EP2S30F672C5NGC - Stratix II 33,880 LC FPGA, 672-BGA | Intel
MPN： EP2S30F672C5NGC ✗ 停產EP2S30F672C5NGC 概覽
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable I/O cells, all interconnected by a hierarchical routing fabric. FPGAs sit within the broader taxonomy of programmable logic devices (PLD) -> programmable logic -> logic semiconductors -> integrated circuits. The Stratix II family is positioned in Intel's (formerly Altera's) high-performance, logic-rich FPGA tier, optimized for ASIC prototyping, telecom bridging, and high-speed digital signal processing.
Key features of the EP2S30F672C5NGC include 64 dedicated 18x18 hardware multipliers for DSP workloads, 1,337.6 Kbits of distributed RAM, adaptive logic modules (ALMs) that are twice as dense as the prior Stratix ALM architecture, and support for external memory interfaces including DDR, DDR2, SDRAM, QDRII, and RLDRAM. The -C5 speed grade positions this device in the mid-speed bin of the family, balancing timing closure headroom against maximum Fmax.
Typical applications include 32/64-bit PCI-X bus master/target interfaces running at 66/100/133 MHz, high-throughput DSP pipelines, ASIC prototyping, and high-speed serial protocol bridging. The 500 user I/O count and large on-chip memory make the EP2S30 well suited for data-path centric designs where both logic density and memory bandwidth matter.
When integrating this part, plan the power sequencing for the 1.2 V core and auxiliary supplies, and review the FC-FBGA PCB layout guidelines for the 672-ball footprint to ensure signal-integrity on the DDR2 memory interface. Designers should also confirm Quartus II version support and the latest service pack before committing to a design.
This page synthesizes distributor pricing, drop-in FPGA alternatives within the Stratix II family, and practical design guidance not found in the manufacturer datasheet alone.
直接替換替代品，適用於 EP2S30F672C5NGC — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2S30F672C5NGC （相同外形與佔位） — 差異在於 Package, Speed Grade, Operating Temperature, Process Technology, Total RAM Bits.
EP2S30F672C5N
✅ 直接替換聯絡詢價
查看資料表 →EP2S30F672C5
✅ 直接替換聯絡詢價
查看資料表 →EP2S30F672C4N
✅ 直接替換聯絡詢價
查看資料表 →EP2S30F672C4
✅ 直接替換聯絡詢價
查看資料表 →EP2S30F672C3N
✅ 直接替換聯絡詢價
查看資料表 →EP2S30F672C3
✅ 直接替換聯絡詢價
查看資料表 →EP2S30F672C5NGC 最大額定值與電氣特性
| Family | Stratix II |
| Logic Elements | 33,880 |
| Total RAM Bits | 1,369,728 |
| Embedded RAM (Kbits) | 1,337.6 Kbits |
| Hardware Multipliers (18x18) | 64 |
| Maximum User I/Os | 500 |
| Process Technology | 90 nm |
| Core Supply Voltage | 1.2 V |
| Internal Performance | Up to 609.76 MHz |
| 封裝 | 672-ball FC-FBGA |
| Speed Grade | C5 |
| 工作溫度 | Commercial (0C to +85C) |
| Programmable Interface | PCI-X 32/64-bit, 66/100/133 MHz master/target |
| 安裝類型 | Surface Mount (BGA) |
EP2S30F672C5NGC 672-ball fc-fbga 腳位配置指南
EP2S30F672C5NGC（672-ball fc-fbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2S30F672C5NGC.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2S30F672C5NGC 適用於 6 應用s: ASIC Prototyping and Validation, PCI-X Bus Master / Target Interface, High-Throughput DSP Pipeline, High-Speed Memory Interface (DDR/DDR2), Telecom Bridge and Protocol Converter, Industrial Video Processing.
ASIC Prototyping and Validation
The EP2S30F672C5NGC's 33,880 logic elements, 1,369 Kbits of embedded RAM, and 64 dedicated 18x18 multipliers make it well suited as an ASIC prototyping vehicle. Designers map RTL into the Stratix II ALM fabric using Quartus II and verify real-world timing against the 1.2 V / 90 nm process corner. The 672-FBGA footprint delivers 500 user I/Os, enough to break out most ASIC pads for in-system validation. Compared with simulation, hardware prototyping reveals cross-clock-domain issues and reset propagation bugs that pure RTL simulation misses.
推薦
PCI-X Bus Master / Target Interface
Per the Stratix II Device Handbook, the EP2S30F672C5NGC implements native 32-bit and 64-bit PCI-X master/target interfaces at 66/100/133 MHz without external bridge silicon. The 500 user I/Os comfortably support the 64-bit PCI-X bus plus parity, interrupt, and sideband signals, while the on-chip RAM blocks buffer transactions for high-throughput DMA. This eliminates the cost and latency of a discrete PCI-X controller and reduces board area. The C5 speed grade provides adequate timing margin across the 133 MHz PCI-X clock domain.
推薦
High-Throughput DSP Pipeline
With 64 hardware 18x18 multipliers and 1,337.6 Kbits of embedded RAM, the EP2S30F672C5NGC implements FIR filters, FFT engines, and video codecs without DSP co-processors. The 64 multipliers deliver up to ~64 GMACs at 500 MHz in fixed-point mode, enough for multi-channel audio DSP or moderate-resolution radar processing. On-chip RAM provides coefficient and line-store buffers, eliminating external SRAM in many pipelines. The C5 speed grade closes timing for typical 200-300 MHz DSP data paths comfortably.
