EP3CLS200F780C7 vs EP3CLS200F780I7N 比較

詳細並排比較 EP3CLS200F780C7 由 Altera 與 EP3CLS200F780I7N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3CLS200F780C7 EP3CLS200F780I7N
品牌 Altera Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND 啟用中
Series Cyclone III LS EP3CLS200
Device Type FPGA - Field Programmable Gate Array —
Number of Logic Elements (LE) 198,464 —
Number of Logic Array Blocks (LAB) 8,212 —
Embedded Memory (Bits) 8,211,456 bit (7.83 Mbit) —
Maximum User I/Os 429 —
封裝 / 外殼 780-BGA, FBGA-780, 29 mm x 29 mm, 1 mm pitch —
Operating Supply Voltage (VCCINT) 1.15 V to 1.25 V —
安裝方式 SMD/SMT —
Maximum Operating Temperature +70 C —
Minimum Operating Temperature 0 C —
Process Technology CMOS, low-power 65 nm CMOS (low-power)
Configuration Method SRAM, JTAG, Passive Serial, Passive Parallel —
Number of Transceivers 0 (no embedded high-speed transceivers) —
RoHS 狀態 Compliant Compliant (lead-free per FBGA-780 datasheet note)
Device Family — Cyclone III LS
Logic Elements — 198,464
Logic Array Blocks (LABs) — 12,404 LAB
Embedded Memory (bits) — 8,211,456
Embedded Multipliers — 425 (18x18)
PLLs — 4
Maximum User I/O — 413
Core Voltage (VCCINT) — 1.15 V to 1.25 V
Speed Grade — 7
工作溫度 — -40 °C to +100 °C (industrial)
Maximum Internal Frequency — [DATA_NEEDED: maximum internal frequency MHz]
封裝 — 780-ball FBGA (FBGA-780)
Ball Pitch — 1.0 mm
安裝類型 — Surface Mount
Configuration Modes — Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG

資料表與資源

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