EP3SE260H780C2N vs EP3SE260H780C4LG 比較

詳細並排比較 EP3SE260H780C2N 由 Intel 與 EP3SE260H780C4LG 由 Altera. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE260H780C2N EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N ⚠ 最後購買機會

規格比較

參數 EP3SE260H780C2N EP3SE260H780C4LG
品牌 Intel Altera
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 啟用中
Series Stratix III E —
Logic Elements 255,000 254,400
LABs / CLBs 10,200 —
Total RAM Bits 16,672,768 —
User I/O Count 488 —
Number of Transceivers [DATA_NEEDED: transceiver count] —
Core Voltage 0.9 V —
封裝 780-BGA FCBGA 780-ball FineLine BGA (HBGA, 29 mm x 29 mm, 1.0 mm pitch)
安裝類型 Surface Mount Surface Mount (BGA)
工作溫度範圍 Commercial (0C to +85C) —
Speed Grade C2 C4 (commercial, mid-speed tier)
MSL 等級 3 (168 hours) 3 (per JEDEC J-STD-020)
Reflow Peak Time Max 40 s —
RoHS 狀態 [DATA_NEEDED: rohs status] Compliant (Pb-free HBGA)
Lead-Free [DATA_NEEDED: lead-free] —
Package Code BGA —
Terminal Form Ball —
Number of Terminals 780 —
Process Node 40 nm —
Family — Stratix III Enhanced (EP3SE)
Adaptive Logic Modules (ALMs) — 101,760
Embedded Memory (M9K + M144K) — 18.36 Mbits
DSP Blocks (18-bit x 18-bit) — 768
18-bit x 18-bit Multipliers — 1,536
Transceivers (full-duplex) — 8 (up to 6.375 Gbps)
Maximum User I/O Pins — 488
Temperature Grade — Commercial (0C to +85C junction)
Process Technology — 65 nm TSMC low-power CMOS
Operating Voltage (Core) — 0.9 V / 1.0 V / 1.1 V (programmable)
External Memory Interface — Up to 800 Mbps DDR3, QDR II+, RLDRAM II
Hard IP Blocks — PCIe Gen2, 10GbE MAC, memory controllers

資料表與資源

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