EP2S30F672C5NGC vs EP2S30F672C3 比較

詳細並排比較 EP2S30F672C5NGC 由 Intel 與 EP2S30F672C3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2S30F672C5NGC EP2S30F672C3
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete Obsolete
Family Stratix II —
Logic Elements 33,880 —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Total RAM Bits 1,369,728 1,369,728
Embedded RAM (Kbits) 1,337.6 Kbits —
Hardware Multipliers (18x18) 64 —
Maximum User I/Os 500 —
User I/O Banks [DATA_NEEDED: number of I/O banks] —
Process Technology 90 nm 90 nm CMOS
Core Supply Voltage 1.2 V —
Internal Performance Up to 609.76 MHz —
封裝 672-ball FC-FBGA —
Speed Grade C5 -3
工作溫度 Commercial (0C to +85C) 0C to +85C (Commercial)
Programmable Interface PCI-X 32/64-bit, 66/100/133 MHz master/target —
安裝類型 Surface Mount (BGA) Surface Mount
Lead-Free / RoHS [DATA_NEEDED: lead-free status] —
Series — Stratix II
Number of Logic Elements — 33,880
Number of Adaptive Logic Modules (ALMs) — 13,560
Total Embedded Memory Bits — 1,369,728
Embedded Memory (M512 / M4K / M-RAM blocks) — M512, M4K, M-RAM TriMatrix
Number of User I/O — 500
Number of Transceivers — [DATA_NEEDED: depends on variant - up to 12]
DSP Blocks — Dedicated 18x18 multipliers
DSP Performance — Up to 156 GMACs
Voltage - Supply — 1.2 V core, multi-rail I/O
封裝 / 外殼 — 672-BBGA, FCBGA (FineLine BGA)
RoHS 狀態 — Non-compliant (leaded BGA)
MSL 等級 — [DATA_NEEDED: MSL rating]

資料表與資源

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