EP2SGX60DF780I4 - 60K LEs Stratix II GX FPGA, 780-FBGA | Intel
MPN： EP2SGX60DF780I4 ⚠ 最後購買機會EP2SGX60DF780I4 概覽
An FPGA is an integrated circuit containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP such as transceivers, memory blocks, and DSP blocks. The Stratix II GX family is Intel's (formerly Altera's) high-end transceiver-rich FPGA family, positioned above the Cyclone and Arria lines and below the Stratix IV/V in the programmable-logic taxonomy: FPGA > Stratix > high-speed serial transceiver FPGA > Stratix II GX. This categorization matters for system architects evaluating performance per dollar and per watt.
Key features of the EP2SGX60DF780I4 include 60,440 logic elements, 2,544,192 embedded RAM bits organized as M512/M4K/M-RAM blocks, embedded 6.375 Gbps multi-gigabit transceivers (MGTs), dedicated DSP blocks, and Phase-Locked Loops (PLLs). The high transceiver count and rich DSP resources make the device a workhorse for parallel signal-processing and high-speed serial I/O applications.
Architecturally, Stratix II GX devices use an adaptive logic module (ALM)-based fabric, an 8-input fracturable LUT, and a column-based DSP/memory floorplan. Compared to Stratix II (non-GX) devices, the GX variant adds hardened PMA-capable transceivers directly bonded to the die, enabling 6.375 Gbps SERDES without consuming fabric logic. This architecture delivers a multi-GHz fabric with deterministic timing closure.
Typical applications include high-speed serial backplane interfaces (XAUI, PCIe Gen1, Serial RapidIO, SDI/HD-SDI), DSP co-processing, software-defined radio (SDR) baseband, and 1G/10G Ethernet MAC bridging. The device's combination of 6.375 Gbps transceivers and embedded DSP is well matched to multi-lane serial protocol bridges and pre-silicon ASIC prototyping.
When designing with the EP2SGX60DF780I4, designers should carefully manage multi-gigabit transceiver PCB routing (controlled-impedance differential pairs, length matching, and AC-coupling capacitors on each lane), provide ample decoupling on VCCINT/VCCA and VTT rails, and ensure thermal management accounts for industrial-temperature operation in enclosed chassis. Power estimation should be performed in the Quartus II Early Power Estimator before PCB layout to size rails correctly.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not aggregated in a single place on the manufacturer datasheet, giving engineers a one-stop reference for part selection, sourcing, and PCB-level integration.
直接替換替代品，適用於 EP2SGX60DF780I4 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2SGX60DF780I4 （相同外形與佔位） — 差異在於 Speed Grade, Package, Package Type, Process Technology, Mounting Type.
EP2SGX60DF780C5
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX60DF780C7
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX60DF780I3N
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX60DF780C4
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX60DF780C5N
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX60DF780C3N
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX60DF780I4 最大額定值與電氣特性
| Family | Stratix II GX |
| Device Logic Elements | 60,440 |
| Logic Cells / CLBs | 60,440 |
| Total RAM Bits | 2,544,192 bits |
| User I/O Count | 364 |
| Transceivers | Embedded multi-gigabit transceivers (MGTs) |
| Internal Maximum Frequency | 732.1 MHz |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| 封裝 | 780-ball FC-FBGA (29 x 29 mm, 1 mm pitch) |
| 安裝類型 | Surface Mount |
| 工作溫度 | -40C to +100C (Industrial) |
| Speed Grade | I4 (Industrial, speed grade 4) |
| RoHS 狀態 | Compliant |
EP2SGX60DF780I4 780-ball fc-fbga (29 x 29 mm, 1 mm pitch) 腳位配置指南
EP2SGX60DF780I4（780-ball fc-fbga (29 x 29 mm, 1 mm pitch) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2SGX60DF780I4.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2SGX60DF780I4 適用於 6 應用s: 10 Gigabit Ethernet XAUI Bridge, PCI Express Gen1 Endpoint, Serial RapidIO Switch Fabric, Software-Defined Radio (SDR) Baseband, High-Definition Serial Digital Interface (HD-SDI / 3G-SDI), Pre-Silicon ASIC Prototyping.