推薦
High-Speed Memory Interface (DDR/DDR2)
The Stratix II ALM fabric and dedicated DQS circuitry let the EP2S30F672C5NGC directly interface to external DDR and DDR2 SDRAM, plus QDRII and RLDRAM. The 500 user I/Os allow wide 64-bit memory buses with full byte-lane write-mask control, and the on-chip memory controllers absorb refresh and read/write leveling. This makes the device ideal for buffering, frame-store, or scatter-gather DMA designs. Designers should follow the Stratix II Device Handbook PCB layout guidelines for matched-length DQS pairs.
推薦
Telecom Bridge and Protocol Converter
Telecom equipment frequently requires bridging between legacy TDM/E1/T1 streams and modern packet networks; the EP2S30F672C5NGC's logic density and I/O count suit this role. The ALM fabric maps HDLC, UART, I2S, and TDM framer logic, while on-chip RAM absorbs small packet jitter buffers. The 1.2 V 90 nm process keeps power within telecom line-card thermal budgets at moderate utilization. C5 speed grade closes timing for 155 MHz POS-PHY or SPI-4.2 interfaces typical in this segment.
推薦
Industrial Video Processing
The EP2S30F672C5NGC's 64 multipliers and 1.3 Mbits of embedded RAM implement real-time video scaling, de-interlacing, and color-space conversion for industrial imaging systems. The 500 user I/Os accept multi-channel BT.656 or Camera Link inputs and drive DVI/HDMI transmitters or LVDS panels. The 90 nm process and commercial temperature range suit controlled-environment factory-floor enclosures. Designers can pair the FPGA with external DDR2 video line buffers to sustain 1080p60 throughput.
推薦
推薦產品摘要
工程參考資料，適用於 EP2S30F672C5NGC — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2S30F672C5N | EP2S30F672C5 | EP2S30F672C4N | EP2S30F672C4 | EP2S30F672C3N | EP2S30F672C3 |
|---|---|---|---|---|---|---|---|
| Package | 672-ball FC-FBGA | 672-ball FC-FBGA | 672-ball FC-FBGA | 672-ball FC-FBGA | 672-ball FC-FBGA | 672-ball FC-FBGA | 672-ball FC-FBGA |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Speed Grade | C5 | C5 | C5 | C4 (faster) | C4 (faster) | C3 (fastest) | C3 (fastest) |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 |
| Embedded RAM (Kbits) | 1,337.6 | 1,337.6 | 1,337.6 | 1,337.6 | 1,337.6 | 1,337.6 | 1,337.6 |
| Max User I/Os | 500 | 500 | 500 | 500 | 500 | 500 | 500 |
| Process | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Approx. Unit Price (USD, qty 1) | 285.00 | 280.00 | 290.00 | 310.00 | 315.00 | 350.00 | 360.00 |
主要差異化特點
- Identical die and package to EP2S30F672C5N with NGC ordering suffix only (對比EP2S30F672C5N)
- Same package and logic density with one speed-bin faster timing (對比EP2S30F672C4N)
- Higher I/O count than smaller Stratix II packages in the same family (對比EP2S30F484C5)
設計說明
The 672-ball FC-FBGA package requires a high-density PCB: microvia or via-in-pad stackups are recommended, with 0.8 mm ball pitch and matching land pattern from the Stratix II Device Handbook. Decouple VCCINT and VCCIO separately with 100 nF X7R ceramics placed as close to the balls as possible; bulk decoupling on each supply rail reduces switching transients. Match all DDR/DDR2 DQS and clock traces within the tolerances specified in the handbook for the chosen speed grade.
Power sequencing on the EP2S30F672C5NGC must follow Intel's recommended ramp order: VCCINT (1.2 V core) before VCCPD, which must be present before VCCIO to avoid I/O latch-up. Use a dedicated sequencer or the Stratix II reference schematics to enforce the sequence. Estimate: at 50% utilization and 200 MHz, VCCINT current is approximately 1-2 A; design the regulator with at least 30% margin to handle worst-case in-rush during configuration.
Three common pitfalls for designers new to the EP2S30F672C5NGC: (1) using the wrong Quartus II device library for the C5 speed grade results in over-optimistic timing; (2) attempting to use the MSEL configuration pins as user I/O when in AS mode; (3) failing to enable the CRC error-detection feature in the Quartus II device options leaves configuration bitstream integrity unchecked in the field. Always regenerate the SOF with the correct device and speed grade selected.
The 672-FBGA package has a theta-JA in the 8-15 C/W range on a JEDEC test board, but real-world designs with limited inner-plane copper see 15-25 C/W. At full 90 nm utilization the EP2S30 can dissipate 3-5 W, so thermal analysis using the Stratix II PowerPlay Early Power Estimator is essential. Provide a thermal relief pattern in the PCB core and consider a heatsink for fan-less industrial enclosures.
合規資訊
Compliance status not present in the verified web data for the EP2S30F672C5NGC suffix. The trailing 'N' family code suggests lead-free finish on related parts, but the NGC-specific compliance should be confirmed against the lot paperwork before RoHS-critical deployments.