EP3CLS70F484C7N vs EP3CLS100F484C7N 比較

詳細並排比較 EP3CLS70F484C7N 由 Intel 與 EP3CLS100F484C7N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3CLS70F484C7N EP3CLS100F484C7N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Device Family Cyclone® III LS —
Logic Elements (LE) 70,208 —
Logic Array Blocks (LABs) 4,388 —
Embedded Memory Bits 3,068,928 —
Maximum User I/Os 278 —
Maximum Operating Frequency 437.5 MHz —
Process Technology TSMC 65nm low-power (LP) 65 nm low-power (TSMC)
Core Supply Voltage (VCCINT) 1.2 V —
Package Type 484-ball FineLine BGA (FBGA-484) —
Package Dimensions 19 x 19 mm, 1.0 mm ball pitch [DATA_NEEDED: package body dimensions]
安裝類型 Surface Mount Surface Mount
工作溫度 [DATA_NEEDED: commercial/industrial grade] —
MSL 等級 [DATA_NEEDED: MSL rating] —
RoHS 狀態 Compliant (per Intel product page) Compliant (lead-free, N suffix)
Configuration Method JTAG / Passive Serial / Active Serial SRAM-based (volatile), via EPCS/JTAG/parallel flash
Design Tool Intel Quartus II (Cyclone III support) —
Family — Cyclone III LS
Logic Elements — 100,448
Embedded Memory (bits) — 4,451,328
User I/O Pins — 278
DSP Blocks (18x18 multipliers) — [DATA_NEEDED: DSP block count]
PLLs — 4
Global Clock Networks — [DATA_NEEDED: global clock count]
Core Supply Voltage — 1.2 V
Operating Temperature (junction) — 0°C to +85°C (commercial)
Speed Grade — C7
封裝 — 484-ball FineLine BGA (FBGA-484)
Ball Pitch — 1.0 mm
Security Features — Bitstream encryption, JTAG tamper protection
Design Software — Quartus II / Intel Quartus Prime

資料表與資源

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