10 Gigabit Ethernet XAUI Bridge
The EP2SGX60DF780I4's embedded multi-gigabit transceivers and 60,440 logic elements make it a natural fit for 10 Gigabit Ethernet XAUI-to-XGMII bridging and switching. With 4 transceivers per XAUI lane group running at 3.125 Gbps, the device can implement a 4-lane XAUI interface in 4K LEs, leaving 50K+ LEs for MAC-layer processing, bridging logic, and traffic shaping. Compared to a discrete SERDES plus ASIC implementation, the integrated transceiver approach saves PCB area and reduces BOM cost. The industrial temperature rating enables deployment in outdoor telecom cabinets.
推薦
PCI Express Gen1 Endpoint
The EP2SGX60DF780I4 includes hard PCI Express Gen1 (2.5 Gbps) PHY IP that is licensed through Quartus II and bonded to the MGTs. Implementing a x4 Gen1 endpoint requires approximately 8K-12K LEs, a fraction of the available 60,440 LEs, leaving substantial headroom for the application-layer DMA engine, BAR mapping logic, and MSI-X interrupt controller. The 780-ball FC-FBGA package provides the differential pairs and reference clock inputs required by the PCIe PHY. Industrial temperature rating suits in-chassis deployments in servers and base stations.
推薦
Serial RapidIO Switch Fabric
Serial RapidIO (sRIO) at 1.25/2.5/3.125 Gbps is a key fabric in wireless base-station and military-aerospace DSP arrays. The EP2SGX60DF780I4 supports 1x and 4x sRIO links via the MGTs, with the protocol layer consumed in approximately 6K-10K LEs per port. The 60K-LE fabric allows a small switch (4 ports) to be built entirely in fabric, while a larger 8-port switch can be partitioned across the embedded transceivers and the logic. The -40C to +100C industrial temperature range qualifies the part for outdoor wireless infrastructure cabinets.
推薦
Software-Defined Radio (SDR) Baseband
The Stratix II GX's combination of MGTs, embedded DSP blocks, and 2.5 Mbit of block RAM makes the EP2SGX60DF780I4 well suited to SDR baseband processing. A typical multi-channel DDC/DUC bank for cellular base-station baseband consumes 30-50 DSP blocks and 4-8 MGTs for CPRI/OBSAI front-haul. The 60K-LE fabric leaves 10-20K LEs for protocol-stack software (via Nios II embedded processor) or custom MAC-layer logic. The industrial temperature rating matches the operational envelope of outdoor macro-cell base stations.
推薦
High-Definition Serial Digital Interface (HD-SDI / 3G-SDI)
The SMPTE 259M/292M/424M serial digital interface standards (SD-SDI, HD-SDI, 3G-SDI) require multi-gigabit serializer/deserializer operation up to 2.97 Gbps, well within the EP2SGX60DF780I4's MGT capability. The device can implement a 4-channel SDI router with embedded audio de-embedders, ANC processing, and genlock in 20-30K LEs, leaving headroom for ancillary data processing. The 780-FBGA package supports the required number of differential pairs (4 TX + 4 RX per direction) plus reference clock and JTAG.
推薦
Pre-Silicon ASIC Prototyping
With 60,440 logic elements and embedded transceivers, the EP2SGX60DF780I4 is a popular target for pre-silicon ASIC prototyping of mid-complexity designs (1-3M ASIC gates). Multi-FPGA partitioning tools (e.g., Certify, Synopsys Certify) can split a large ASIC netlist across multiple Stratix II GX devices with high-speed serial TDM links between FPGAs. The 780-ball FC-FBGA footprint and 1 mm pitch facilitate BGA-to-BGA socket-based prototyping boards (e.g., HAPS, FPGA-Array). Industrial temperature rating extends prototyping use into the field.
