EP3SE260F1152C3 vs EP3SE260F1152I3G 比較
詳細並排比較 EP3SE260F1152C3 由 Intel 與 EP3SE260F1152I3G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260F1152C3 | EP3SE260F1152I3G |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | NRND |
| Series | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | — |
| Embedded Memory (bits) | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| User I/Os | 744 | — |
| Embedded 18x18 Multipliers | 384 | — |
| 封裝 | 1152-ball FCBGA (Flip-Chip BGA) | 1152-BBGA, FCBGA (FineLine BGA) |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| Core Voltage | 0.9 V to 1.1 V | — |
| Process Technology | 40 nm | 40 nm TSMC low-power |
| 工作溫度 | 0C to +85C (Commercial) | — |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG | — |
| PLLs | 12 | — |
| RoHS 狀態 | Compliant | [DATA_NEEDED: RoHS compliance not stated in scraped data] |
| Speed Grade | C3 | I3 (Industrial, balanced) |
| Family | — | Stratix III |
| Logic Elements (LE) | — | 255,000 |
| Embedded Memory Bits | — | 16,672,640 bits |
| Embedded Memory Bits (alternate) | — | 20,880 Kb (16,672,640 / 1024) |
| User I/O Count | — | 744 |
| 工作溫度範圍 | — | -40C to +100C (Industrial) |
| Supply Voltage Core | — | 0.9 V (typical, see handbook) |
| Configuration Bitstream Encryption | — | AES-256 (Stratix III feature) |
| I/O Standards Supported | — | LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X |
| 濕度敏感等級 (MSL) | — | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] |
| Lead-Free Reflow | — | [DATA_NEEDED: peak reflow temperature] |
| Design Toolchain | — | Quartus II / Quartus Prime |
| Country of Origin / Distribution | — | Multiple authorized distributors (DigiKey, Mouser) |