EP3SE260H780C4L vs EP3SE260H780I4LG 比較

詳細並排比較 EP3SE260H780C4L 由 Intel 與 EP3SE260H780I4LG 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE260H780C4L EP3SE260H780I4LG
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Family Stratix III E EP3SE260
Logic Elements 255,000 255,000 LE
LABs/CLBs 10,200 —
Total RAM Bits 16,672,768 (16.7 Mbit) —
User I/O Count 488 —
封裝 780-ball FCBGA (HBGA 33x33 mm) 780-ball FineLine BGA (HBGA)
Speed Grade C4 (middle/slow tier) -4
Core Voltage 0.9 V (nominal) —
工作接面溫度 0C to +85C (commercial) —
安裝類型 Surface Mount (flip-chip BGA) —
MSL 等級 [DATA_NEEDED: MSL level] —
RoHS 狀態 Compliant (lead-free per datasheet) —
Transceivers Up to 24 multi-gigabit transceivers —
Memory Interface DDR3, DDR2, QDRII+, RLDRAM II controllers —
Configuration Mode PS, FPP, JTAG with EPCS/EPCQ —
Series — Stratix III Enhanced
Adaptive Logic Modules (ALMs) — 102,000 ALM
Embedded Memory — 15.90 Mbit
DSP Blocks — 304
18x18 Multipliers — 840
User I/O — 488
PLLs — 8 (4 fractional + 4 general-purpose)
Temperature Grade — Industrial (I)
工作溫度 — -40C to +100C
Process Technology — 65 nm low-power CMOS
Configuration Method — JTAG / Passive Serial / Fast Passive Parallel / Active Serial

資料表與資源

瀏覽所有產品 建立 BOM 索取報價