EP2SGX60DF780C4 vs EP2SGX60DF780I4 比較

詳細並排比較 EP2SGX60DF780C4 由 Intel 與 EP2SGX60DF780I4 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP2SGX60DF780I4 EP2SGX60DF780I4 - 60K LEs Stratix II GX FPGA, 780-FBGA | Intel

EP2SGX60DF780I4 - 60K LEs Stratix II GX FPGA, 780-FBGA | Intel

EP2SGX60DF780I4 ⚠ 最後購買機會

規格比較

參數 EP2SGX60DF780C4 EP2SGX60DF780I4
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND 最後購買
Device Family Stratix II GX —
Logic Elements 60,440 —
Embedded Memory Bits 2,544,192 —
User I/O Count 364 364
Maximum Internal Frequency 717 MHz —
Transceiver Channels [DATA_NEEDED: exact transceiver count and data rate] —
Number of CLBs 60,440 —
Process Technology 90 nm CMOS 90 nm CMOS
Core Supply Voltage 1.2 V —
Package Type 780-ball FC-FBGA —
Package Dimensions 29 x 29 mm —
Ball Pitch 1.0 mm —
Operating Temperature Grade Commercial (C) —
Speed Grade 4 (C4) I4 (Industrial, speed grade 4)
安裝類型 Surface Mount Surface Mount
RoHS 狀態 Compliant Compliant
Family — Stratix II GX
Device Logic Elements — 60,440
Logic Cells / CLBs — 60,440
Total RAM Bits — 2,544,192 bits
Transceivers — Embedded multi-gigabit transceivers (MGTs)
Transceiver Data Rate — [DATA_NEEDED: transceiver data rate in Gbps]
Internal Maximum Frequency — 732.1 MHz
Propagation Delay — [DATA_NEEDED: propagation delay]
Core Voltage — 1.2 V
封裝 — 780-ball FC-FBGA (29 x 29 mm, 1 mm pitch)
工作溫度 — -40C to +100C (Industrial)
MSL 等級 — [DATA_NEEDED: MSL level]

資料表與資源

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