ATSAMA5D28C-LD1G-CUR vs ATSAMA5D27C-LD1G-CUR 比較

詳細並排比較 ATSAMA5D28C-LD1G-CUR 由 Microchip Technology 與 ATSAMA5D27C-LD1G-CUR 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
ATSAMA5D28C-LD1G-CUR ATSAMA5D28C-LD1G-CUR - Cortex-A5 MPU 500MHz 289-LFBGA | Microchip

ATSAMA5D28C-LD1G-CUR - Cortex-A5 MPU 500MHz 289-LFBGA | Microchip

ATSAMA5D28C-LD1G-CUR ✓ 啟用中
Microchip Technology
ATSAMA5D27C-LD1G-CUR ATSAMA5D27C-LD1G-CUR - 500MHz Cortex-A5 MPU, 1Gb LPDDR2 SiP | Microchip

ATSAMA5D27C-LD1G-CUR - 500MHz Cortex-A5 MPU, 1Gb LPDDR2 SiP | Microchip

ATSAMA5D27C-LD1G-CUR ✓ 啟用中

規格比較

參數 ATSAMA5D28C-LD1G-CUR ATSAMA5D27C-LD1G-CUR
品牌 Microchip Technology Microchip Technology
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 啟用中
MPU Core ARM Cortex-A5 —
Core Count 1 —
資料匯流排寬度 32-bit 32-bit
Maximum CPU Clock 500 MHz 500 MHz
Integrated Memory (SiP) 2 Gbit LPDDR2 SDRAM —
External Memory Support DDR2, LPDDR2, LPDDR3, QSPI, e.MMC —
L1 I-Cache / D-Cache 32 Kbytes / 32 Kbytes —
NEON / FPU Yes (with single-precision FPU) —
Operating Voltage (Core) 1.2 V —
Package Type 289-LFBGA —
Package Dimensions 14 x 14 mm —
Ball Pitch 0.8 mm —
工作溫度 -40C to +85C (Industrial) -40C to +85C (Industrial)
安裝類型 Surface Mount Surface Mount (BGA)
RoHS 狀態 Compliant Compliant
Core Architecture — ARM Cortex-A5 with NEON and FPU
Number of Cores — 1
Integrated Memory — 1 Gbit LPDDR2 SDRAM
封裝 — 361-ball TFBGA (16x16 mm), 0.8 mm ball pitch
Series — SAMA5D2
記憶體類型 — LPDDR2 (System-in-Package)
Memory Bus Width — 32-bit
LCD Controller — Yes (TFT, up to 2048x2048)
Ethernet — 10/100 MAC with IEEE 1588 (EMAC + GMAC)
USB — USB 2.0 High-Speed Host and Device
Security — AES, SHA, TRNG, secure boot
Touch Controller — Peripheral Touch Controller (PTC)

資料表與資源

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