EP3CLS100F484C8N vs EP3CLS100F484C7 比較

詳細並排比較 EP3CLS100F484C8N 由 Intel 與 EP3CLS100F484C7 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3CLS100F484C8N EP3CLS100F484C7
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Series Cyclone® III LS —
Family Name Cyclone III LS —
Logic Elements 100,448 —
Embedded Memory Bits 4,451,328 bits 4,451,328
Number of I/O 278 (maximum user I/O) —
Number of Logic Blocks / Cells 47 (logic blocks reported by DigChip snapshot) —
Package Type FBGA-484 (FineLine BGA, lead-free) —
Pin / Ball Count 484 —
Supply Voltage (Core) 1.2 V —
Speed Grade C8 (commercial, fastest) —
Process Technology TSMC 65 nm low-power (LP) 65 nm
工作溫度 0°C to +85°C (commercial grade) —
安裝類型 Surface Mount Surface Mount
Configuration Interface JTAG, Passive Serial, Active Serial —
Bitstream Encryption AES-128 (Cyclone III LS security feature) —
RoHS 狀態 Compliant (Pb-free, 'N' suffix) Compliant
MSL 等級 3 (per JEDEC J-STD-020, typical for BGA) —
Embedded Multipliers (18x18) 4,488 (per Cyclone III LS family handbook, 100K LE tier) —
PLLs 4 (per Cyclone III LS family) 4
DSP Blocks Integrated (multiplier-based) —
Family — Cyclone III LS
Logic Elements (LE) — 100,448
Maximum User I/Os — 278
Logic Blocks / Logic Cells — 47
Core Voltage — 1.2 V
Maximum Internal Frequency — 437.5 MHz
封裝 — 484-ball FBGA (Fine-Pitch BGA)
Operating Temperature Grade — Commercial
Configuration Memory — SRAM-based (volatile, requires external config device)
Design Software — Quartus II / Quartus Prime

資料表與資源

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