discrete MCU plus external controller solutions, the D22C reduces BOM by ~30% while meeting IEC 61010 industrial safety and EN 55032 EMI requirements with proper PCB layout.
推薦
Building Automation Gateway
Building automation gateways benefit from the ATSAMA5D22C-CU's dual 10/100 EMAC with IEEE 1588 PTP for time-synchronized BACnet/IP or KNX/IP traffic, plus its dual CAN-FD for sensor and actuator backbones. The hardware cryptographic accelerator handles TLS 1.3 and X.509 handshakes efficiently, while the industrial temperature range (-40C to +85C) supports outdoor or uncontrolled-environment installations. Linux BSP and Yocto/OpenWrt support simplify integration with cloud-management stacks for HVAC, lighting, and access-control subsystems.
推薦
IoT Edge Node with Secure Connectivity
The ATSAMA5D22C-CU powers secure IoT edge nodes running Linux with the on-die AES/SHA/TRNG accelerator performing TLS termination at line rate. The dual Ethernet ports allow segregated local-device-network and WAN connections, while the LPDDR2/LPDDR3 controller supports low-power mobile RAM for battery-backed deployments. Engineers typically pair it with an external Wi-Fi/BLE module (such as the Microchip WINC3400) via the SDIO/UART interfaces to complete the edge-node reference design.
推薦
Point-of-Sale (POS) Terminal
POS terminals leverage the ATSAMA5D22C-CU's Cortex-A5 CPU running secure Linux, 2D graphics engine for receipt and customer-display rendering, and the embedded audio subsystem for contactless payment beeps and barcode-reader feedback. The hardware crypto engine accelerates EMV chip-card processing, while USB HSIC plus dual CAN-FD supports printers, cash drawers, and magnetic-stripe readers. The 0.8 mm pitch TFBGA allows ultra-compact mainboard designs behind integrated touchscreen POS units.
推薦
Medical Patient Interface Device
Medical patient interface devices such as infusion-pump touchscreens, diagnostic-tablet front panels, and bedside vital-sign monitors use the ATSAMA5D22C-CU for its Cortex-A5 deterministic Linux execution, integrated 2D graphics engine for medical-grade UI, and the Peripheral Touch Controller for gloved-hand capacitive touch sensing. The industrial -40C to +85C operating range supports hospital and ambulance environments, while the hardware cryptographic accelerator secures HIPAA-compliant patient data transmission over Ethernet or Wi-Fi.
推薦
Smart Energy / Metering HMI
Smart energy HMI displays use the ATSAMA5D22C-CU for its Cortex-A5 performance running secure Linux, dual 10/100 EMAC with 1588 PTP for synchronized metering data collection, and the 24-bit LCD interface driving a sunlight-readable display. The hardware cryptographic accelerator secures DLMS/COSEM or proprietary smart-metering protocols, while the industrial temperature grade handles outdoor cabinet installations. The same 196-TFBGA footprint across the SAMA5D2 family lets OEMs reuse PCB layout across single-phase, three-phase, and gateway-class metering products.
推薦
推薦產品摘要
工程參考資料，適用於 ATSAMA5D22C-CU — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | ATSAMA5D22B-CUR | ATSAMA5D22A-CN | ATSAMA5D21C-CUR | ATSAMA5D225C-D1M-CU |
|---|---|---|---|---|---|
| Package | 196-TFBGA (11x11) | 196-TFBGA (11x11) - same | 196-TFBGA (11x11) - same | 196-TFBGA (11x11) - same | 196-TFBGA (11x11) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Core | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 |
| Maximum CPU Clock | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| Ethernet | Dual 10/100 EMAC + 1588 PTP | Dual 10/100 EMAC + 1588 PTP | Dual 10/100 EMAC + 1588 PTP | Single 10/100 EMAC | Dual 10/100 EMAC + 1588 PTP |
| CAN-FD | Dual | Dual | Dual | None | Dual |
| 2D Graphics | Yes (WXGA 1366x768) | Yes (WXGA 1366x768) | Yes (WXGA 1366x768) | Yes (WXGA 1366x768) | Yes (WXGA 1366x768) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +105C (extended) |
| Approximate Unit Price (1k qty) | $7.14 | ~$6.80 | ~$6.50 | ~$5.40 | ~$8.10 |
主要差異化特點
- Pin-compatible drop-in across the SAMA5D2 family (對比ATSAMA5D21C-CUR)
- Industrial temperature range with extended variant option (對比ATSAMA5D225C-D1M-CU)
- Hardware cryptographic accelerator integrated (對比ATSAM4S16C)
設計說明
The ATSAMA5D22C-CU 196-TFBGA package uses 0.8 mm ball pitch and requires laser-drilled microvias on the BGA pads. Use at least a 4-layer PCB stack-up with continuous GND planes under the BGA. Per Microchip hardware design guidelines, place 100 nF decoupling capacitors within 2 mm of every power pin and 4.7 uF bulk capacitors per supply rail; route DDR3L traces with length matching within 0.5 mm to maintain signal integrity at 500 MHz.
Estimated: at typical industrial HMI workloads (500 MHz, all peripherals active), the ATSAMA5D22C-CU dissipates approximately 1.2 W. The TFBGA package theta_JA of approximately 25 C/W (with proper PCB thermal via array under the BGA) yields a junction temperature rise of ~30C above ambient. For high-temperature industrial environments exceeding 70C ambient, add thermal vias to the inner GND plane and consider forced-air cooling to maintain the 85C junction spec.
Do not substitute the ATSAMA5D22C-CU with the ATSAMA5D22A-CN without verifying errata differences - revision A silicon has known USB HSIC timing bugs documented in the SAMA5D2 errata sheet. Always check the device marking for the correct silicon revision. The boot configuration pins (BMS, JTAG_SEL) must be pulled correctly at power-up or the device will not boot from the intended QSPI/e.MMC source.
合規資訊
RoHS and REACH compliant per Microchip product declaration. Not AEC-Q100 qualified (industrial grade, not automotive). For AEC-Q100 needs, contact Microchip for SAMA5D27 automotive-grade variant.
