EP2A70B724I8 vs EP2A70B724I-8 比較

詳細並排比較 EP2A70B724I8 由 Intel 與 EP2A70B724I-8 由 Altera. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2A70B724I8 EP2A70B724I-8
品牌 Intel Altera
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete Obsolete
Family APEX II APEX II
Logic Elements (LEs) 67200 —
System Gates 3 M (typical maximum) 3,000,000
Process Technology 0.15 µm CMOS 0.15 µm CMOS
Core Voltage 1.5 V —
Maximum Internal Frequency 281 MHz (typical) 281 MHz
封裝 724-pin FCBGA —
腳位數 724 —
Operating Temperature (Industrial) -40 °C to +100 °C —
Speed Grade 8 —
Embedded Memory ESB / TriMatrix (size not in provided data) —
Configuration Modes Active Serial, Passive Serial, Passive Parallel Asynchronous —
PLL Count [DATA_NEEDED: PLL block count] —
User I/O Banks [DATA_NEEDED: bank count and I/O count] [DATA_NEEDED: user I/O bank count]
Multipliers Embedded multiplier blocks (count [DATA_NEEDED]) —
Supported I/O Standards LVTTL, LVCMOS, SSTL, LVDS (True-LVDS), PCI, HSTL —
安裝類型 Surface Mount (BGA) Surface Mount
RoHS 狀態 [DATA_NEEDED: RoHS compliance] [DATA_NEEDED: RoHS compliance]
Configuration Device Compatibility EPC4, EPC8, EPC16 (Enhanced Configuration Devices) —
Design Software Quartus II (legacy support) —
Logic Elements / Cells — 67,200 cells
Core Supply Voltage — 1.5 V
I/O Supply Voltage — 3.3 V
腳位數 — 724
Package Type — FCBGA (Flip-Chip Ball Grid Array)
工作溫度 — -40 °C to +100 °C (Industrial)
Peak Reflow Temperature — 220 °C (per JEDEC J-STD-020)
User I/O Pins — [DATA_NEEDED: user I/O pin count]
Embedded System Blocks (ESBs) — [DATA_NEEDED: ESB count]
Embedded Array Blocks (EABs) — [DATA_NEEDED: EAB count]
Embedded RAM — [DATA_NEEDED: total bits]
PLLs — [DATA_NEEDED: PLL count]
Configuration Method — JTAG / Passive Serial / Passive Parallel
MSL 等級 — [DATA_NEEDED: MSL level]

資料表與資源

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