推薦
推薦產品摘要
工程參考資料，適用於 EP2SGX60DF780I4 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2SGX60DF780C5 | EP2SGX60DF780C7 | EP2SGX60DF780I3N | EP2SGX60DF780C4 | EP2SGX60DF780C5N | EP2SGX60DF780C3N |
|---|---|---|---|---|---|---|---|
| Package | 780-ball FC-FBGA (29x29 mm) | 780-ball FC-FBGA (29x29 mm) - same | 780-ball FC-FBGA (29x29 mm) - same | 780-ball FC-FBGA (29x29 mm) - same | 780-ball FC-FBGA (29x29 mm) - same | 780-ball FC-FBGA (29x29 mm) - same | 780-ball FC-FBGA (29x29 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Speed Grade | I4 (industrial, grade 4) | C5 (commercial, grade 5) | C7 (commercial, grade 7) | I3 (industrial, grade 3) | C4 (commercial, grade 4) | C5 (commercial, grade 5) | C3 (commercial, grade 3) |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Embedded Memory | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits |
| User I/O | 364 | 364 | 364 | 364 | 364 | 364 | 364 |
| Internal Max Frequency | 732.1 MHz | 732.1 MHz | 732.1 MHz | 732.1 MHz | 732.1 MHz | 732.1 MHz | 732.1 MHz |
| Lead-Free (N suffix) | No | No | No | Yes (N suffix) | No | Yes (N suffix) | Yes (N suffix) |
主要差異化特點
- Industrial speed grade at -40C to +100C (對比EP2SGX60DF780C5)
- I4 (industrial grade 4) timing budget balance (對比EP2SGX60DF780I3N)
- 60,440 logic elements vs 33,640 in EP2SGX30 devices (對比EP2SGX30DF780I4)
設計說明
Estimated: the 780-ball FC-FBGA package at 1 mm pitch requires escape routing on a high-density PCB (HDI) with microvia stacks. Designers should plan for at least 6 PCB layers (4 signal + 2 ground) and use a 0.8 mm / 0.4 mm laser-drilled microvia stackup. VCCINT and VCCA decoupling should be placed as close to the balls as possible, with 0402 size 0.1 uF X5R ceramic capacitors preferred for high-frequency decoupling of the 1.2 V core rail.
The multi-gigabit transceiver (MGT) channels require tightly controlled differential pair routing: 100 ohm +/- 10% differential impedance, intra-pair length matching within 5 mils, and inter-pair length matching within 50 mils for multi-lane protocols. Reference designators and signal naming should follow the Stratix II GX PCB Design Guidelines (Altera app note AN 521). Each MGT lane requires its own AC-coupling capacitor (0.01 uF X7R) close to the receiver side of the channel.
Estimated: at typical utilization (~50K LEs, 4 active MGTs, 25% block RAM toggling rate), the EP2SGX60DF780I4 dissipates approximately 4-7 W. The 29 x 29 mm FC-FBGA package has a theta-JA of approximately 12-15 C/W with a 16-layer PCB, implying a junction-to-ambient temperature rise of 50-100 C. In enclosed industrial enclosures with 70C ambient, a thermal pad or heatsink is recommended to keep the junction below 100C.
Configuration mode (AS, AP, PS, JTAG) must be selected correctly via MSEL pins; mis-configuring MSEL causes the device to fail to configure. The CONF_DONE pin must be pulled high externally and monitored by the system controller. The nCONFIG pin must be held low during power-up ramp and released only after VCCINT, VCCA, and VCCPD reach the recommended operating range. Failing to observe these constraints can result in brown-out configuration failures or CRC errors during multi-boot.
合規資訊
RoHS and lead-free compliance confirmed by Intel/Altera product page. Not AEC-Q100 qualified (commercial/industrial grade, not automotive grade).
